Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
XCZU4EV-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							30	250				CMOS		.85 V					R-PBGA-B784	4		e1
MCIMX535DVV1CR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.4 V			0.9/1.25,1.3	GRID ARRAY, HEAT SINK/SLUG	BGA529,23X23,32	1.2 V	85 Cel	-20 Cel	TIN SILVER		BOTTOM	1.85 mm		19 mm				40	260	19 mm			CMOS		1.25 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified	e2
CY8C3866AXI-039	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1.6 mm		14 mm				40	260	14 mm	65536 Bits		CMOS		3.3 V	Other uPs/uCs/Peripheral ICs		.5 mm		S-PQFP-G100	3	Not Qualified	e4
CY8C5267AXI-LP051	Infineon Technologies	PSoC	INDUSTRIAL																PURE TIN									30	260												3	Not Qualified
ESP32-S3-WROOM-1U-N8R2	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel			UNSPECIFIED	3.35 mm		18 mm						19.2 mm			CMOS		3.3 V			1.27 mm		R-XXMA-N41
ESP32-S3-WROOM-1U-N8R8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		3 V	65 Cel	-40 Cel			UNSPECIFIED	3.35 mm		18 mm						19.2 mm			CMOS		3.3 V			1.27 mm		R-XXMA-N41
ATECC608B-SSHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	MATTE TIN		DUAL	1.75 mm		3.9 mm				30	260	4.9 mm			CMOS				I2C	1.27 mm		R-PDSO-G8	1		e3
NRF52832-QFAB-R7	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel			QUAD	.9 mm		6 mm						6 mm			CMOS		3 V			.4 mm		S-XQCC-N48
SM-K26-XCL2GI	Xilinx	PSoC
MIMXRT1064CVJ5B	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,31	1.15 V	105 Cel	-40 Cel			BOTTOM	1.52 mm		12 mm				40	260	12 mm			CMOS					.8 mm		S-PBGA-B196	3
MFRC52202HN1,157	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel			QUAD							30	260					100 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified
MCP2221-I/ST	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949		3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	3 V	85 Cel	-40 Cel	MATTE TIN		DUAL	1.2 mm		4.4 mm						5 mm			CMOS	15 mA	3.3 V	Serial IO/Communication Controllers		.65 mm		R-PDSO-G14		Not Qualified	e3
MIMXRT1064CVL5B	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel			BOTTOM	1.43 mm		10 mm				40	260	10 mm			CMOS					.65 mm		S-PBGA-B196	3
ESP32-S3-WROOM-1U-N4R2	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel			UNSPECIFIED	3.35 mm		18 mm						19.2 mm			CMOS		3.3 V			1.27 mm		R-XXMA-N41
NRF52810-QCAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel			QUAD	.95 mm		5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm			CMOS		3 V			.5 mm		S-XQCC-N32
ATECC608B-SSHDA-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	MATTE TIN		DUAL	1.75 mm		3.9 mm				30	260	4.9 mm			CMOS				I2C	1.27 mm		R-PDSO-G8	1		e3
ESP32-C3FH4	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	105 Cel	-40 Cel			QUAD	.9 mm		5 mm	ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY					5 mm			CMOS		3.3 V			.5 mm		S-PQCC-N32
CY8C3866AXI-039T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN	N	QUAD	1.6 mm		14 mm						14 mm	524288 Bits		CMOS		3.3 V	Other uPs/uCs/Peripheral ICs		.5 mm		S-PQFP-G100	3	Not Qualified
MIMX8MM6DVTLZAAR	NXP Semiconductors	SoC		BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER		BOTTOM	1.25 mm		14 mm				40	260	14 mm			CMOS		1 V			.5 mm		S-PBGA-B486	3		e2
ESP32-C3	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	105 Cel	-40 Cel			QUAD	.9 mm		5 mm	ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY					5 mm			CMOS		3.3 V			.5 mm		S-PQCC-N32
FT245RL-REEL	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V				SMALL OUTLINE, SHRINK PITCH		3.3 V	85 Cel	-40 Cel			DUAL	2 mm		5.3 mm				40	260	10.2 mm			CMOS					.65 mm		R-PDSO-G28	3	Not Qualified
XC7Z030-1SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	2.44 mm		19 mm						19 mm			CMOS		1 V			.8 mm		S-PBGA-B485
ATECC608A-SSHDA-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel			DUAL	1.75 mm		3.9 mm						4.9 mm			CMOS					1.27 mm		R-PDSO-G8
