Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Data Encoding or Decoding Method | Communication Protocol | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Exar |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
BALL |
176 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
0 |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA176,15X15,32 |
85 Cel |
3.125 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
13 mm |
YES |
8 |
NRZ |
ASYNC, BIT |
245 |
13 mm |
CMOS |
1.2 V |
8 |
Serial IO/Communication Controllers |
PCI |
.8 mm |
S-PBGA-B176 |
4 |
Not Qualified |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
Exar |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
BALL |
176 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
0 |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA176,15X15,32 |
85 Cel |
3.125 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
13 mm |
YES |
8 |
NRZ |
ASYNC, BIT |
245 |
13 mm |
CMOS |
1.2 V |
3 |
Serial IO/Communication Controllers |
PCI |
.8 mm |
S-PBGA-B176 |
4 |
Not Qualified |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
Beckhoff Automation |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
BALL |
128 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.75 V |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.25 V |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.2 mm |
10 mm |
NO |
16 |
ASYNC, BIT; SYNC, BYTE; ETHERNET |
10 |
260 |
10 mm |
CMOS |
2.5 V |
4 |
I2C |
.8 mm |
S-PBGA-B128 |
3 |
NO |
e1 |
||||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.08 V |
0 |
GRID ARRAY |
.93 V |
85 Cel |
320 MBps |
-10 Cel |
BOTTOM |
2.01 mm |
17 mm |
ALSO REQUIRES 1.8V AND 3.3V SUPPLY |
YES |
0 |
BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
CMOS |
1 V |
4 |
PCI |
1 mm |
S-PBGA-B256 |
YES |
|||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.08 V |
1,1.8,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
.93 V |
85 Cel |
640 MBps |
-10 Cel |
BOTTOM |
ALSO REQUIRES 1.8V SUPPLY |
YES |
BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT |
25 MHz |
CMOS |
2528 mA |
1 V |
4 |
Serial IO/Communication Controllers |
PCI |
1 mm |
S-PBGA-B256 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
BALL |
1071 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BGA1071(UNSPEC) |
1000 MBps |
BOTTOM |
NO |
ASYNC, BIT |
CMOS |
PCI, UART |
S-PBGA-B1071 |
NO |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
1.2,1.8,3.3 |
GRID ARRAY |
BGA196,14X14,40 |
1.14 V |
70 Cel |
125 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.75 mm |
15 mm |
YES |
32 |
NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
25 MHz |
15 mm |
CMOS |
1.2 V |
1 |
Serial IO/Communication Controllers |
PCI |
1 mm |
S-PBGA-B196 |
Not Qualified |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
BALL |
576 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
70 Cel |
1250 MBps |
0 Cel |
BOTTOM |
NO |
SYNC, HDLC |
CMOS |
1 |
PCI |
S-PBGA-B576 |
YES |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
BALL |
BGA |
SQUARE |
UNSPECIFIED |
YES |
GRID ARRAY |
55 Cel |
5000 MBps |
0 Cel |
BOTTOM |
NO |
CMOS |
PCI |
S-PBGA-B |
NO |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
BALL |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
55 Cel |
0 Cel |
BOTTOM |
NO |
CMOS |
PCI |
S-PBGA-B |
NO |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
BALL |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
55 Cel |
0 Cel |
BOTTOM |
NO |
CMOS |
PCI |
S-PBGA-B |
NO |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Holt Integrated Circuits |
SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 |
MILITARY |
BALL |
121 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
GRID ARRAY |
125 Cel |
.125 MBps |
-55 Cel |
BOTTOM |
5.2 mm |
16.3 mm |
NO |
16 |
BIPH-LEVEL(MANCHESTER) |
MIL-STD-1553A; MIL-STD-1553B; MIL-STD-1760 |
16.3 mm |
CMOS |
3.3 V |
2 |
SPI |
1.27 mm |
S-PBGA-B121 |
1 |
NO |
||||||||||||||||||||||||||||||||||||||
|
Freescale Semiconductor |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
BALL |
357 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 V |
32 |
GRID ARRAY |
2.7 V |
70 Cel |
1.25 MBps |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.86 mm |
25 mm |
YES |
32 |
NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC |
25 MHz |
40 |
260 |
25 mm |
HCMOS |
