Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
ST4SIM-200A	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR
TDA8026ET/C2,551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel		-25 Cel				BOTTOM										260				260 mA	3.3 V	Other Microprocessor ICs			.8 mm	S-PBGA-B64	2	Not Qualified
TEA1791T/N1,118	NXP Semiconductors			GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				20	SMALL OUTLINE	SOP8,.25								DUAL										260					20 V	Other Microprocessor ICs			1.27 mm	R-PDSO-G8	1	Not Qualified
UCD3138128APFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	1.2 mm			12 mm			0	2 MHz	30	260	12 mm		CMOS		3.3 V			I2C; SPI; UART	.5 mm	S-PQFP-G80	3			e4
XC7Z012S-2CLG485E	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel		0 Cel				BOTTOM	1.6 mm			19 mm							19 mm		CMOS		1 V				.8 mm	S-PBGA-B485
XCZU7EG-2FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM									30	245			CMOS		.85 V					R-PBGA-B1517	4			e1
5CSEBA6U23C6N	Intel	SoC
5CSEBA6U23I7SN	Intel	SoC
66AK2G12ABY60	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	70 Cel		0 Cel	TIN SILVER COPPER			BOTTOM	1.56 mm			21 mm					30	260	21 mm		CMOS		.9 V				.8 mm	S-PBGA-B625	3			e1
AM4377BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.3 mm			17 mm					30	260	17 mm		CMOS		1.325 V				.65 mm	S-PBGA-B491	3			e1
CC2543RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD			QUAD	1 mm			5 mm			0		30	260	5 mm		CMOS		3 V	Other uPs/uCs/Peripheral ICs		I2C; SPI; UART; USART	.5 mm	S-PQCC-N32	3	Not Qualified		e4
CY8C5267LTI-LP089	Infineon Technologies	PSoC	INDUSTRIAL																	NICKEL PALLADIUM GOLD												30	260											3	Not Qualified		e4
MIMX8MQ5DVAJZAB	NXP Semiconductors	SoC																														40	260											3
MPFS250T-1FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel		0 Cel				BOTTOM	1.4 mm			16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY						16 mm		CMOS		1 V				.5 mm	S-PBGA-B536
OMAPL138EZCEA3E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.3 mm			13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY				30	260	13 mm		CMOS		1.3 V				.65 mm	S-PBGA-B361	3			e1
SE050B1HQ1/Z01SEZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD SILVER			QUAD	.33 mm			3 mm					30	260	3 mm		CMOS		1.8 V				.4 mm	S-PQCC-N20	1			e4
XC7Z014S-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		0 Cel				BOTTOM	1.6 mm			17 mm							17 mm		CMOS		1 V				.8 mm	S-PBGA-B400
XCZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM									30	250			CMOS		.85 V					R-PBGA-B625	4			e1
XCZU5CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM									30	250			CMOS		.85 V					S-PBGA-B784	4			e1
XCZU9CG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM									30	245			CMOS		.85 V					R-PBGA-B1156	4			e1
AS5140H-ASSM	Ams Ag	SYSTEM ON CHIP																		TIN																											e3
ATECC608B-TNGTLSU-C	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			DUAL	.6 mm			2 mm			0	1 MHz			3 mm		CMOS						.5 mm	R-PDSO-N8				e4
EFR32MG12P432F1024IM48-C	Silicon Labs	SYSTEM ON CHIP
MCIMX6S5DVM10ADR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm			21 mm					40	260	21 mm		CMOS						.8 mm	S-PBGA-B624	3			e1
XCZU1EG-2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT																		Tin/Silver/Copper (Sn/Ag/Cu)												30	250											4			e1
XCZU28DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	TIN SILVER COPPER			BOTTOM									30	245			CMOS		.85 V					R-PBGA-B1517	4			e1
XCZU5EG-L2FBVB900E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY	BGA900,30X30,40	.698 V	110 Cel		0 Cel	TIN SILVER COPPER			BOTTOM	2.88 mm			31 mm	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245	31 mm		CMOS		.72 V				1 mm	R-PBGA-B900	4			e1
XCZU5EV-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM									30	245			CMOS		.85 V					R-PBGA-B900	4			e1
CC430F5147IRGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD			QUAD	1 mm	32768	4	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER		20 MHz	30	260	7 mm	4096	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm	S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
CM108AH	C-media Electronics		COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES				5	FLATPACK	QFP48,.35SQ,20		70 Cel		-15 Cel				QUAD															5 V	Other Microprocessor ICs			.5 mm	S-PQFP-G48		Not Qualified
CY8C6116BZI-F54	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1 mm			9 mm							9 mm		CMOS		1.8 V				.65 mm	S-PBGA-B124	3			e1
DA16200MOD-AAE4WA32	Renesas Electronics	SYSTEM ON CHIP																														40	260
MCIMX6S5DVM10ACR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm			21 mm					40	260	21 mm		CMOS						.8 mm	S-PBGA-B624	3			e1
OMAPL138EZCEA3	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.3 mm			13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS		1.3 V			I2C; SPI; UART; USB	.65 mm	S-PBGA-B361	3		456 rpm	e1
TCI6630K2LCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V				TIN SILVER COPPER			BOTTOM									30	245			CMOS		.95 V					S-PBGA-B900	4			e1
XCZU11EG-L1FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS		.72 V					R-PBGA-B1760	4			e1
XCZU15EG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM									30	245			CMOS		.85 V					R-PBGA-B900	4			e1
XCZU9EG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM									30	245			CMOS		.85 V					R-PBGA-B1156	4			e1
AM6234ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel				BOTTOM	.89 mm			13 mm						250	13 mm		CMOS		.75 V				.5 mm	S-PBGA-B425	3
AM6441BSEFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel				BOTTOM	2.652 mm			17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				30	250	17.2 mm		CMOS		.75 V				.8 mm	S-PBGA-B441	3
CC1310F32RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			QUAD	1 mm			5 mm					NOT SPECIFIED	260	5 mm	28672	CMOS		3.3 V				.5 mm	S-PQCC-N32	3			e4
CY8C6244AZI-S4D92	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel		-40 Cel				QUAD	1.6 mm			10 mm							10 mm		CMOS		1.8 V				.5 mm	S-PQFP-G64	3
EFR32MG22C224F512GN32-C	Silicon Labs	SYSTEM ON CHIP																		NICKEL PALLADIUM GOLD												40	260											2			e4
OMAPL138EZWT3	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER			BOTTOM	1.4 mm			16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS		1.3 V			I2C; SPI; UART; USB	.8 mm	S-PBGA-B361	3		456 rpm	e1
UPD720200F1-DAK-A	Renesas Electronics																																260
XA7Z020-1CLG400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		N	BOTTOM	1.6 mm			17 mm					30	260	17 mm		CMOS			Other uPs/uCs/Peripheral ICs			.8 mm	S-PBGA-B400	3	Not Qualified		e1
EFR32FG23A010F256GM48-C	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	85 Cel		-40 Cel				QUAD	.9 mm			6 mm							6 mm		CMOS		3.3 V				.4 mm	S-XQCC-N48
MCIMX280DVM4BR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel		-20 Cel	TIN SILVER COPPER			BOTTOM	1.37 mm			14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS		1.45 V				.8 mm	S-PBGA-B289	3			e1

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.