Pin/Peg Field Programmable Gate Arrays (FPGA) 1,265

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC4025E-2PG299C

Xilinx

FPGA

Other

Pin/Peg

299

HPGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

5.25 V

1024

CMOS

256

15000

5

5 V

Grid Array, Heat Sink/Slug

PGA299,20X20

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

1.6 ns

1024 CLBS, 15000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

Max usable 25000 Logic gates

125 MHz

256

52.324 mm

XC3090-100PP175CSPC0109

Xilinx

FPGA

Commercial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

No

5.25 V

320

CMOS

9000

5

Grid Array

4.75 V

2.54 mm

70 °C (158 °F)

7 ns

320 CLBS, 9000 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P175

3.937 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

100 MHz

42.164 mm

XC3064-70PG132MSPC0107

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

No

224

CMOS

3500

5

Grid Array

2.54 mm

125 °C (257 °F)

9 ns

224 CLBS, 3500 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P132

3.9116 mm

37.084 mm

No

688 flip-flops; typical gates = 3500-4500

70 MHz

37.084 mm

XC4044XL-3PG411I

Xilinx

FPGA

Pin/Peg

411

HPGA

Square

Ceramic, Metal-Sealed Cofired

1600

No

3.6 V

1600

CMOS

320

27000

3.3

3.3 V

Grid Array, Heat Sink/Slug

SPGA411,39X39

Field Programmable Gate Arrays

3 V

2.54 mm

1.6 ns

1600 CLBS, 27000 Gates

Perpendicular

S-CPGA-P411

5.969 mm

52.324 mm

No

Max usable 44000 Logic gates

166 MHz

320

52.324 mm

XC3120-3PG84C

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.25 V

64

CMOS

64

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

2.7 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1000-1500

270 MHz

64

27.94 mm

XC3042-70PP132I

Xilinx

FPGA

Industrial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

144

No

5.5 V

144

CMOS

96

4200

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

9 ns

144 CLBS, 4200 Gates

-40 °C (-40 °F)

Perpendicular

S-PPGA-P132

1

4.191 mm

37.084 mm

No

MAX 96 I/OS; 480 flip-flops

70 MHz

96

37.084 mm

XC4062XL-09PG475I

Xilinx

FPGA

Pin/Peg

475

PGA

Square

Ceramic

2304

No

CMOS

384

3.3

3.3 V

Grid Array

SPGA475,41X41

Field Programmable Gate Arrays

1.27 mm

Perpendicular

S-XPGA-P475

No

e0

217 MHz

384

XC3142A-4PG132B

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

No

144

CMOS

MIL-STD-883 Class B

2000

5

Grid Array

2.54 mm

125 °C (257 °F)

3.3 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

3000 Logic gates can also be used

37.084 mm

XC4025E-4PG299M

Xilinx

FPGA

Military

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

5.5 V

1024

CMOS

256

15000

5

5 V

Grid Array

PGA299,20X20

Field Programmable Gate Arrays

4.5 V

2.54 mm

125 °C (257 °F)

3.9 ns

1024 CLBS, 15000 Gates

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

Typical gates = 15000-45000

e0

111 MHz

256

52.324 mm

XC6264-2PG299C

Xilinx

FPGA

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

16384

No

5.25 V

16384

CMOS

512

64000

5

5 V

Grid Array

PGA299,20X20

Field Programmable Gate Arrays

4.75 V

2.54 mm

16384 CLBS, 64000 Gates

Matte Tin

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

16384 flip-flops; typical gates = 64000-100000

e3

111 MHz

512

52.324 mm

XC3064-70PP132C

Xilinx

FPGA

Other

Pin/Peg

132

PGA

Square

Plastic/Epoxy

224

No

5.25 V

224

CMOS

110

3500

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

9 ns

224 CLBS, 3500 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-PPGA-P132

1

3.7338 mm

37.084 mm

No

688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA

e0

70 MHz

110

37.084 mm

XC3064-70PP132CSPC0108

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

No

5.25 V

224

CMOS

6400

5

Grid Array

4.75 V

2.54 mm

70 °C (158 °F)

