Pin/Peg Field Programmable Gate Arrays (FPGA) 1,265

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC2018-33PG84C

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic

100

No

CMOS

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Perpendicular

S-XPGA-P84

No

33 MHz

74

XC3120-4PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.5 V

64

CMOS

64

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

3.3 ns

64 CLBS, 1000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1000-1500

227 MHz

64

27.94 mm

XC3042-100PG132B

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

144

CMOS

MIL-STD-883 Class B

96

2000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

7 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

100 MHz

96

37.084 mm

XC3142-3PG84C

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.25 V

144

CMOS

74

3000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

2.7 ns

144 CLBS, 3000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700

270 MHz

74

27.94 mm

5962-9473001MXX

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

MIL-STD-883

5

Grid Array

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

e4

47.244 mm

XC2064-100PG68I

Xilinx

FPGA

Industrial

Pin/Peg

68

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.5 V

64

CMOS

58

600

5

5 V

Grid Array

PGA68,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

8 ns

64 CLBS, 600 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P68

4.064 mm

27.94 mm

No

122 flip-flops; typical gates = 600-1000

100 MHz

58

27.94 mm

XC3090-50PG175MSPC0109

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

320

CMOS

9000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

320 CLBS, 9000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P175

3.5052 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

50 MHz

42.164 mm

XC3120-5PG84C

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.25 V

64

CMOS

64

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

4.1 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1000-1500

188 MHz

64

27.94 mm

XC2018-130PG84C

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

5.5 ns

100 CLBS, 1000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

174 flip-flops; typical gates = 1000-1500

130 MHz

74

27.94 mm

XC3030-70PG84CSPC0107

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

100

CMOS

1500

5

Grid Array

4.75 V

2.54 mm

85 °C (185 °F)

9 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

360 flip-flops; typical gates = 1500-2000

e3

70 MHz

27.94 mm

XC3020-70PG84B

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

64

CMOS

MIL-STD-883 Class B

64

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

9 ns

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA

70 MHz

64

27.94 mm

XC6216-2PG299C

Xilinx

FPGA

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

4096

No

5.25 V

4096

CMOS

256

16000

5

5 V

Grid Array

PGA299,20X20

Field Programmable Gate Arrays

4.75 V

2.54 mm

4096 CLBS, 16000 Gates

Matte Tin

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

Typical gates = 16000-24000

e3

111 MHz

256

52.324 mm

XC3195-5PG223C

Xilinx

FPGA

Commercial

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

484

No

5.25 V

484

CMOS

176

6500

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

4.1 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000

190 MHz

176

47.244 mm

XC4062XL-3PG475M

Xilinx

FPGA

Military

Pin/Peg

475

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

3.6 V

2304

CMOS

40000

3.3

Grid Array, Heat Sink/Slug, Interstitial Pitch

3 V

2.54 mm

125 °C (257 °F)

2304 CLBS, 40000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P475

5.334 mm

54.864 mm

No

Can also use 130000 gates

54.864 mm

XC3042A-7PP132I

Xilinx

FPGA

Industrial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

144

No

5.5 V

144

CMOS

96

2000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

5.1 ns

144 CLBS, 2000 Gates

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-PPGA-P132

1

4.191 mm

37.084 mm

No

Typical gates = 2000-3000

e0

113 MHz

96

37.084 mm

XC4020-5PG299C

Xilinx

FPGA

Other

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

1862

No

5.25 V

784

CMOS

256

16000

5

5 V

Grid Array

PGA299,20X20

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

4.5 ns

784 CLBS, 16000 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P299

4.2418 mm

52.324 mm

No

2016 flip-flops; typical gates = 16000-20000

e3

133.3 MHz

256

52.324 mm

XC4010E-4PG225I

Xilinx

FPGA

Pin/Peg

225

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

400

7000

5

Grid Array

4.5 V

2.7 ns

400 CLBS, 7000 Gates

Matte Tin

Perpendicular

S-CPGA-P225

No

Can also use 20000 gates

e3

111 MHz

XC4005-10PG156B

Xilinx

FPGA

Military

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

196

CMOS

MIL-STD-883 Class B

4000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

196 CLBS, 4000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

616 flip-flops; typical gates = 4000-5000

42.164 mm

5962-8863803XX

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

CMOS

MIL-STD-883

1800

5

Grid Array

4.5 V

125 °C (257 °F)

