Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
FPGA |
Pin/Peg |
896 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
1.575 V |
75264 |
CMOS |
3000000 |
1.2 |
Grid Array |
1.14 V |
1 mm |
75264 CLBS, 3000000 Gates |
Perpendicular |
S-CPGA-P896 |
6.75 mm |
31 mm |
31 mm |
|||||||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
559 |
HIPGA |
Square |
Ceramic, Metal-Sealed Cofired |
5184 |
No |
2.7 V |
5184 |
CMOS |
448 |
100000 |
2.5 |
2.5,3.3 V |
Grid Array, Heat Sink/Slug, Interstitial Pitch |
HSPGA559,43X43 |
Field Programmable Gate Arrays |
2.3 V |
2.54 mm |
85 °C (185 °F) |
1.3 ns |
5184 CLBS, 100000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P559 |
5.969 mm |
57.404 mm |
No |
Can also use 300000 gates |
225 MHz |
448 |
57.404 mm |
|||||||||
|
Xilinx |
FPGA |
Pin/Peg |
559 |
HIPGA |
Square |
Ceramic, Metal-Sealed Cofired |
5184 |
No |
2.7 V |
5184 |
CMOS |
448 |
100000 |
2.5 |
2.5,3.3 V |
Grid Array, Heat Sink/Slug, Interstitial Pitch |
HSPGA559,43X43 |
Field Programmable Gate Arrays |
2.3 V |
2.54 mm |
1.3 ns |
5184 CLBS, 100000 Gates |
Perpendicular |
S-CPGA-P559 |
5.969 mm |
57.404 mm |
No |
Can also use 300000 gates |
225 MHz |
448 |
57.404 mm |
||||||||||||
|
Xilinx |
FPGA |
Commercial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
64 |
No |
5.25 V |
64 |
CMOS |
64 |
2000 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
70 °C (158 °F) |
64 CLBS, 2000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P84 |
4.318 mm |
27.94 mm |
No |
MAX 64 I/OS; 256 flip-flops |
50 MHz |
64 |
27.94 mm |
||||||||||
|
Xilinx |
FPGA |
Military |
Pin/Peg |
132 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
224 |
No |
224 |
CMOS |
110 |
3500 |
5 |
5 V |
Grid Array |
PGA132,14X14 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
7 ns |
224 CLBS, 3500 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P132 |
3.9116 mm |
37.084 mm |
No |
688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA |
100 MHz |
110 |
37.084 mm |
|||||||||||
|
Xilinx |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
144 |
No |
144 |
CMOS |
MIL-STD-883 Class B |
74 |
2000 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
7 ns |
144 CLBS, 2000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
5.207 mm |
27.94 mm |
No |
480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA |
100 MHz |
74 |
27.94 mm |
||||||||||
|
Xilinx |
FPGA |
Military |
Pin/Peg |
156 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
466 |
No |
5.5 V |
196 |
CMOS |
MIL-PRF-38535 |
112 |
3000 |
5 |
5 V |
Grid Array |
PGA156,16X16 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
2.01 ns |
196 CLBS, 3000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P156 |
4.318 mm |
42.164 mm |
No |
Maximum usable gates = 9000 |
e3 |
125 MHz |
112 |
42.164 mm |
|||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
68 |
PGA |
Ceramic |
295 |
No |
CMOS |
57 |
5 |
5 V |
Grid Array |
PGA68(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Perpendicular |
No |
57 |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
133 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
684 |
No |
5.5 V |
684 |
CMOS |
MIL-STD-883 Class B |
104 |
4000 |
5 |
5 V |
Grid Array |
PGA133M,13X13 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
684 CLBS, 4000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P133 |
4.27 mm |
34.544 mm |
No |
55 MHz |
104 |
34.544 mm |
|||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.25 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
70 °C (158 °F) |
16.38 ns |
1232 CLBS, 8000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
48 MHz |
140 |
39.88 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
547 |
CMOS |
1200 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4.7 ns |
547 CLBS, 1200 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
4.318 mm |
27.94 mm |
No |
44 MHz |
27.94 mm |
|||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
4000 |
5 |
Grid Array |
4.5 V |
125 °C (257 °F) |
4000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
No |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
6.1 ns |
8000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P176 |
4.7498 mm |
39.878 mm |
No |
e0 |
41 MHz |
30 s |
225 °C (437 °F) |
39.878 mm |
|||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
207 |
PGA |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
CMOS |
Grid Array |
85 °C (185 °F) |
-40 °C (-40 °F) |
R-CPGA-P207 |
No |
MAX 168 I/OS |
|||||||||||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA176,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
17.55 ns |
1232 CLBS, 8000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
43 MHz |
140 |
39.88 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
144 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
125 °C (257 °F) |
8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P144 |
No |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
100 |
PGA |
Square |
Ceramic |
451 |
No |
CMOS |
83 |
5 |
5 V |
Grid Array |
PGA100(UNSPEC) |
Field Programmable Gate Arrays |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P100 |
No |
75 MHz |
83 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
547 |
No |
5.5 V |
547 |
CMOS |
38535Q/M;38534H;883B |
69 |
2000 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
16.092 ns |
547 CLBS, 2000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
5.21 mm |
27.94 mm |
No |
MAX 69 I/OS; 273 flip-flops |
69 |
27.94 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 Class B |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
50 MHz |
140 |
39.88 mm |
|||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
133 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
684 |
No |
5.25 V |
684 |
CMOS |
104 |
4000 |
5 |
5 V |
Grid Array |
PGA133M,13X13 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
70 °C (158 °F) |
684 CLBS, 4000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P133 |
4.27 mm |
34.544 mm |
No |
75 MHz |
104 |
34.544 mm |
||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
133 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
684 |
No |
5.5 V |
684 |
CMOS |
104 |
4000 |
5 |
5 V |
Grid Array |
PGA133M,13X13 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
684 CLBS, 4000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P133 |
4.27 mm |
34.544 mm |
No |
66 MHz |
104 |
34.544 mm |
||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
547 |
No |
CMOS |
69 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Perpendicular |