9 ns

224 CLBS, 6400 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P132

4.191 mm

37.084 mm

No

MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C

70 MHz

37.084 mm

XC3195A-5PP175I

Xilinx

FPGA

Pin/Peg

175

PGA

Square

Plastic/Epoxy

484

No

5.5 V

484

CMOS

144

6500

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

4.1 ns

484 CLBS, 6500 Gates

Perpendicular

S-PPGA-P175

1

4.191 mm

42.164 mm

No

Typical gates = 6500-7500

188 MHz

144

42.164 mm

XC3042-100PP132C

Xilinx

FPGA

Other

Pin/Peg

132

PGA

Square

Plastic/Epoxy

144

No

5.25 V

144

CMOS

96

2000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

7 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-PPGA-P132

1

3.7338 mm

37.084 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

e0

100 MHz

96

37.084 mm

5962-9752201QXX

Xilinx

FPGA

Military

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

196

MIL-PRF-38535 Class Q

3000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

3.9 ns

196 CLBS, 3000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

Typical gates = 3000-9000

42.164 mm

XC4052XL-2PG411I

Xilinx

FPGA

Pin/Peg

411

HPGA

Square

Ceramic, Metal-Sealed Cofired

1936

No

3.6 V

1936

CMOS

352

33000

3.3

3.3 V

Grid Array, Heat Sink/Slug

SPGA411,39X39

Field Programmable Gate Arrays

3 V

2.54 mm

1.5 ns

1936 CLBS, 33000 Gates

Perpendicular

S-CPGA-P411

5.969 mm

52.324 mm

No

Max usable 52000 Logic gates

179 MHz

352

52.324 mm

XC4003E-3PG120I

Xilinx

FPGA

Pin/Peg

120

HPGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.5 V

100

CMOS

80

2000

5

5 V

Grid Array, Heat Sink/Slug

PGA120,13X13

Field Programmable Gate Arrays

4.5 V

2.54 mm

2 ns

100 CLBS, 2000 Gates

Perpendicular

S-CPGA-P120

4.318 mm

34.544 mm

No

Max usable 3000 Logic gates

125 MHz

80

34.544 mm

XC4005-6PG156M

Xilinx

FPGA

Military

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

196

No

5.5 V

196

CMOS

112

4000

5

5 V

Grid Array

PGA156,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

125 °C (257 °F)

6 ns

196 CLBS, 4000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P156

3.683 mm

42.164 mm

No

616 flip-flops; typical gates = 4000-5000

e3

90.9 MHz

112

42.164 mm

XC3042-50PP132I

Xilinx

FPGA

Industrial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

144

No

5.5 V

144

CMOS

96

4200

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

144 CLBS, 4200 Gates

-40 °C (-40 °F)

Perpendicular

S-PPGA-P132

1

4.191 mm

37.084 mm

No

MAX 96 I/OS; 480 flip-flops

50 MHz

96

37.084 mm

5962-01-353-0687

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic

100

No

CMOS

38535Q/M;38534H;883B

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Perpendicular

S-XPGA-P84

No

50 MHz

74

XC4013-5PG223I

Xilinx

FPGA

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

576

CMOS

10000

5

Grid Array

4.5 V

2.54 mm

4.5 ns

576 CLBS, 10000 Gates

Perpendicular

S-CPGA-P223

4.064 mm

47.244 mm

No

1536 flip-flops; typical gates = 10000-13000

47.244 mm

XC4003-6PG120B

Xilinx

FPGA

Military

Pin/Peg

120

PGA

Square

Ceramic

238

No

CMOS

38535Q/M;38534H;883B

80

5

5 V

Grid Array

PGA120,13X13

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Perpendicular

S-XPGA-P120

No

90.9 MHz

80

5962-01-360-2955

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic

144

No

CMOS

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Perpendicular

S-XPGA-P84

No

70 MHz

74

XC3042-70PP132C

Xilinx

FPGA

Other

Pin/Peg

132

PGA

Square

Plastic/Epoxy

144

No

5.25 V

144

CMOS

96

2000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

9 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-PPGA-P132

1

3.7338 mm

37.084 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

e0

70 MHz

96

37.084 mm

XC5206L-5PG191C

Xilinx

FPGA

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

No

3.6 V

196

CMOS

6000

3.3

Grid Array

3 V

2.54 mm

196 CLBS, 6000 Gates

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

Typical gates = 6000-10000

47.244 mm

XC3020-125PG84CSPC0107

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

64

CMOS

1000

5

Grid Array

4.75 V

2.54 mm

85 °C (185 °F)

5.5 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

256 flip-flops; typical gates = 1000-1500

e3

125 MHz

27.94 mm

XC3090-50PG175CSPC0107

Xilinx

FPGA

Commercial

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

320

CMOS

9000

5

Grid Array

4.75 V

2.54 mm

70 °C (158 °F)

320 CLBS, 9000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

3.5052 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

50 MHz

42.164 mm

XC3142A-4PG84B

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

144

CMOS

MIL-STD-883 Class B

2000

5

Grid Array

2.54 mm

125 °C (257 °F)

3.3 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

3000 Logic gates can also be used

27.94 mm

5962-9752301QXC

Xilinx

FPGA

Military

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

950

No

5.5 V

400

CMOS

MIL-PRF-38535 Class Q

160

7000

5

5 V

Grid Array

PGA191M,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

125 °C (257 °F)

3.9 ns

400 CLBS, 7000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

Typical gates = 7000-20000

e4

111 MHz

160

47.244 mm

XC4005-6PG156C

Xilinx

FPGA

Other

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

196

No

5.25 V

196

CMOS

112

4000

5

5 V

Grid Array

PGA156,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

6 ns

196 CLBS, 4000 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P156

3.683 mm

42.164 mm

No

616 flip-flops; typical gates = 4000-5000

e3

90.9 MHz

112

42.164 mm

XC4003E-2PGG120M

Xilinx

FPGA

Military

Pin/Peg

120

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

100

CMOS

2000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

100 CLBS, 2000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P120

4.318 mm

34.544 mm

No

e3

125 MHz

34.544 mm

XC3042-50PG84MSPC0107

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

144

CMOS

2000

5

Grid Array

2.54 mm

125 °C (257 °F)