3 V |
4 |
68000 |
1.27 mm |
S-PBGA-B357 |
3 |
Not Qualified |
YES |
e1 |
||||||||||||||||||||||||||||||
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
2.5/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA24,5X5,20 |
4.5 V |
85 Cel |
.1875 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 mm |
3 mm |
ALSO OPERATES AT 2.5V/3.3V SUPPLY |
NO |
8 |
ASYNC, BIT |
24 MHz |
30 |
260 |
3 mm |
CMOS |
8 mA |
5 V |
1 |
Serial IO/Communication Controllers |
.5 mm |
S-PBGA-B24 |
1 |
Not Qualified |
NO |
e1 |
|||||||||||||||||||||||||||
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
BALL |
24 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
2.5/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA24,5X5,20 |
4.5 V |
70 Cel |
.1875 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 mm |
3 mm |
ALSO OPERATES AT 2.5V/3.3V SUPPLY |
NO |
8 |
ASYNC, BIT |
24 MHz |
30 |
260 |
3 mm |
CMOS |
5 V |
1 |
Serial IO/Communication Controllers |
.5 mm |
S-PBGA-B24 |
1 |
Not Qualified |
NO |
e1 |
||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER |
OTHER |
BALL |
1022 |
SQUARE |
PLASTIC/EPOXY |
YES |
105 Cel |
1000 MBps |
0 Cel |
BOTTOM |
NO |
I2C |
CMOS |
PCI, UART |
S-PBGA-B1022 |
NO |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
BALL |
160 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
GRID ARRAY, LOW PROFILE |
BGA160,14X14,40 |
3 V |
70 Cel |
12.5 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.65 mm |
15 mm |
NO |
32 |
NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
25 MHz |
30 |
260 |
15 mm |
CMOS |
225 mA |
3.3 V |
4 |
Serial IO/Communication Controllers |
PCI |
1 mm |
S-PBGA-B160 |
3 |
Not Qualified |
YES |
e1 |
|||||||||||||||||||||||||||
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,5 |
GRID ARRAY |
BGA196,14X14,40 |
3 V |
85 Cel |
12.5 MBps |
-40 Cel |
BOTTOM |
1.75 mm |
15 mm |
NO |
32 |
NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
15 mm |
CMOS |
155 mA |
3.3 V |
1 |
Serial IO/Communication Controllers |
1 mm |
S-PBGA-B196 |
Not Qualified |
YES |
e0 |
|||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2,1.8,3.3 |
GRID ARRAY |
BGA196,14X14,40 |
70 Cel |
0 Cel |
BOTTOM |
Serial IO/Communication Controllers |
1 mm |
S-PBGA-B196 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
BALL |
357 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
GRID ARRAY |
4.75 V |
70 Cel |
1.25 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.86 mm |
25 mm |
ALSO OPERATES AT 3.3 V |
YES |
32 |
NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL |
BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP |
25 MHz |
40 |
260 |
25 mm |
CMOS |
5 V |
MC68040; MC68030 |
1.27 mm |
S-PBGA-B357 |
3 |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
BALL |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
55 Cel |
-10 Cel |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
PCI |
S-PBGA-B |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
BALL |
576 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY |
1.14 V |
70 Cel |
1250 MBps |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2.755 mm |
25 mm |
ALSO REQUIRES 3.3V |
YES |
NRZ; BIPH-LEVEL(MANCHESTER) |
SYNC, HDLC |
25 MHz |
40 |
245 |
25 mm |
CMOS |
1.2 V |
1 |
PCI; USB |
1 mm |
S-PBGA-B576 |
Not Qualified |
YES |
e1 |
||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
BALL |
576 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2,3.3 |
GRID ARRAY |
BGA576,24X24,40 |
BOTTOM |
CMOS |
Serial IO/Communication Controllers |
1 mm |
S-PBGA-B576 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
BALL |
576 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2,3.3 |
GRID ARRAY |
BGA576,24X24,40 |
BOTTOM |
CMOS |
Serial IO/Communication Controllers |
1 mm |
S-PBGA-B576 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
BALL |
357 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
8 |
32 |
GRID ARRAY |
BGA357,19X19,50 |
4.75 V |
70 Cel |
1.25 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.86 mm |
2560 |
25 mm |
ALSO OPERATES AT 3.3 V |
YES |
32 |
NRZ; NRZI; BIPH-SPACE(FM0); BIPH-MARK(FM1); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC BYTE; ASYNC, HDLC; SYNC, HDLC; SYNC SDLC; BISYNC |
33.34 MHz |
40 |
260 |
25 mm |
HCMOS |
5 V |
16 |
6 |
SCC, SMC, SPI, UART |
1.27 mm |
S-PBGA-B357 |
3 |
Not Qualified |
YES |
e1 |