S-XPGA-P84 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
133 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
684 |
No |
5.5 V |
684 |
CMOS |
MIL-STD-883 |
104 |
4000 |
5 |
5 V |
Grid Array |
PGA133M,13X13 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
684 CLBS, 4000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P133 |
4.27 mm |
34.544 mm |
No |
50 MHz |
104 |
34.544 mm |
|||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.25 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA176,15X15 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
70 °C (158 °F) |
16.38 ns |
1232 CLBS, 8000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
48 MHz |
140 |
39.88 mm |
||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
133 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
CMOS |
Grid Array |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P133 |
4.27 mm |
34.544 mm |
No |
MAX 100 I/OS |
34.544 mm |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.25 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
70 °C (158 °F) |
1232 CLBS, 8000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
65 MHz |
140 |
39.88 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
295 |
No |
CMOS |
57 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Perpendicular |
S-XPGA-P84 |
No |
57 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
132 |
PGA |
Square |
Ceramic |
684 |
No |
CMOS |
104 |
5 |
5 V |
Grid Array |
PGA132,13X13 |
Field Programmable Gate Arrays |
2.54 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Perpendicular |
S-XPGA-P132 |
No |
55 MHz |
104 |
||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
133 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
CMOS |
Grid Array |
2.54 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P133 |
4.27 mm |
34.544 mm |
No |
MAX 100 I/OS |
34.544 mm |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 Class B |
8000 |
5 |
Grid Array, Heat Sink/Slug |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
e4 |
39 MHz |
39.88 mm |
|||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
132 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
684 |
No |
5.5 V |
684 |
CMOS |
38535Q/M;38534H;883B |
104 |
8000 |
5 |
5 V |
Grid Array |
PGA133M,13X13 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
6.1 ns |
684 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P132 |
4.318 mm |
34.544 mm |
No |
54 MHz |
104 |
34.544 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 |
8000 |
5 |
Grid Array, Heat Sink/Slug |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
e4 |
50 MHz |
39.88 mm |
|||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
177 |
PGA |
Square |
Ceramic |
1232 |
No |
CMOS |
140 |
5 |
5 V |
Grid Array |
HPGA177,15X15 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Perpendicular |
S-XPGA-P177 |
No |
39 MHz |
140 |
||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 |
8000 |
5 |
Grid Array, Heat Sink/Slug |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
e4 |
39 MHz |
39.88 mm |
|||||||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.25 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA176,15X15 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
70 °C (158 °F) |
1232 CLBS, 8000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
65 MHz |
140 |
39.88 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
547 |
CMOS |
1200 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4.7 ns |
547 CLBS, 1200 Gates |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P84 |
4.318 mm |
27.94 mm |
No |
e0 |
44 MHz |
30 s |
225 °C (437 °F) |
27.94 mm |
|||||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
68 |
PGA |
Ceramic |
295 |
No |
CMOS |
57 |
5 |
5 V |
Grid Array |
PGA68(UNSPEC) |
Field Programmable Gate Arrays |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
No |
57 |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
547 |
No |
5.5 V |
547 |
CMOS |
69 |
2000 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
19.332 ns |
547 CLBS, 2000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
5.21 mm |
27.94 mm |
No |
MAX 69 I/OS; 273 flip-flops |
69 |
27.94 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
547 |
No |
5.5 V |
547 |
CMOS |
38535Q/M;38534H;883B |
69 |
2000 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
19.332 ns |
547 CLBS, 2000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
5.21 mm |
27.94 mm |
No |
MAX 69 I/OS; 273 flip-flops |
69 |
27.94 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
132 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
684 |
No |
5.5 V |
684 |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
6.1 ns |
684 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P132 |
4.318 mm |
34.544 mm |
No |
e0 |
54 MHz |
30 s |
225 °C (437 °F) |
34.544 mm |
||||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
547 |
No |
CMOS |
69 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P84 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
132 |
PGA |
Square |
Ceramic |
684 |
No |
CMOS |
104 |
5 |
5 V |
Grid Array |
PGA132,13X13 |
Field Programmable Gate Arrays |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P132 |
No |
66 MHz |
104 |
||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
1232 CLBS, 8000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
60 MHz |
140 |
39.88 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
125 °C (257 °F) |
8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
No |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
133 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
684 |
No |
5.25 V |
684 |
CMOS |
104 |
4000 |
5 |
5 V |
Grid Array |
PGA133M,13X13 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
70 °C (158 °F) |
14 ns |
684 CLBS, 4000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P133 |
4.27 mm |
34.544 mm |
No |
MAX 92 I/OS; 565 flip-flops |
66 MHz |
104 |
34.544 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
5.2 ns |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P176 |
4.7498 mm |
39.878 mm |
No |
60 MHz |
39.878 mm |
|||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 Class B |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
18.72 ns |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
39 MHz |
140 |
39.88 mm |
|||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
120 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
6000 |
5 |
Grid Array |
4.5 V |
125 °C (257 °F) |
6000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P120 |
No |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.