BALL Serial Communication Controllers 206

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Maximum Data Transfer Rate Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Additional Features Boundary Scan Peripherals External Data Bus Width Data Encoding or Decoding Method Communication Protocol Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) No. of Timers RAM Bytes Technology Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Drive Interface Standard Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

XR17V358IB176-F

Exar

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

BALL

176

LFBGA

SQUARE

PLASTIC/EPOXY

YES

0

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA176,15X15,32

85 Cel

3.125 MBps

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

13 mm

YES

8

NRZ

ASYNC, BIT

245

13 mm

CMOS

1.2 V

8

Serial IO/Communication Controllers

PCI

.8 mm

S-PBGA-B176

4

Not Qualified

YES

e1

XR17V354IB176-F

Exar

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

BALL

176

LFBGA

SQUARE

PLASTIC/EPOXY

YES

0

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA176,15X15,32

85 Cel

3.125 MBps

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

13 mm

YES

8

NRZ

ASYNC, BIT

245

13 mm

CMOS

1.2 V

3

Serial IO/Communication Controllers

PCI

.8 mm

S-PBGA-B176

4

Not Qualified

YES

e1

ET1100-0003-NNNN

Beckhoff Automation

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

BALL

128

TFBGA

SQUARE

PLASTIC/EPOXY

YES

2.75 V

16

GRID ARRAY, THIN PROFILE, FINE PITCH

2.25 V

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.2 mm

10 mm

NO

16

ASYNC, BIT; SYNC, BYTE; ETHERNET

10

260

10 mm

CMOS

2.5 V

4

I2C

.8 mm

S-PBGA-B128

3

NO

e1

NH82580DB/SLH5U

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.08 V

0

GRID ARRAY

.93 V

85 Cel

320 MBps

-10 Cel

BOTTOM

2.01 mm

17 mm

ALSO REQUIRES 1.8V AND 3.3V SUPPLY

YES

0

BIPH-LEVEL(MANCHESTER)

ASYNC, BIT

25 MHz

NOT SPECIFIED

NOT SPECIFIED

17 mm

CMOS

1 V

4

PCI

1 mm

S-PBGA-B256

YES

NH82580EBSLH5Q

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.08 V

1,1.8,3.3

GRID ARRAY

BGA256,16X16,40

.93 V

85 Cel

640 MBps

-10 Cel

BOTTOM

ALSO REQUIRES 1.8V SUPPLY

YES

BIPH-LEVEL(MANCHESTER)

ASYNC, BIT

25 MHz

CMOS

2528 mA

1 V

4

Serial IO/Communication Controllers

PCI

1 mm

S-PBGA-B256

Not Qualified

YES

PM8072B1-F3EI

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

BALL

1071

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BGA1071(UNSPEC)

1000 MBps

BOTTOM

NO

ASYNC, BIT

CMOS

PCI, UART

S-PBGA-B1071

NO

LU82541PI

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

COMMERCIAL

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY

BGA196,14X14,40

1.14 V

70 Cel

125 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

1.75 mm

15 mm

YES

32

NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

25 MHz

15 mm

CMOS

1.2 V

1

Serial IO/Communication Controllers

PCI

1 mm

S-PBGA-B196

Not Qualified

YES

e1

JL82599ENSR1ZS

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

COMMERCIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

70 Cel

1250 MBps

0 Cel

BOTTOM

NO

SYNC, HDLC

CMOS

1

PCI

S-PBGA-B576

YES

FTXL710-BM1

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

BALL

BGA

SQUARE

UNSPECIFIED

YES

GRID ARRAY

55 Cel

5000 MBps

0 Cel

BOTTOM

NO

CMOS

PCI

S-PBGA-B

NO

FTXL710-BM1SLLKA

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

BALL

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

55 Cel

0 Cel

BOTTOM

NO

CMOS

PCI

S-PBGA-B

NO

FTXL710-BM1SLLK9

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

BALL

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

55 Cel

0 Cel

BOTTOM

NO

CMOS

PCI

S-PBGA-B

NO

HI-2130GBTF

Holt Integrated Circuits

SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553

MILITARY

BALL

121

BGA

SQUARE

PLASTIC/EPOXY

YES

16

GRID ARRAY

125 Cel

.125 MBps

-55 Cel

BOTTOM

5.2 mm

16.3 mm

NO

16

BIPH-LEVEL(MANCHESTER)