|||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.08 V |
1 |
GRID ARRAY |
BGA256,16X16,40 |
.93 V |
85 Cel |
640 MBps |
-40 Cel |
BOTTOM |
2.01 mm |
17 mm |
YES |
BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; I2C |
25 MHz |
17 mm |
CMOS |
2218 mA |
1 V |
Serial IO/Communication Controllers |
PCI; USB |
1 mm |
S-PBGA-B256 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
BALL |
SQUARE |
PLASTIC/EPOXY |
YES |
0 |
55 Cel |
0 Cel |
BOTTOM |
NO |
0 |
CMOS |
PCI |
NO |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
BALL |
169 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
55 Cel |
0 Cel |
BOTTOM |
3.3V to 1.2V Voltage Regulator Control available |
YES |
SYNC, BIT, BYTE, ETHERNET |
24 MHz |
260 |
CMOS |
PCI, SMBUS |
S-PBGA-B169 |
3 |
YES |
||||||||||||||||||||||||||||||||||||||||||||||
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
OTHER |
BALL |
256 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.08 V |
0 |
GRID ARRAY, HEAT SINK/SLUG |
.93 V |
85 Cel |
640 MBps |
-10 Cel |
BOTTOM |
2.01 mm |
17 mm |
ALSO REQUIRES 1.8V SUPPLY |
YES |
0 |
BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT |
25 MHz |
17 mm |
CMOS |
1 V |
2 |
I2C; PCI; SPI |
1 mm |
S-PBGA-B256 |
YES |
||||||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
BALL |
576 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2,3.3 |
GRID ARRAY |
BGA576,24X24,40 |
BOTTOM |
CMOS |
Serial IO/Communication Controllers |
1 mm |
S-PBGA-B576 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
OTHER |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,3.3/5 |
GRID ARRAY |
BGA196,14X14,40 |
3 V |
85 Cel |
12.5 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.75 mm |
15 mm |
ALSO REQUIRES 5V SUPPLY |
NO |
32 |
NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
25 MHz |
15 mm |
CMOS |
3.3 V |
1 |
Serial IO/Communication Controllers |
PCI; CARDBUS |
1 mm |
S-PBGA-B196 |
Not Qualified |
YES |
e1 |
||||||||||||||||||||||||||||||
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
OTHER |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,5 |
GRID ARRAY |
BGA196,14X14,40 |
3 V |
85 Cel |
12.5 MBps |
0 Cel |
TIN LEAD |
BOTTOM |
1.75 mm |
15 mm |
NO |
32 |
NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
25 MHz |
15 mm |
CMOS |
155 mA |
3.3 V |
1 |
Serial IO/Communication Controllers |
1 mm |
S-PBGA-B196 |
Not Qualified |
YES |
e0 |
||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
BALL |
SQUARE |
PLASTIC/EPOXY |
YES |
0 |
70 Cel |
1250 MBps |
0 Cel |
BOTTOM |
NO |
0 |
CMOS |
PCI |
NO |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
1.2,2.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
1.14 V |
70 Cel |
125 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.6 mm |
15 mm |
YES |
0 |
NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
25 MHz |
15 mm |
CMOS |
1.2 V |
1 |
Serial IO/Communication Controllers |
PCI |
1 mm |
S-PBGA-B196 |
Not Qualified |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
Qualcomm |
INDUSTRIAL |
BALL |
96 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.8,1.8/3.3 |
GRID ARRAY, FINE PITCH |
BGA96,11X11,32 |
105 Cel |
-40 Cel |
BOTTOM |
Serial IO/Communication Controllers |
.8 mm |
S-PBGA-B96 |
Not Qualified |
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Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
BALL |
364 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.57 V |
64 |
1.5,2.5,3.3 |
GRID ARRAY |
BGA364,20X20,40 |
1.43 V |
55 Cel |
125 MBps |
0 Cel |
TIN LEAD |
BOTTOM |
2.43 mm |
21 mm |
YES |
64 |
25 MHz |
21 mm |
CMOS |
1.5 V |
2 |
Serial IO/Communication Controllers |
PCI |
1 mm |
S-PBGA-B364 |
Not Qualified |
YES |
e0 |
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|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
BALL |
576 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
0 |
GRID ARRAY |
1.71 V |
55 Cel |
128 MBps |
0 Cel |
BOTTOM |
25 mm |
YES |
0 |
BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; I2C |
25 MHz |
25 mm |
CMOS |
1.8 V |
2 |
PCI |
1 mm |
S-PBGA-B576 |
YES |
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|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
OTHER |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
GRID ARRAY |
BGA196,14X14,40 |
3 V |
85 Cel |
12.5 MBps |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.75 mm |
15 mm |
