357 Serial Communication Controllers 18

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	JESD-609 Code
KMC68EN360VR25VL	Freescale Semiconductor	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	3.3 V		32	GRID ARRAY		2.7 V	70 Cel	1.25 MBps	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.86 mm		25 mm		YES	32	NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC	25 MHz	40	260	25 mm	HCMOS	3 V		4	68000	1.27 mm	S-PBGA-B357	3	Not Qualified	YES	e1
MC68360VR25L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32	GRID ARRAY		4.75 V	70 Cel	1.25 MBps	0 Cel	TIN SILVER COPPER	BOTTOM	1.86 mm		25 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz	40	260	25 mm	CMOS	5 V			MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e1
MC68EN360VR25VL	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V	8	32	GRID ARRAY	BGA357,19X19,50	4.75 V	70 Cel	1.25 MBps	0 Cel	TIN SILVER COPPER	BOTTOM	1.86 mm	2560	25 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI; BIPH-SPACE(FM0); BIPH-MARK(FM1); BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC BYTE; ASYNC, HDLC; SYNC, HDLC; SYNC SDLC; BISYNC	33.34 MHz	40	260	25 mm	HCMOS	5 V	16	6	SCC, SMC, SPI, UART	1.27 mm	S-PBGA-B357	3	Not Qualified	YES	e1
MC68360CZQ25L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32	GRID ARRAY		4.75 V	70 Cel	1.25 MBps	0 Cel	TIN LEAD	BOTTOM	1.86 mm		25 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz	40	260	25 mm	CMOS	5 V			MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e0
MC68MH360VR33L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32	GRID ARRAY		4.75 V	70 Cel	1.25 MBps	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.86 mm		25 mm		YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz	40	260	25 mm	CMOS	5 V			MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e1
MC68MH360ZQ33L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32	GRID ARRAY		4.75 V	70 Cel	1.25 MBps	0 Cel	TIN LEAD	BOTTOM	1.86 mm		25 mm		YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz			25 mm	CMOS	5 V			MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e0
MC68EN360CZQ25L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V	8	32	GRID ARRAY	BGA357,19X19,50	4.75 V	85 Cel	1.25 MBps	-40 Cel	TIN LEAD	BOTTOM	1.86 mm	2560	25 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI; BIPH-SPACE(FM0); BIPH-MARK(FM1); BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC BYTE; ASYNC, HDLC; SYNC, HDLC; SYNC SDLC; BISYNC	33.34 MHz	40	260	25 mm	HCMOS	5 V	16	6	SCC, SMC, SPI, UART	1.27 mm	S-PBGA-B357	3		YES	e0
MC68360VR33L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32	GRID ARRAY		4.75 V	70 Cel	1.25 MBps	0 Cel	TIN SILVER COPPER	BOTTOM	1.86 mm		25 mm		YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz	40	260	25 mm	CMOS	5 V			MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e1
MC68EN360ZQ25VL	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V	8	32	GRID ARRAY	BGA357,19X19,50	4.75 V	70 Cel	1.25 MBps	0 Cel	TIN LEAD SILVER	BOTTOM	1.86 mm	2560	25 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI; BIPH-SPACE(FM0); BIPH-MARK(FM1); BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC BYTE; ASYNC, HDLC; SYNC, HDLC; SYNC SDLC; BISYNC	33.34 MHz	40	260	25 mm	HCMOS	5 V	16	6	SCC, SMC, SPI, UART	1.27 mm	S-PBGA-B357	3		YES	e0
MC68MH360ZQ25VL	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32	GRID ARRAY		4.75 V	70 Cel	1.25 MBps	0 Cel	TIN LEAD	BOTTOM	1.86 mm		25 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz			25 mm	CMOS	5 V			MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e0
MC68360ZQ33L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32	GRID ARRAY		4.75 V	70 Cel	1.25 MBps	0 Cel	TIN LEAD	BOTTOM	1.86 mm		25 mm		YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz	40	260	25 mm	CMOS	5 V			MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e0
MC68360CVR25L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES			32	GRID ARRAY						TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz	40	260	25 mm	CMOS				MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e1
MC68360VR25VL	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32	GRID ARRAY		4.75 V	70 Cel	1.25 MBps	0 Cel	TIN SILVER COPPER	BOTTOM	1.86 mm		25 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz	40	260	25 mm	CMOS	5 V			MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e1
MC68MH360VR25VL	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32	GRID ARRAY		4.75 V	70 Cel	1.25 MBps	0 Cel	TIN SILVER COPPER	BOTTOM	1.86 mm		25 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz	40	260	25 mm	CMOS	5 V			MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e1
MC68360ZQ25L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32	GRID ARRAY		4.75 V	70 Cel	1.25 MBps	0 Cel	TIN LEAD	BOTTOM	1.86 mm		25 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz			25 mm	CMOS	5 V			MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e0
MC68360ZQ25VL	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32	GRID ARRAY		4.75 V	70 Cel	1.25 MBps	0 Cel	TIN LEAD	BOTTOM	1.86 mm		25 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz	40	260	25 mm	CMOS	5 V			MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e0
MC68E360VR25VLR2	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32	GRID ARRAY		4.75 V	70 Cel	1.25 MBps	0 Cel	TIN SILVER COPPER	BOTTOM	1.86 mm		25 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz			25 mm	CMOS	5 V			MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e1
MC68EN360CVR25L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES		8	32	GRID ARRAY	BGA357,19X19,50			1.25 MBps		TIN SILVER COPPER	BOTTOM	2.52 mm	2560	25 mm	ALSO OPERATES AT 3.3 V	YES	32		ASYNC, BIT; SYNC BYTE; ASYNC, HDLC; SYNC, HDLC; SYNC SDLC; BISYNC	25 MHz	40	260	25 mm	CMOS		16	1	SCC, SMC, SPI, UART	1.27 mm	S-PBGA-B357	3		YES	e1

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.