453-00053R	Laird Technologies	SoC
CY8CMBR3116-LQXIT	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	.55 mm		4 mm	Capacitive Touch Sense Controller					4 mm			CMOS		1.8 V			.5 mm		S-XQCC-N24	3		e4
NRF52810-QFAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel			QUAD	.95 mm		6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm			CMOS		3 V			.4 mm		S-XQCC-N48
SE050C2HQ1/Z01SDZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	.33 mm		3 mm				30	260	3 mm			CMOS		1.8 V			.4 mm		S-PQCC-N20	1		e4
MCIMX6Q6AVT10AD	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE			40	260	21 mm			CMOS					.8 mm		S-PBGA-B624	3		e1
TMS320DM368ZCED48F	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	8192	13 mm			32	30	260	13 mm			CMOS		1.35 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified	e1
RN2903A-I/RM105	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel	-40 Cel	NICKEL GOLD		UNSPECIFIED	3.34 mm		17.8 mm					250	26.7 mm			CMOS		3.3 V			1.27 mm		R-XXMA-N47			e4
FT245BL-REEL	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V				FLATPACK, LOW PROFILE		4.35 V	70 Cel	0 Cel	MATTE TIN		QUAD	1.6 mm		7 mm				30	260	7 mm			CMOS		5 V			.8 mm		S-PQFP-G32	3		e3
XC7Z007S-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel	0 Cel			BOTTOM	1.6 mm		17 mm						17 mm			CMOS		1 V			.8 mm		S-PBGA-B400
MCIMX6Q6AVT10ADR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel			BOTTOM	2.16 mm		21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE			40	260	21 mm			CMOS					.8 mm		S-PBGA-B624	3
CY8C5268AXI-LP047	Infineon Technologies	PSoC	INDUSTRIAL																PURE TIN									30	260												3	Not Qualified
MCIMX7D5EVM10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,29	1.2 V	105 Cel	-20 Cel			BOTTOM	1.42 mm		19 mm				40	260	19 mm			CMOS		1.225 V			.75 mm		S-PBGA-B541	3
MIMXRT1021CAG4A	NXP Semiconductors	SoC	INDUSTRIAL																TIN									40	260												3		e3
MIMXRT1171CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel			BOTTOM	1.52 mm		14 mm				40	260	14 mm			CMOS					.8 mm		S-PBGA-B289	3
ATECC608B-MAHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	.6 mm		2 mm					260	3 mm			CMOS				I2C	.5 mm		R-PDSO-N8	1		e4
ST4SI2M0020TPIFW	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		105 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	1 mm		5 mm					260	6 mm			CMOS					1.27 mm		R-XDSO-N8	3
ATECC608A-SSHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel			DUAL	1.75 mm		3.9 mm						4.9 mm			CMOS					1.27 mm		R-PDSO-G8
MCIMX6Y2CVM08AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.325 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.32 mm		14 mm				40	260	14 mm			CMOS					.8 mm		S-PBGA-B289	3		e1
MIMXRT1052CVL5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.52 mm		10 mm	24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE			40	260	10 mm			CMOS					.65 mm		S-PBGA-B196	3		e1
SLB9670VQ20FW785XUMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel	-20 Cel			QUAD	.9 mm		5 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY					5 mm			CMOS		1.8 V			.5 mm		S-PQCC-N32	3
AR1100T-I/SS	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V	TS 16949			SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	3.135 V	85 Cel	-40 Cel	MATTE TIN		DUAL	2 mm		5.3 mm	ALSO OPERATES AT 5V SUPPLY			40	260	7.2 mm			CMOS		3.3 V			.65 mm		R-PDSO-G20	2	Not Qualified	e3
MIMX8MQ6DVAJZAA	NXP Semiconductors	SoC																											260												3
CC2541F256RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	8	6 mm		TIMER(4)	0	30	260	6 mm		8192	CMOS		3 V	Other uPs/uCs/Peripheral ICs	I2C; SPI; USART; USB	.5 mm		S-PQCC-N40	3	Not Qualified	e4	23
14255R-100	Renesas Electronics	SoC
HS103	Nel Frequency Controls

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.