MIL-STD-1553A; MIL-STD-1553B; MIL-STD-1760

16.3 mm

CMOS

3.3 V

2

SPI

1.27 mm

S-PBGA-B121

1

NO

KMC68EN360VR25VL

Freescale Semiconductor

SERIAL IO/COMMUNICATION CONTROLLER, LAN

COMMERCIAL

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

3.3 V

32

GRID ARRAY

2.7 V

70 Cel

1.25 MBps

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.86 mm

25 mm

YES

32

NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC

25 MHz

40

260

25 mm

HCMOS

3 V

4

68000

1.27 mm

S-PBGA-B357

3

Not Qualified

YES

e1

TL16C550DIZQSR

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

INDUSTRIAL

BALL

24

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

3

2.5/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA24,5X5,20

4.5 V

85 Cel

.1875 MBps

-40 Cel

TIN SILVER COPPER

BOTTOM

1 mm

3 mm

ALSO OPERATES AT 2.5V/3.3V SUPPLY

NO

8

ASYNC, BIT

24 MHz

30

260

3 mm

CMOS

8 mA

5 V

1

Serial IO/Communication Controllers

.5 mm

S-PBGA-B24

1

Not Qualified

NO

e1

TL16C550DZQSR

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

BALL

24

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

3

2.5/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA24,5X5,20

4.5 V

70 Cel

.1875 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

1 mm

3 mm

ALSO OPERATES AT 2.5V/3.3V SUPPLY

NO

8

ASYNC, BIT

24 MHz

30

260

3 mm

CMOS

5 V

1

Serial IO/Communication Controllers

.5 mm

S-PBGA-B24

1

Not Qualified

NO

e1

PM8068B1-F3EI

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER

OTHER

BALL

1022

SQUARE

PLASTIC/EPOXY

YES

105 Cel

1000 MBps

0 Cel

BOTTOM

NO

I2C

CMOS

PCI, UART

S-PBGA-B1022

NO

DP83815DUJB/NOPB

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, LAN

COMMERCIAL

BALL

160

LBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

3.3

GRID ARRAY, LOW PROFILE

BGA160,14X14,40

3 V

70 Cel

12.5 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

1.65 mm

15 mm

NO

32

NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

25 MHz

30

260

15 mm

CMOS

225 mA

3.3 V

4

Serial IO/Communication Controllers

PCI

1 mm

S-PBGA-B160

3

Not Qualified

YES

e1

GD82551IT

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

INDUSTRIAL

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

3.3,5

GRID ARRAY

BGA196,14X14,40

3 V

85 Cel

12.5 MBps

-40 Cel

BOTTOM

1.75 mm

15 mm

NO

32

NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

25 MHz

NOT SPECIFIED

NOT SPECIFIED

15 mm

CMOS

155 mA

3.3 V

1

Serial IO/Communication Controllers

1 mm

S-PBGA-B196

Not Qualified

YES

e0

LU82541PI/SL7FZ

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

COMMERCIAL

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

1.2,1.8,3.3

GRID ARRAY

BGA196,14X14,40

70 Cel

0 Cel

BOTTOM

Serial IO/Communication Controllers

1 mm

S-PBGA-B196

Not Qualified

MC68360VR25L

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

5.25 V

32

GRID ARRAY

4.75 V

70 Cel

1.25 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

1.86 mm

25 mm

ALSO OPERATES AT 3.3 V

YES

32

NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL

BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP

25 MHz

40

260

25 mm

CMOS

5 V

MC68040; MC68030

1.27 mm

S-PBGA-B357

3

YES

e1

FTX710-BM2SLLKB

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

COMMERCIAL

BALL

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

55 Cel

-10 Cel

BOTTOM

NOT SPECIFIED

NOT SPECIFIED

CMOS

PCI

S-PBGA-B

JL82599ES

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

COMMERCIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY

1.14 V

70 Cel

1250 MBps

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

2.755 mm

25 mm

ALSO REQUIRES 3.3V

YES

NRZ; BIPH-LEVEL(MANCHESTER)

SYNC, HDLC

25 MHz

40

245

25 mm

CMOS

1.2 V

1

PCI; USB

1 mm

S-PBGA-B576

Not Qualified

YES

e1

JL82599ESSLGWE

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1.2,3.3

GRID ARRAY

BGA576,24X24,40

BOTTOM

CMOS

Serial IO/Communication Controllers

1 mm

S-PBGA-B576

Not Qualified

JL82599ESSLGWF

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1.2,3.3

GRID ARRAY

BGA576,24X24,40

BOTTOM

CMOS

Serial IO/Communication Controllers

1 mm

S-PBGA-B576

Not Qualified

MC68EN360VR25VL

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, LAN

COMMERCIAL

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

5.25 V

8

32

GRID ARRAY

BGA357,19X19,50

4.75 V

70 Cel

1.25 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

1.86 mm

2560

25 mm

ALSO OPERATES AT 3.3 V

YES

32

NRZ; NRZI; BIPH-SPACE(FM0); BIPH-MARK(FM1); BIPH-LEVEL(MANCHESTER)