1800 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

No

5962-8863802MXC

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

MIL-STD-883

Grid Array

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

e4

27.94 mm

XC3090A-6PG175C

Xilinx

FPGA

Other

Pin/Peg

175

HPGA

Square

Ceramic, Metal-Sealed Cofired

320

No

5.25 V

320

CMOS

144

5000

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

4.1 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

Max usable 6000 Logic gates

135 MHz

144

42.164 mm

XC4008E-1PG191C

Xilinx

FPGA

Other

Pin/Peg

191

HPGA

Square

Ceramic, Metal-Sealed Cofired

324

No

5.25 V

324

CMOS

144

6000

5

5 V

Grid Array, Heat Sink/Slug

PGA191M,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

1.3 ns

324 CLBS, 6000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

Max usable 8000 Logic gates

166 MHz

144

47.244 mm

XC3042-50PG84ISPC0107

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

144

CMOS

4200

5

Grid Array

4.5 V

2.54 mm

85 °C (185 °F)

144 CLBS, 4200 Gates

-40 °C (-40 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 74 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C

e3

50 MHz

27.94 mm

XC4020-5PG223I

Xilinx

FPGA

Industrial

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

784

No

5.5 V

784

CMOS

224

16000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

4.5 ns

784 CLBS, 16000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

2016 flip-flops; typical gates = 16000-20000

133.3 MHz

224

47.244 mm

XC4020E-3PG223I

Xilinx

FPGA

Pin/Peg

223

HPGA

Square

Ceramic, Metal-Sealed Cofired

784

No

5.5 V

784

CMOS

224

13000

5

5 V

Grid Array, Heat Sink/Slug

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

2 ns

784 CLBS, 13000 Gates

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

Max usable 20000 Logic gates

125 MHz

224

47.244 mm

XC5406-4PG191C

Xilinx

FPGA

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

5

Grid Array

2.54 mm

Perpendicular

S-CPGA-P191

4.064 mm

47.244 mm

No

47.244 mm

XC3090-70PG175C

Xilinx

FPGA

Other

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

320

No

5.25 V

320

CMOS

144

5000

5

5 V

Grid Array

PGA176,16X16MOD

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

9 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

70 MHz

144

42.164 mm

XC3190A-09PP175C

Xilinx

FPGA

Other

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

320

No

5.25 V

320

CMOS

144

5000

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

1.5 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P175

4.191 mm

42.164 mm

No

Max usable 6000 Logic gates

370 MHz

144

42.164 mm

XC3164A-2PP132I

Xilinx

FPGA

Pin/Peg

132

PGA

Square

Plastic/Epoxy

224

No

5.5 V

224

CMOS

110

3500

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.5 V

2.54 mm

2.2 ns

224 CLBS, 3500 Gates

Perpendicular

S-PPGA-P132

1

4.191 mm

37.084 mm

No

Typical gates = 3500-4500

323 MHz

110

37.084 mm

XC4008E-4PG191C

Xilinx

FPGA

Other

Pin/Peg

191

HPGA

Square

Ceramic, Metal-Sealed Cofired

324

No

5.25 V

324

CMOS

144

6000

5

5 V

Grid Array, Heat Sink/Slug

PGA191M,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

2.7 ns

324 CLBS, 6000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

Max usable 8000 Logic gates

111 MHz

144

47.244 mm

XC3190-5PG175C

Xilinx

FPGA

Commercial

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

320

No

5.25 V

320

CMOS

144

5000

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

4.1 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500

190 MHz

144

42.164 mm

XC5204-4PG156I

Xilinx

FPGA

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

120

No

5.5 V

120

CMOS

124

4000

5

5 V

Grid Array

PGA156,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

3.8 ns

120 CLBS, 4000 Gates

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

Typical gates = 4000-6000

83 MHz

124

42.164 mm

XC5210-3PG223I

Xilinx

FPGA

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

324

No

5.5 V

324

CMOS

196

10000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

3 ns

324 CLBS, 10000 Gates

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

Typical gates = 10000-16000

83 MHz

196

47.244 mm

XC4013E-1PGG223M

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

576

CMOS

10000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

e3

166 MHz

47.244 mm

XC3020-50PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.5 V

64

CMOS

64

2000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

64 CLBS, 2000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 64 I/OS; 256 flip-flops

50 MHz

64

27.94 mm

XC6209-2PG299I

Xilinx

FPGA

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

2304

No

5.5 V

2304

CMOS

9000

5

Grid Array

4.5 V

2.54 mm

100 °C (212 °F)

