Ball Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LIFCL-40-7MG289C	Lattice Semiconductor	FPGA	Other	Ball	289	TFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74		1			Grid Array, Thin Profile, Fine Pitch	BGA289,17X17,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B289		1.2 mm	9.5 mm						74		9.5 mm
XC6SLX100-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	326		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	326	250 °C (482 °F)	23 mm
10M04SCM153C8G	Intel	FPGA	Other	Ball	153	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246		3			Grid Array	BGA153,15X15,20		2.85 V	.5 mm	85 °C (185 °F)		250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm		Also Operates at 3.3 V nominal supply				246		8 mm
ICE40UL1K-SWG16ITR	Lattice Semiconductor	FPGA	Industrial	Ball	16	BGA	Square	Plastic/Epoxy	1248	Yes	1.26 V	156	CMOS	10		1.2			Grid Array			1.14 V	.35 mm	100 °C (212 °F)	9 ns	156 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B16	1		1.409 mm					30 s	10	260 °C (500 °F)	1.409 mm
M2GL025T-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS	267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
XC3S1200E-4FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	304	1200000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	572 MHz	30 s	232	250 °C (482 °F)	21 mm
XC6SLX16-3FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	186		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	862 MHz	30 s	186	260 °C (500 °F)	17 mm
XC6SLX25-3FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	186		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	862 MHz	30 s	186	260 °C (500 °F)	17 mm
XC7A75T-3CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900		300		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.94 ns	5900 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1412 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7K70T-2FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS	285		1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	5125 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
10CX105YF672I6G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	236		.9			Grid Array			.87 V		100 °C (212 °F)		38000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672									236
LCMXO2-256HC-4MG132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	256	Yes	3.465 V			55		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	55	250 °C (482 °F)	8 mm
LFE5U-25F-8MG285C	Lattice Semiconductor	FPGA	Other	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.155 V	3000				1.1			Grid Array, Low Profile, Fine Pitch			1.045 V	.5 mm	85 °C (185 °F)		3000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s		260 °C (500 °F)	10 mm
M7A3P1000-FGG256	Microchip Technology	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	177	1000000	1.5	Tray		Grid Array			1.425 V	1 mm	70 °C (158 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	350 MHz	30 s	177	250 °C (482 °F)	17 mm
XC7A35T-1CPG236C	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	85 °C (185 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm	No		e1	1098 MHz	30 s	250	260 °C (500 °F)	10 mm
XCKU040-1FFVA1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	1920		520		.95		0.95 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		1920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm	No		e1			520		35 mm
10CL016YU484I7G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	963				1.2			Grid Array, Fine Pitch			1.15 V	.8 mm	100 °C (212 °F)		963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm								19 mm
MPF300T-FCG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
XC7K325T-3FFG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	400		1		1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.58 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No		e1	1412 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7VX485T-1FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS	700		1		0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No		e1	1818 MHz		700		45 mm
5CGXFC3B7U15C8N	Intel	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	31500	Yes	1.13 V	1346	CMOS	144		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		1346 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm	No					144		15 mm
LCMXO3LF-6900C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6900	Yes	3.465 V	858		206		2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		858 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LIFCL-40-8BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74		1			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.7 mm	17 mm					30 s	74	260 °C (500 °F)	17 mm
M2GL090-FGG484	Microchip Technology	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V			267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
M2S010TS-1VFG256I	Microchip Technology	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	12084	Yes	1.26 V			138		1.2			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.56 mm	14 mm					40 s	138	250 °C (482 °F)	14 mm
MPF200T-FCVG484I	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	192000	Yes	1.03 V		CMOS	284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
MPF300T-FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
XC3S1400A-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	161	1400000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	148	260 °C (500 °F)	17 mm
XC7S25-1FTGB196Q	Xilinx	FPGA	Automotive	Ball	196	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150		1			Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	125 °C (257 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm			e3	1098 MHz		150		15 mm
XC7S50-1CSGA324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm			e1	1098 MHz		250		15 mm
10CL016YU484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	963				1.2			Grid Array			1.15 V		85 °C (185 °F)		963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484
EP3C5M164I7N	Intel	FPGA	Industrial	Ball	164	BGA	Square	Plastic/Epoxy	5136	Yes	2.625 V	5136	CMOS	106		2.5		1.2/3.3 V	Grid Array	BGA164,15X15,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)		5136 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B164				No					106
M2GL010-VFG256I	Microchip Technology	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	12084	Yes	1.26 V					1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.56 mm	14 mm					30 s		260 °C (500 °F)	14 mm
M2GL050-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V		CMOS	267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	267	225 °C (437 °F)	23 mm
XC7A15T-1CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A50T-1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A75T-1FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900	CMOS	300		1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1098 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7K325T-1FFG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	500		1		1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm		0.74 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm	No		e1	1098 MHz	30 s	500	245 °C (473 °F)	31 mm
XC7K410T-2FFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS	500		1		1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm	No		e1	1286 MHz	30 s	500	245 °C (473 °F)	31 mm
LIFCL-40-7MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	48		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm					30 s	48	260 °C (500 °F)	6 mm
XC6SLX45T-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	296		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	296	250 °C (482 °F)	23 mm
XCKU035-2SFVA784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520		0.95		0.95 V	Grid Array, Fine Pitch	BGA784,28X28,32	Field Programmable Gate Arrays	.922 V	.8 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.52 mm	23 mm	No		e1			520		23 mm
10M02DCV36C8G	Intel	FPGA	Commercial Extended	Ball	36	VFBGA	Rectangular	Plastic/Epoxy	2000	Yes	1.25 V	125		246		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA36,6X6,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		125 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36	1	.54 mm	3.396 mm	No					246		3.466 mm
10M40DAF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		2500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			500		23 mm
LCMXO1200C-3MN132I	Lattice Semiconductor	FPGA	Industrial	Ball	132	LFBGA	Square	Plastic/Epoxy	1200	Yes	3.465 V	150		101		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		150 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		40 s	101	260 °C (500 °F)	8 mm
LCMXO2-7000HC-6FTG256I	Lattice Semiconductor	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	6864	Yes	3.465 V			206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	17 mm
MPF300T-FCG784NI	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	388		1			Grid Array	BGA784,28X28,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm		It also Operates at 1.05 V nominal supply				388		29 mm
LCMXO2-1200HC-4MG132IR1	Lattice Semiconductor	FPGA		Ball	132	BGA	Square	Plastic/Epoxy	1280	Yes	3.465 V		CMOS	105		2.5		2.5/3.3 V	Grid Array	BGA132,14X14,20	Field Programmable Gate Arrays	2.375 V	.5 mm					Tin/Silver/Copper	Bottom	S-PBGA-B132	3			No		e1	133 MHz	30 s	105	260 °C (500 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.