ASYNC, BIT; SYNC BYTE; ASYNC, HDLC; SYNC, HDLC; SYNC SDLC; BISYNC

33.34 MHz

40

260

25 mm

HCMOS

5 V

16

6

SCC, SMC, SPI, UART

1.27 mm

S-PBGA-B357

3

Not Qualified

YES

e1

NHI350AM2SLJ3S

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.08 V

1

GRID ARRAY

BGA256,16X16,40

.93 V

85 Cel

640 MBps

-40 Cel

BOTTOM

2.01 mm

17 mm

YES

BIPH-LEVEL(MANCHESTER)

ASYNC, BIT; SYNC, BYTE; I2C

25 MHz

17 mm

CMOS

2218 mA

1 V

Serial IO/Communication Controllers

PCI; USB

1 mm

S-PBGA-B256

Not Qualified

YES

ELX550AT2SLL2E

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

COMMERCIAL

BALL

SQUARE

PLASTIC/EPOXY

YES

0

55 Cel

0 Cel

BOTTOM

NO

0

CMOS

PCI

NO

BCM5720A0KFBG

Broadcom

SERIAL IO/COMMUNICATION CONTROLLER, LAN

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

55 Cel

0 Cel

BOTTOM

3.3V to 1.2V Voltage Regulator Control available

YES

SYNC, BIT, BYTE, ETHERNET

24 MHz

260

CMOS

PCI, SMBUS

S-PBGA-B169

3

YES

NH82580DB

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

OTHER

BALL

256

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.08 V

0

GRID ARRAY, HEAT SINK/SLUG

.93 V

85 Cel

640 MBps

-10 Cel

BOTTOM

2.01 mm

17 mm

ALSO REQUIRES 1.8V SUPPLY

YES

0

BIPH-LEVEL(MANCHESTER)

ASYNC, BIT

25 MHz

17 mm

CMOS

1 V

2

I2C; PCI; SPI

1 mm

S-PBGA-B256

YES

JL82599EBSLGWH

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1.2,3.3

GRID ARRAY

BGA576,24X24,40

BOTTOM

CMOS

Serial IO/Communication Controllers

1 mm

S-PBGA-B576

Not Qualified

LU82551QM

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

OTHER

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

3.3,3.3/5

GRID ARRAY

BGA196,14X14,40

3 V

85 Cel

12.5 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

1.75 mm

15 mm

ALSO REQUIRES 5V SUPPLY

NO

32

NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

25 MHz

15 mm

CMOS

3.3 V

1

Serial IO/Communication Controllers

PCI; CARDBUS

1 mm

S-PBGA-B196

Not Qualified

YES

e1

GD82551ER

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

OTHER

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

3.3,5

GRID ARRAY

BGA196,14X14,40

3 V

85 Cel

12.5 MBps

0 Cel

TIN LEAD

BOTTOM

1.75 mm

15 mm

NO

32

NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

25 MHz

15 mm

CMOS

155 mA

3.3 V

1

Serial IO/Communication Controllers

1 mm

S-PBGA-B196

Not Qualified

YES

e0

JL82599EB

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

COMMERCIAL

BALL

SQUARE

PLASTIC/EPOXY

YES

0

70 Cel

1250 MBps

0 Cel

BOTTOM

NO

0

CMOS

PCI

NO

PC82573L

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

COMMERCIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

0

1.2,2.5,3.3

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

1.14 V

70 Cel

125 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

15 mm

YES

0

NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

25 MHz

15 mm

CMOS

1.2 V

1

Serial IO/Communication Controllers

PCI

1 mm

S-PBGA-B196

Not Qualified

YES

e1

BC358239A-INN-E4

Qualcomm

INDUSTRIAL

BALL

96

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8,1.8/3.3

GRID ARRAY, FINE PITCH

BGA96,11X11,32

105 Cel

-40 Cel

BOTTOM

Serial IO/Communication Controllers

.8 mm

S-PBGA-B96

Not Qualified

FW82546GB

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

COMMERCIAL

BALL

364

BGA

SQUARE

PLASTIC/EPOXY

YES

1.57 V

64

1.5,2.5,3.3

GRID ARRAY

BGA364,20X20,40

1.43 V

55 Cel

125 MBps

0 Cel

TIN LEAD

BOTTOM

2.43 mm

21 mm

YES

64

25 MHz

21 mm

CMOS

1.5 V

2

Serial IO/Communication Controllers

PCI

1 mm

S-PBGA-B364

Not Qualified

YES

e0

JL82576EBSLJBH

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

COMMERCIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

0

GRID ARRAY

1.71 V

55 Cel

128 MBps

0 Cel

BOTTOM

25 mm

YES

0

BIPH-LEVEL(MANCHESTER)