NO |
32 |
NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
25 MHz |
30 |
260 |
15 mm |
CMOS |
155 mA |
3.3 V |
1 |
Serial IO/Communication Controllers |
1 mm |
S-PBGA-B196 |
3 |
Not Qualified |
YES |
e1 |
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|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY |
BGA196,14X14,40 |
BOTTOM |
3.3 V |
Serial IO/Communication Controllers |
1 mm |
S-PBGA-B196 |
Not Qualified |
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|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
BALL |
364 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.57 V |
64 |
1.5,2.5,3.3 |
GRID ARRAY |
BGA364,20X20,40 |
1.43 V |
55 Cel |
125 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.43 mm |
21 mm |
YES |
64 |
25 MHz |
21 mm |
CMOS |
1.5 V |
2 |
Serial IO/Communication Controllers |
PCI |
1 mm |
S-PBGA-B364 |
Not Qualified |
YES |
e1 |
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|
Holt Integrated Circuits |
SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 |
INDUSTRIAL |
BALL |
121 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
GRID ARRAY |
85 Cel |
.125 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
5.2 mm |
16.3 mm |
NO |
16 |
BIPH-LEVEL(MANCHESTER) |
MIL-STD-1553A; MIL-STD-1553B; MIL-STD-1760 |
40 |
260 |
16.3 mm |
CMOS |
3.3 V |
2 |
SPI |
1.27 mm |
S-PBGA-B121 |
1 |
NO |
e1 |
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|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,5 |
GRID ARRAY |
BGA196,14X14,40 |
3 V |
85 Cel |
12.5 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.75 mm |
15 mm |
NO |
32 |
NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
25 MHz |
15 mm |
CMOS |
155 mA |
3.3 V |
1 |
Serial IO/Communication Controllers |
1 mm |
S-PBGA-B196 |
Not Qualified |
YES |
e1 |
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|
Intel |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.08 V |
GRID ARRAY |
.93 V |
85 Cel |
640 MBps |
-10 Cel |
BOTTOM |
ALSO REQUIRES 1.8V SUPPLY |
YES |
BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT |
25 MHz |
CMOS |
1 V |
4 |
PCI |
S-PBGA-B256 |
YES |
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Pmc-sierra |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
BALL |
352 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.8,3.3 |
GRID ARRAY |
BGA352,26X26,40 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
CMOS |
Serial IO/Communication Controllers |
1 mm |
S-PBGA-B352 |
3 |
Not Qualified |
e0 |
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|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER |
COMMERCIAL |
BALL |
100 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
8 |
0 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA100,11X11,25 |
2.97 V |
70 Cel |
.1875 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
.8 mm |
256 |
8 mm |
NO |
0 |
SYNC, BYTE |
33 MHz |
8 mm |
CMOS |
1 mA |
3 V |
4 |
2 |
PCI; UART |
.65 mm |
S-PBGA-B100 |
YES |
e1 |
24 |
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|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER |
INDUSTRIAL |
BALL |
100 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
8 |
0 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA100,11X11,25 |
2.97 V |
85 Cel |
.1875 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
.8 mm |
256 |
8 mm |
NO |
0 |
SYNC, BYTE |
33 MHz |
8 mm |
CMOS |
1 mA |
3 V |
0 |
6 |
PCI; UART |
.65 mm |
S-PBGA-B100 |
YES |
e1 |
40 |
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Texas Instruments |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
BALL |
179 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA179,14X14,32 |
3 V |
70 Cel |
50 MBps |
0 Cel |
BOTTOM |
1.4 mm |
12 mm |
NO |
16 |
24.576 MHz |
12 mm |
CMOS |
3.3 V |
2 |
Bus Controllers |
.8 mm |
S-PBGA-B179 |
Not Qualified |
YES |
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Texas Instruments |
CONSUMER CIRCUIT |
COMMERCIAL EXTENDED |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
GRID ARRAY, LOW PROFILE |
85 Cel |
400 MBps |
-20 Cel |
BOTTOM |
1.5 mm |
15 mm |
32 |
33 MHz |
15 mm |
CMOS |
PCI |
1 mm |
S-PBGA-B196 |
3 |
Not Qualified |
IEEE1394; IEEE1394A |
Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.
Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.
Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.