Ball Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A100T-1FG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS		285		1			Grid Array			.95 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e0			285		23 mm
EP3C40F780I7N	Intel	FPGA	Industrial	Ball	780	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS		535		1.2			Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		39600 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz	30 s	535	260 °C (500 °F)	29 mm
XC7A35T-1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600			250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
10CL010YU256C8G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645					1.2			Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
10M16DAU324I7G	Intel	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000			320		1.2		1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					320		15 mm
5CEFA7U19I7N	Intel	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS		230		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm						Bottom	S-PBGA-B484		1.9 mm	19 mm	No					230		19 mm
A3P1000-FGG256	Microchip Technology	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	17 mm
M2GL005-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	6060	Yes	1.26 V		CMOS		209		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	209	250 °C (482 °F)	23 mm
XC3SD1800A-4CSG484C	Xilinx	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS		309	1800000	1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.71 ns	4160 CLBS, 1800000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No		e1	250 MHz	30 s	249	260 °C (500 °F)	19 mm
10M02SCU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	2000	Yes	3.15 V	125			246		3			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	85 °C (185 °F)		125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				246		15 mm
LCMXO3LF-6900C-5BG324C	Lattice Semiconductor	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858					2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.7 mm	15 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	15 mm
LIFCL-17-7MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V				48		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm					30 s	48	260 °C (500 °F)	6 mm
MPF100TS-1FCVG484I	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
EP1S25F672C7N	Intel	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS		706		1.5		1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2852 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1			706		27 mm
EP2C35F672C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS		475		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2076 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e1	402.5 MHz	30 s	459	260 °C (500 °F)	27 mm
EP4CE40F23C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	2475			331		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz	30 s	331	260 °C (500 °F)	23 mm
LFXP2-17E-5FTN256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V	2125	CMOS		201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
M1A3P250-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s		260 °C (500 °F)	13 mm
M2GL060-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s		250 °C (482 °F)	23 mm
M2GL060-FGG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B676	3	2.44 mm	27 mm					30 s		250 °C (482 °F)	27 mm
XC7A75T-1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900	CMOS		285		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7K325T-2FF900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS		500		1		1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	25475 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900		3.35 mm	31 mm	No		e0	1818 MHz		500		31 mm
XCKU115-2FLVA1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520			832		.95		0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
A3P1000-FGG256M	Microchip Technology	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V		CMOS		177	1000000	1.5			Grid Array, Low Profile	BGA256,16X16,40		1.425 V	1 mm	125 °C (257 °F)		1000000 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B256		1.7 mm	17 mm						177		17 mm
EP3C40F484C7N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS		331		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		331		23 mm
LIFCL-17-7BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V				48		1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	48	260 °C (500 °F)	14 mm
M1A3P1000-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
M1A3P1000-FGG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
M2GL050T-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V				267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	267	225 °C (437 °F)	23 mm
10CX150YU484E5G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	150000	Yes	.93 V	54770	TSMC		188		.9			Grid Array			.87 V		100 °C (212 °F)		54770 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484									188
EP2C35F484I8N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS		322		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm			2076 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	402.5 MHz	30 s	306	260 °C (500 °F)	23 mm
EP3C40F484C6N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS		331		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		331		23 mm
LFE2M20E-5FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2375			140		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	140	250 °C (482 °F)	17 mm
M2GL005-VFG256	Microchip Technology	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.56 mm	14 mm					30 s		260 °C (500 °F)	14 mm
XC3S50A-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS		144	50000	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	112	260 °C (500 °F)	17 mm
XC7A15T-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.05 V	1300					1			Grid Array			.95 V	1 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1					23 mm
XC7K160T-2FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS		285		1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XCAU20P-2SFVB784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	238437	Yes	.876 V	13625			228		0.85			Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		13625 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.32 mm	23 mm						228		23 mm
5CEFA5U19I7N	Intel	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS		238		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm						Bottom	S-PBGA-B484		1.9 mm	19 mm	No					238		19 mm
A3P1000-FGG256T	Microchip Technology	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	AEC-Q100	177	1000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	350 MHz	30 s	177	250 °C (482 °F)	17 mm
EP4CE115F29I7N	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	114480	Yes	1.25 V	7155			531		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm			7155 CLBS		Tin Silver Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e1	472.5 MHz		531		29 mm
LFXP2-8E-6MN132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS		86		1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.399 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	435 MHz	40 s	86	260 °C (500 °F)	8 mm
MPF100T-FCSG325E	Microchip Technology	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		170		1			Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
XC7K160T-L2FBG676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes	.93 V	12675	CMOS		400		.9		0.9,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	0.91 ns	12675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No	Also Operates at 1 V supply	e1		30 s	400	250 °C (482 °F)	27 mm
10CL016YU256C8G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963					1.2			Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
10M16SCU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000			320		3			Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)		1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
ICE40LP8K-CM225	Lattice Semiconductor	FPGA	Industrial	Ball	225	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS		178		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA225,15X15,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1 mm	7 mm	No		e1	133 MHz	30 s	178	260 °C (500 °F)	7 mm
LFD2NX-40-7BG196C	Lattice Semiconductor	FPGA	Other	Ball	196		Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		92		1						.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B196			12 mm						92		12 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.