ASYNC, BIT; I2C

25 MHz

25 mm

CMOS

1.8 V

2

PCI

1 mm

S-PBGA-B576

YES

LU82551ER

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

OTHER

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

3.3

GRID ARRAY

BGA196,14X14,40

3 V

85 Cel

12.5 MBps

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.75 mm

15 mm

NO

32

NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

25 MHz

30

260

15 mm

CMOS

155 mA

3.3 V

1

Serial IO/Communication Controllers

1 mm

S-PBGA-B196

3

Not Qualified

YES

e1

LU82562EZ

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY

BGA196,14X14,40

BOTTOM

3.3 V

Serial IO/Communication Controllers

1 mm

S-PBGA-B196

Not Qualified

NH82546GB

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

COMMERCIAL

BALL

364

BGA

SQUARE

PLASTIC/EPOXY

YES

1.57 V

64

1.5,2.5,3.3

GRID ARRAY

BGA364,20X20,40

1.43 V

55 Cel

125 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

2.43 mm

21 mm

YES

64

25 MHz

21 mm

CMOS

1.5 V

2

Serial IO/Communication Controllers

PCI

1 mm

S-PBGA-B364

Not Qualified

YES

e1

HI-2130GBIF

Holt Integrated Circuits

SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553

INDUSTRIAL

BALL

121

BGA

SQUARE

PLASTIC/EPOXY

YES

16

GRID ARRAY

85 Cel

.125 MBps

-40 Cel

TIN SILVER COPPER

BOTTOM

5.2 mm

16.3 mm

NO

16

BIPH-LEVEL(MANCHESTER)

MIL-STD-1553A; MIL-STD-1553B; MIL-STD-1760

40

260

16.3 mm

CMOS

3.3 V

2

SPI

1.27 mm

S-PBGA-B121

1

NO

e1

LU82551IT

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

INDUSTRIAL

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

3.3,5

GRID ARRAY

BGA196,14X14,40

3 V

85 Cel

12.5 MBps

-40 Cel

TIN SILVER COPPER

BOTTOM

1.75 mm

15 mm

NO

32

NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

25 MHz

15 mm

CMOS

155 mA

3.3 V

1

Serial IO/Communication Controllers

1 mm

S-PBGA-B196

Not Qualified

YES

e1

NH82580EB

Intel

SERIAL IO/COMMUNICATION CONTROLLER, LAN

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.08 V

GRID ARRAY

.93 V

85 Cel

640 MBps

-10 Cel

BOTTOM

ALSO REQUIRES 1.8V SUPPLY

YES

BIPH-LEVEL(MANCHESTER)

ASYNC, BIT

25 MHz

CMOS

1 V

4

PCI

S-PBGA-B256

YES

PM3387-BI

Pmc-sierra

SERIAL IO/COMMUNICATION CONTROLLER, LAN

INDUSTRIAL

BALL

352

BGA

SQUARE

PLASTIC/EPOXY

YES

1.8,3.3

GRID ARRAY

BGA352,26X26,40

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

CMOS

Serial IO/Communication Controllers

1 mm

S-PBGA-B352

3

Not Qualified

e0

SCH3224-SY

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER

COMMERCIAL

BALL

100

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.63 V

8

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA100,11X11,25

2.97 V

70 Cel

.1875 MBps

0 Cel

TIN SILVER COPPER

BOTTOM

.8 mm

256

8 mm

NO

0

SYNC, BYTE

33 MHz

8 mm

CMOS

1 mA

3 V

4

2

PCI; UART

.65 mm

S-PBGA-B100

YES

e1

24

SCH3226I-SY

Microchip Technology

SERIAL IO/COMMUNICATION CONTROLLER

INDUSTRIAL

BALL

100

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.63 V

8

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA100,11X11,25

2.97 V

85 Cel

.1875 MBps

-40 Cel

TIN SILVER COPPER

BOTTOM

.8 mm

256

8 mm

NO

0

SYNC, BYTE

33 MHz

8 mm

CMOS

1 mA

3 V

0

6

PCI; UART

.65 mm

S-PBGA-B100

YES

e1

40

TSB43AA82GHH

Texas Instruments

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

COMMERCIAL

BALL

179

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA179,14X14,32

3 V

70 Cel

50 MBps

0 Cel

BOTTOM

1.4 mm

12 mm

NO

16

24.576 MHz

12 mm

CMOS

3.3 V

2

Bus Controllers

.8 mm

S-PBGA-B179

Not Qualified

YES

TSB43DB42GHCR

Texas Instruments

CONSUMER CIRCUIT

COMMERCIAL EXTENDED

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

32

GRID ARRAY, LOW PROFILE

85 Cel

400 MBps

-20 Cel

BOTTOM

1.5 mm

15 mm

32

33 MHz

15 mm

CMOS

PCI

1 mm

S-PBGA-B196

3

Not Qualified

IEEE1394; IEEE1394A

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.