3 ns

2304 CLBS, 9000 Gates

-40 °C (-40 °F)

Matte Tin

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

2304 flip-flops; typical gates = 9000-13000

e3

111 MHz

52.324 mm

XC3164-3PP132I

Xilinx

FPGA

Industrial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

224

No

CMOS

110

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Perpendicular

S-PPGA-P132

No

110

XC4010E-4PG225C

Xilinx

FPGA

Other

Pin/Peg

225

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

400

7000

5

Grid Array

4.75 V

85 °C (185 °F)

2.7 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P225

No

Can also use 20000 gates

e3

111 MHz

XC4008E-3PG191I

Xilinx

FPGA

Pin/Peg

191

HPGA

Square

Ceramic, Metal-Sealed Cofired

324

No

5.5 V

324

CMOS

144

6000

5

5 V

Grid Array, Heat Sink/Slug

PGA191M,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

2 ns

324 CLBS, 6000 Gates

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

Max usable 8000 Logic gates

125 MHz

144

47.244 mm

XH4052XLPG411I

Xilinx

FPGA

Pin/Peg

411

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

3.3

Grid Array, Heat Sink/Slug, Interstitial Pitch

2.54 mm

Matte Tin

Perpendicular

S-CPGA-P411

5.334 mm

52.324 mm

No

e3

52.324 mm

XC4003E-2PG120M

Xilinx

FPGA

Military

Pin/Peg

120

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.5 V

100

CMOS

80

2000

5

5 V

Grid Array

PGA120,13X13

Field Programmable Gate Arrays

4.5 V

2.54 mm

125 °C (257 °F)

100 CLBS, 2000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P120

4.318 mm

34.544 mm

No

125 MHz

80

34.544 mm

XC3020-50PG84MSPC0107

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

64

CMOS

1000

5

Grid Array

2.54 mm

125 °C (257 °F)

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

256 flip-flops; typical gates = 1000-1500

50 MHz

27.94 mm

XC4062XL-08CPG475C

Xilinx

FPGA

Other

Pin/Peg

475

HPGA

Square

Ceramic, Metal-Sealed Cofired

5472

No

3.6 V

2304

CMOS

384

40000

3.3

3.3 V

Grid Array, Heat Sink/Slug

SPGA475,41X41

Field Programmable Gate Arrays

3 V

2.54 mm

85 °C (185 °F)

1.1 ns

2304 CLBS, 40000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P475

5.969 mm

54.864 mm

No

Max usable 62000 Logic gates

238 MHz

384

54.864 mm

XC3042-100PP132CSPC0107

Xilinx

FPGA

Other

Pin/Peg

132

PGA

Square

Plastic/Epoxy

No

5.25 V

144

CMOS

2000

5

Grid Array

4.75 V

2.54 mm

85 °C (185 °F)

7 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P132

3.7338 mm

37.084 mm

No

480 flip-flops; typical gates = 2000-3000

100 MHz

37.084 mm

XC4008-6PG191I

Xilinx

FPGA

Industrial

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

770

No

5.5 V

324

CMOS

144

6500

5

5 V

Grid Array

PGA191M,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

6 ns

324 CLBS, 6500 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P191

4.064 mm

47.244 mm

No

936 flip-flops; typical gates = 6500-8000

90.9 MHz

144

47.244 mm

5962-9957501QXX

Xilinx

FPGA

Military

Pin/Peg

475

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

3.6 V

3136

CMOS

MIL-PRF-38535 Class Q

55000

3.3

Grid Array, Heat Sink/Slug, Interstitial Pitch

3 V

2.54 mm

125 °C (257 °F)

1.3 ns

3136 CLBS, 55000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P475

5.969 mm

54.864 mm

No

200 MHz

54.864 mm

5962-9230502MXX

Xilinx

FPGA

Military

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

No

400

CMOS

MIL-STD-883

8000

5

Grid Array

2.54 mm

125 °C (257 °F)

6 ns

400 CLBS, 8000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

e4

47.244 mm

XC3142-4PG132C

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.25 V

144

CMOS

96

3000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

3.3 ns

144 CLBS, 3000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P132

3.9116 mm

37.084 mm

No

MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700

230 MHz

96

37.084 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.