Ball Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU035-2FBVA900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700		520		.95		0.95 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm	No		e1		30 s	520	245 °C (473 °F)	31 mm
LCMXO2-2000HC-4FTG256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	2112	Yes	3.465 V			206		2.5	Tray	2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	206	260 °C (500 °F)	17 mm
LCMXO2-4000HC-4BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LFE5U-12F-6BG381C	Lattice Semiconductor	FPGA		Ball	381	FBGA	Square	Plastic/Epoxy		Yes	1.155 V	1500		197		1.1			Grid Array, Fine Pitch	BGA381,20X20,32		1.045 V	.8 mm	85 °C (185 °F)		1500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B381	3	1.76 mm	17 mm						197	260 °C (500 °F)	17 mm
M2GL050-FGG484	Microchip Technology	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V			267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
XC7A75T-1FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900		300		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
XC7K70T-1FBG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS	300		1		1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	5125 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1	1098 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7S100-1FGGA484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	HKMG	400		1			Grid Array	BGA484,22X22,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	8000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		400		23 mm
XC7VX690T-2FFG1927I	Xilinx	FPGA		Ball	1927	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	600		1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No		e1	1818 MHz		600	245 °C (473 °F)	45 mm
A3P1000-FG256	Microchip Technology	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
A3P600-FG256	Microchip Technology	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		600000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
LFXP2-8E-5MN132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	86		1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	435 MHz	40 s	86	260 °C (500 °F)	8 mm
XCKU040-3FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	1920		520		1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		1920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm	No		e1			520		35 mm
10M02DCV36C7G	Intel	FPGA	Commercial Extended	Ball	36	VFBGA	Rectangular	Plastic/Epoxy	2000	Yes	1.25 V	125		246		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA36,6X6,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		125 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36	1	.54 mm	3.396 mm	No					246		3.466 mm
EP1C6F256C8N	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185		1.5		1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		598 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e1	275 MHz		185		17 mm
EP3C25F324A7N	Intel	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy	24624	Yes	2.625 V	24624	CMOS	215		2.5		1.2/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		24624 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		3.5 mm	19 mm	No					215		19 mm
M7A3P1000-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	300	1000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	27 mm	No		e0	350 MHz		300		27 mm
XC7A15T-2FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	17 mm
XC7A50T-3CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.94 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm
XCKU035-3FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	1700		520		1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		1700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm	No		e1			520		35 mm
XCKU060-2FFVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	2760		624		.95		0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		2760 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	624	245 °C (473 °F)	40 mm
10CL006YU256C6G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	392				1.2			Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
EP2C20F256I8N	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS	152		1.2		1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm			1172 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		136		17 mm
EP4CE22U14I7N	Intel	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	22320	Yes	1.25 V			153		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm					Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.5 mm	14 mm	No		e1		30 s	153	260 °C (500 °F)	14 mm
XC3S1200E-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	250	1200000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	572 MHz	30 s	194	260 °C (500 °F)	19 mm
XC6SLX75T-3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	320		1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	320	250 °C (482 °F)	27 mm
5CEBA4F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	49000	Yes	1.13 V		CMOS	224		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1		30 s	224	260 °C (500 °F)	23 mm
EP1SGX10CF672C6N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS	362		1.5		1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1			362		27 mm
LCMXO3LF-1300E-5MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	1300	Yes	1.26 V	160		100		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1			100	260 °C (500 °F)	6 mm
LIFCL-17-8MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm					30 s	48	260 °C (500 °F)	6 mm
MPF100T-FCVG484E	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
XC3S2000-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS	489	2000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	5120 CLBS, 2000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	630 MHz	30 s	489	260 °C (500 °F)	27 mm
XC7A15T-1CPG236C	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1			Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	10 mm
XC7A25T-2CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150		1			Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		150		10 mm
XC7S75-2FGGA484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	76800	Yes	1.05 V	6000	HKMG	400		1			Grid Array	BGA484,22X22,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	6000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1286 MHz		400		23 mm
XCKU095-2FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95			Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1		30 s	702	245 °C (473 °F)	35 mm
5CEBA2F17I7N	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	128		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.07 V	1 mm						Bottom	S-PBGA-B256		1.55 mm	17 mm	No					128		17 mm
XC3S200A-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	195	200000	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	160	260 °C (500 °F)	17 mm
XC3S700AN-4FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS	372	700000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	288	250 °C (482 °F)	23 mm
XC6SLX100T-3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	296		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	862 MHz	30 s	296	250 °C (482 °F)	23 mm
XC7A12T-L2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	.93 V	1000	HKMG	150		0.9			Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz		150		10 mm
XC7A50T-2CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm	No		e8	1286 MHz	30 s	250	260 °C (500 °F)	10 mm
XC7A50T-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7K325T-1FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	400		1		1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.74 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1	1098 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7S15-2FTGB196C	Xilinx	FPGA	Other	Ball	196	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100		1			Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	1000 CLBS	0 °C (32 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm			e3	1286 MHz		100		15 mm
10M40DCF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			500		23 mm
5CEBA4U15C7N	Intel	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	49000	Yes	1.13 V		CMOS	176		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1			176		15 mm
5CEBA9F31C7N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	480		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm	No					480		31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.