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

480 flip-flops; typical gates = 2000-3000

50 MHz

27.94 mm

XC4044EX-3PG411C

Xilinx

FPGA

Pin/Peg

411

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

1600

CMOS

27000

5

Grid Array, Heat Sink/Slug, Interstitial Pitch

4.75 V

2.54 mm

85 °C (185 °F)

1600 CLBS, 27000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P411

4.318 mm

52.324 mm

No

Typical gates = 27000-80000

e0

125 MHz

52.324 mm

5962-9851101QXC

Xilinx

FPGA

Military

Pin/Peg

475

HIPGA

Square

Ceramic, Metal-Sealed Cofired

5472

No

3.6 V

2304

CMOS

MIL-PRF-38535 Class Q

384

40000

3.3

3.3 V

Grid Array, Heat Sink/Slug, Interstitial Pitch

SPGA475,41X41

Field Programmable Gate Arrays

3 V

2.54 mm

125 °C (257 °F)

1.6 ns

2304 CLBS, 40000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P475

5.969 mm

54.864 mm

No

e4

166 MHz

384

54.864 mm

XC4008-10PG191C

Xilinx

FPGA

Commercial

Pin/Peg

PGA

Ceramic

770

No

CMOS

144

5

5 V

Grid Array

PGA(UNSPEC)

Field Programmable Gate Arrays

70 °C (158 °F)

0 °C (32 °F)

Perpendicular

No

110 MHz

144

XC4013-10PG223B

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

576

MIL-STD-883 Class B

13000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

576 CLBS, 13000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

47.244 mm

XC3142-3PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Plastic/Epoxy

144

No

CMOS

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Perpendicular

S-PPGA-P84

No

74

XC3030-50PG84B

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic

100

No

CMOS

38535Q/M;38534H;883B

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Perpendicular

S-XPGA-P84

No

50 MHz

74

XC4028XL-09PG299I

Xilinx

FPGA

Pin/Peg

299

PGA

Square

Ceramic

1024

No

CMOS

256

3.3

3.3 V

Grid Array

PGA299,20X20

Field Programmable Gate Arrays

2.54 mm

Perpendicular

S-XPGA-P299

No

217 MHz

256

XC4020E-4PG223C

Xilinx

FPGA

Other

Pin/Peg

223

HPGA

Square

Ceramic, Metal-Sealed Cofired

784

No

5.25 V

784

CMOS

224

13000

5

5 V

Grid Array, Heat Sink/Slug

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

2.7 ns

784 CLBS, 13000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

Max usable 20000 Logic gates

e0

111 MHz

224

47.244 mm

XC4028XL-09PG299C

Xilinx

FPGA

Other

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

3.6 V

1024

CMOS

256

18000

3.3

3.3 V

Grid Array

PGA299,20X20

Field Programmable Gate Arrays

3 V

2.54 mm

85 °C (185 °F)

1.2 ns

1024 CLBS, 18000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

Typical gates = 18000-50000

217 MHz

256

52.324 mm

XC4005H-4PG223C

Xilinx

FPGA

Commercial

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

466

No

5.25 V

196

CMOS

190

4000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

4 ns

196 CLBS, 4000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

MAX 192 I/OS; 392 flip-flops; typical gates = 4000 - 5000

133.3 MHz

190

47.244 mm

XC3164A1PG132C

Xilinx

FPGA

Other

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

224

No

5.25 V

224

CMOS

110

3500

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.25 V

2.54 mm

85 °C (185 °F)

1.75 ns

224 CLBS, 3500 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

323 MHz

110

37.084 mm

5962-9752501QXX

Xilinx

FPGA

Military

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

1024

MIL-PRF-38535 Class Q

15000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

3.9 ns

1024 CLBS, 15000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

Typical gates = 15000-45000

52.324 mm

XC3130-4PG84C

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

2000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

3.3 ns

100 CLBS, 2000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700

230 MHz

74

27.94 mm

XC3090-70PG175ISPC0109

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

320

CMOS

9000

5

Grid Array

4.5 V

2.54 mm

85 °C (185 °F)

9 ns

320 CLBS, 9000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P175

3.5052 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

70 MHz

42.164 mm

XC3020-100PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.5 V

64

CMOS

64

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

7 ns

64 CLBS, 1000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA

100 MHz

64

27.94 mm

XC3090A-7PP175I

Xilinx

FPGA

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

320

No

5.5 V

320

CMOS

144

5000

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

5.1 ns

320 CLBS, 5000 Gates

Tin Lead

Perpendicular

S-PPGA-P175

4.191 mm

42.164 mm

No

Max usable 6000 Logic gates

e0

113 MHz

144

42.164 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.