Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	PWM Channels	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
AT97SC3205-U3A15-20	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES			0	NO	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		85 Cel	-40 Cel	MATTE TIN	NO	DUAL	NO	1.1 mm	4.4 mm		0				9.7 mm	CMOS	3.3 V	NO	EEPROM	I2C	.65 mm	R-PDSO-G28			33 rpm	e3	6
ATECC108A-SSHDA-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm	3.9 mm				40	260	4.9 mm	CMOS					1.27 mm	R-PDSO-G8	3			e4
ATECC608A-TNGTLSU-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		.6 mm	2 mm						3 mm	CMOS				I2C	.5 mm	R-PDSO-N8				e4
ATMXT1067TD-ABRI2CVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100				FLATPACK, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	3.14 V	105 Cel	-40 Cel			QUAD		1.2 mm	14 mm						14 mm	CMOS	3.3 V				.4 mm	S-PQFP-G128	3
ATMXT224E-MAHR030	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.47 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	85 Cel	-40 Cel			QUAD		.6 mm	7 mm						7 mm	CMOS	1.8 V				.4 mm	S-PQCC-N48
ATMXT224T-CCU027	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA64,8X8,20	3 V	85 Cel	-40 Cel			BOTTOM		.6 mm	5 mm						5 mm	CMOS	3.3 V				.5 mm	S-PBGA-B64
ATMXT224T-MAU023	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS																														CMOS
ATMXT224T-MAUR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS																														CMOS
ATMXT224T-MAUR041	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS																														CMOS
ATMXT540E-ATR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V					FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	2.57 V	85 Cel	-40 Cel			QUAD		1.2 mm	14 mm						14 mm	CMOS	2.7 V				.5 mm	S-PQFP-G100
ATMXT640T-CCU035	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,20	3 V	85 Cel	-40 Cel			BOTTOM		.6 mm	6 mm						6 mm	CMOS	3.3 V				.5 mm	S-PBGA-B84
ATMXT641TD-ABR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100; TS 16949				FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3.14 V	105 Cel	-40 Cel			QUAD		1.2 mm	14 mm						14 mm	CMOS	3.3 V				.5 mm	S-PQFP-G100
ATSAM4C32CA-AU	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V					FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel	-40 Cel	MATTE TIN		QUAD		1.6 mm	14 mm				40	260	14 mm	CMOS	1.2 V				.5 mm	S-PQFP-G100	3			e3
ATSHA204A-SSHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	3	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				SMALL OUTLINE	SOP8,.25	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm	3.9 mm						4.9 mm	CMOS	3.3 V				1.27 mm	R-PDSO-G8
ATTPM20P-G6MA1-10	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V	TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	1.8 V	70 Cel	0 Cel			DUAL		.6 mm	2 mm						3 mm	CMOS				SPI	.5 mm	R-PDSO-N8
ATWILC1000B-MU-Y	Microchip Technology	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		85 Cel	-40 Cel	MATTE TIN		QUAD		1 mm	5 mm						5 mm	CMOS	1.1 V				.4 mm	S-XQCC-N40
ATWINC1510B-MU-Y042	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel	-40 Cel	MATTE TIN		QUAD		1 mm	5 mm			48 MHz			5 mm	CMOS	3.3 V				.4 mm	S-PQCC-N40				e3
ATWINC3400-MR210CA131-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		2.5 V	85 Cel	-40 Cel			UNSPECIFIED		2.0874 mm	14.732 mm	SEATED HGT-CALCULATED			NOT SPECIFIED	NOT SPECIFIED	22.3774 mm	CMOS	3.6 V				1.204 mm	R-XXMA-N36
BCM53115UKFBG	Broadcom
BT252KPJ20	Conexant Systems	MICROPROCESSOR CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V					CHIP CARRIER		4.75 V	70 Cel	0 Cel			QUAD		4.57 mm	16.5862 mm						16.5862 mm	CMOS	5 V				1.27 mm	S-PQCC-J44	1	Not Qualified
CC-SBP-WMX-JM8E	Digi International
CC-WMX-L87C-TE	Digi International	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	400	LGA	SQUARE	UNSPECIFIED	YES						GRID ARRAY			85 Cel	-40 Cel			BOTTOM			50 mm						50 mm	CMOS					2 mm	S-XBGA-N400
CEC1712H-S2-I/SX	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,25	1.71 V	85 Cel	-40 Cel			BOTTOM		.8 mm	7 mm	3.3V NOM SUPPLY ALSO AVAILABLE					7 mm	CMOS	1.8 V			I2C, QSPI, UART	.65 mm	S-PBGA-B84
