Ball Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
M2S090-FCSG325I	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V			180		1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B325	3	1.16 mm	11 mm					40 s	180	250 °C (482 °F)	13.5 mm
XC7S25-1CSGA324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm			e1	1098 MHz		150		15 mm
10M02SCM153C8G	Intel	FPGA	Other	Ball	153	BGA	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246		3			Grid Array	BGA153,15X15,20		2.85 V	.5 mm	85 °C (185 °F)		125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm		Also Operates at 3.3 V nominal supply				246		8 mm
EP4CGX30CF23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		290		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		290		23 mm
M2GL005-VF256I	Microchip Technology	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256		1.56 mm	14 mm			e0					14 mm
XC6SLX75-3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	400		1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	400	250 °C (482 °F)	27 mm
XC6VLX760-1FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	1.05 V		CMOS	1200		1		1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1	1098 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
LCMXO3LF-9400C-6BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	1175				2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
10CL040YF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	2475				1.2			Grid Array			1.15 V	1 mm	100 °C (212 °F)		2475 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm								23 mm
LCMXO3LF-4300C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	4300	Yes	3.465 V	540		206		2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
XC7A200T-2SBG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285		1		1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.44 mm	19 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	19 mm
EP4CE22F17I7N	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	22320	Yes	1.25 V	1395		153		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm			1395 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz	30 s	153	260 °C (500 °F)	17 mm
LCMXO2-256ZE-1UMG64I	Lattice Semiconductor	FPGA		Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			44		1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
XC7A35T-3FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1412 MHz	30 s	250	260 °C (500 °F)	17 mm
ICE40HX8K-CB132	Lattice Semiconductor	FPGA	Industrial	Ball	132	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	95		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	7.3 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1 mm	8 mm	No		e1	133 MHz	30 s	95	260 °C (500 °F)	8 mm
XC3SD1800A-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	519	1800000	1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	4160 CLBS, 1800000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	250 MHz	30 s	409	260 °C (500 °F)	27 mm
LCMXO2-256ZE-1UMG64C	Lattice Semiconductor	FPGA	Other	Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			44		1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
M2S090-FCSG325	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V			180		1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B325	3	1.16 mm	11 mm					40 s	180	250 °C (482 °F)	13.5 mm
XCKU060-1FFVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	2760		624		.95		0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		2760 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	624	245 °C (473 °F)	40 mm
XC7A12T-1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150		1			Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		150		10 mm
XC7S75-1FGGA484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	76800	Yes	1.05 V	6000	HKMG	400		1			Grid Array	BGA484,22X22,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	6000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		400		23 mm
XC7A12T-L1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG	150		0.95			Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		150		10 mm
XC6SLX4-2CSG225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS	120		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	667 MHz	30 s	120	260 °C (500 °F)	13 mm
XC7S50-2FGGA484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1			Grid Array	BGA484,22X22,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1286 MHz		250		23 mm
10CL025YU256C8G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	1539				1.2			Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		1539 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
XC5VFX70T-1FFG1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	5600	CMOS	640		1		1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	5600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	640	245 °C (473 °F)	35 mm
XC7S15-1CPGA196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100		1			Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1098 MHz		100		8 mm
XCKU3P-1FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340		304		0.85			Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XC7A100T-3FGG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	300		1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1412 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7S25-1CSGA324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm			e1	1098 MHz		150		15 mm
EP3C55F484C8N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		55856 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		327		23 mm
M2S090-FCS325	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V			180		1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B325		1.16 mm	11 mm					30 s	180	240 °C (464 °F)	13.5 mm
XC3S200AN-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	195	200000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	160	260 °C (500 °F)	17 mm
XC7S15-2CPGA196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100		1			Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1286 MHz		100		8 mm
EP3C16F484I7N	Intel	FPGA	Industrial	Ball	484	BGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		15408 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		346		23 mm
M2S090-FCS325I	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V			180		1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	R-PBGA-B325		1.16 mm	11 mm					30 s	180	240 °C (464 °F)	13.5 mm
XCAU20P-1SFVB784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	238437	Yes	.876 V	13625		228		0.85			Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		13625 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.32 mm	23 mm						228		23 mm
M1A3P1000-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
XC6SLX75-2CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	310		1.2		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	310	260 °C (500 °F)	19 mm
XC7VX1140T-1FLG1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS	1100		1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	89000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.75 mm	45 mm	No		e1	1818 MHz		1100		45 mm
10M50DAF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			500		23 mm
EP4CE15F17I7N	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963		165		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm			963 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		165		17 mm
10M04SAU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246		3			Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)		250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				246		11 mm
LCMXO3LF-4300C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	540				2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
A3P1000-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e0	350 MHz				17 mm
5CEBA4F17I7N	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	49000	Yes	1.13 V		CMOS	128		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.07 V	1 mm						Bottom	S-PBGA-B256		1.55 mm	17 mm	No					128		17 mm
XCAU15P-2UBVA368I	Xilinx	FPGA		Ball	368	VFBGA	Rectangular	Plastic/Epoxy	170100	Yes	.876 V	9720		128		0.85			Grid Array, Very Thin Profile, Fine Pitch	BGA368,18X22,20		.825 V	.5 mm	100 °C (212 °F)		9720 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B368		.692 mm	9.5 mm						128		11.5 mm
XC7A50T-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	CMOS	250		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1286 MHz	30 s	250	250 °C (482 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.