CN5020-500BG564-SCP-G	Marvell Technology	MICROPROCESSOR CIRCUIT		BALL	564	BGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY							BOTTOM										CMOS						S-PBGA-B564
CSR8811A08-ICXR-R	Qualcomm	MICROPROCESSOR CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4.8 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.3 V	85 Cel	-30 Cel			BOTTOM		.6 mm	2.569 mm						3.208 mm	CMOS	3.3 V				.5 mm	R-PBGA-B28	1
CY8C4024LQI-S413	Infineon Technologies	PSoC	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN		QUAD		.6 mm	6 mm						6 mm	CMOS	1.8 V				.5 mm	S-XQCC-N40	3
CY8C4125LQS-S433	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.27SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.9 mm	7 mm						7 mm	CMOS	1.8 V				.5 mm	S-XQCC-N40	3			e4
CY8C4146LQE-S433	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.6 mm	6 mm						6 mm	CMOS	1.8 V				.5 mm	S-XQCC-N40	3			e4
CY8C4147LQS-S473	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN		QUAD		.6 mm	6 mm						6 mm	CMOS	3.3 V				.5 mm	S-XQCC-N40	3
D2-92683-QR	Renesas Electronics	SoC	OTHER	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-10 Cel	MATTE TIN		QUAD		.9 mm	10 mm				30	260	10 mm	CMOS	1.8 V				.5 mm	S-PQCC-N72	3			e3
DLPC350ZFF	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	419	BGA	SQUARE	PLASTIC/EPOXY	YES	3.465 V					GRID ARRAY		3.135 V	85 Cel	0 Cel			BOTTOM		2.36 mm	23 mm				NOT SPECIFIED	NOT SPECIFIED	23 mm	CMOS	3.3 V				1 mm	S-PBGA-B419					14
DM505MRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100				GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		2.82 mm	15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V			I2C; SPI; UART	.65 mm	S-PBGA-B367	3			e1
EFR32BG13P532F512GM48-DR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.8 V	85 Cel	-40 Cel			QUAD		.9 mm	7 mm						7 mm	CMOS	3.3 V				.5 mm	S-XQCC-N48
EFR32BG13P632F512GM32-DR	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.8 V	85 Cel	-40 Cel			QUAD		.9 mm	5 mm						5 mm	CMOS	3.3 V				.5 mm	S-XQCC-N32
EFR32FG12P231F1024GM68-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel	-40 Cel			QUAD		.9 mm	8 mm						8 mm	CMOS	1.8 V				.4 mm	S-XQCC-N68
EFR32FG13P231F512GM32-DR	Silicon Labs	SoC																											40	260									3
EFR32FG1P131F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel			QUAD		.9 mm	7 mm						7 mm	CMOS	3.3 V				.5 mm	S-XQCC-N48
EFR32FG1P131F256GM48-C0R	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel			QUAD		.9 mm	7 mm						7 mm	CMOS	3.3 V				.5 mm	S-XQCC-N48
EFR32FG1P133F256GM48-C0R	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel			QUAD		.9 mm	7 mm						7 mm	CMOS	3.3 V				.5 mm	S-XQCC-N48
EFR32FG1V131F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel			QUAD		.9 mm	7 mm						7 mm	CMOS	3.3 V				.5 mm	S-XQCC-N48
EFR32MG12P332F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP
EFR32MG12P433F1024GL125-B	Silicon Labs	SYSTEM ON CHIP
EFR32MG13P732F512GM32-DR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.8 V	85 Cel	-40 Cel			QUAD		.9 mm	5 mm						5 mm	CMOS	3.3 V				.5 mm	S-XQCC-N32
EFR32MG13P732F512GM48-DR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.8 V	85 Cel	-40 Cel			QUAD		.9 mm	7 mm						7 mm	CMOS	3.3 V				.5 mm	S-XQCC-N48
EFR32MG13P732F512IM32-DR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.8 V	125 Cel	-40 Cel			QUAD		.9 mm	5 mm						5 mm	CMOS	3.3 V				.5 mm	S-XQCC-N32
EFR32MG13P733F512IM48-D	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	1.62 V	125 Cel	-40 Cel	MATTE TIN		QUAD		.9 mm	7 mm				40	260	7 mm	CMOS	3.3 V				.5 mm	S-XQCC-N48	2			e3
EFR32MG1B232F256GM32-C0R	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel	-40 Cel			QUAD		.9 mm	5 mm						5 mm	CMOS	3.3 V				.5 mm	S-XQCC-N32
EFR32MG1V132F256GM32-C0	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel	-40 Cel			QUAD		.9 mm	5 mm						5 mm	CMOS	3.3 V				.5 mm	S-XQCC-N32

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.