Pin/Peg Field Programmable Gate Arrays (FPGA) 1,265

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3195-5PG175M

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

484

No

484

CMOS

144

6500

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

4.1 ns

484 CLBS, 6500 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000

190 MHz

144

42.164 mm

5962-8994801MXX

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

64

CMOS

1000

5

Grid Array

2.54 mm

125 °C (257 °F)

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

27.94 mm

XC40150XV-9PG559I

Xilinx

FPGA

Pin/Peg

559

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

2.7 V

5184

CMOS

100000

2.5

Grid Array, Heat Sink/Slug, Interstitial Pitch

2.3 V

2.54 mm

1.2 ns

5184 CLBS, 100000 Gates

Perpendicular

S-CPGA-P559

5.334 mm

57.404 mm

No

188 MHz

57.404 mm

XH4036XLPG411I

Xilinx

FPGA

Pin/Peg

411

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

3.3

Grid Array, Heat Sink/Slug, Interstitial Pitch

2.54 mm

Matte Tin

Perpendicular

S-CPGA-P411

5.334 mm

52.324 mm

No

e3

52.324 mm

XC3020-50PG84M

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

64

CMOS

64

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA

50 MHz

64

27.94 mm

5962-8982301MXC

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

320

No

320

CMOS

MIL-STD-883

144

9000

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

320 CLBS, 9000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

e4

50 MHz

144

42.164 mm

XC4085XL-09PG559C

Xilinx

FPGA

Other

Pin/Peg

559

HIPGA

Square

Ceramic, Metal-Sealed Cofired

3136

No

3.6 V

3136

CMOS

448

55000

3.3

3.3 V

Grid Array, Heat Sink/Slug, Interstitial Pitch

HSPGA559,43X43

Field Programmable Gate Arrays

3 V

2.54 mm

85 °C (185 °F)

1.2 ns

3136 CLBS, 55000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P559

5.969 mm

57.404 mm

No

Typical gates = 55000-180000

217 MHz

448

57.404 mm

XC3142-4PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.5 V

144

CMOS

74

3000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

3.3 ns

144 CLBS, 3000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700

230 MHz

74

27.94 mm

XC3030-125PG84CSPC0104

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

100

CMOS

3000

5

Grid Array

4.75 V

2.54 mm

70 °C (158 °F)

5.5 ns

100 CLBS, 3000 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C

e3

125 MHz

27.94 mm

XC5215-6PG299I

Xilinx

FPGA

Pin/Peg

299

HPGA

Square

Ceramic, Metal-Sealed Cofired

484

No

5.5 V

484

CMOS

244

15000

5

5 V

Grid Array, Heat Sink/Slug

PGA299,20X20

Field Programmable Gate Arrays

4.5 V

2.54 mm

5.6 ns

484 CLBS, 15000 Gates

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

MAX available 23000 Logic gates

83 MHz

244

52.324 mm

5962-8994801XX

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Rectangular

Ceramic, Metal-Sealed Cofired

No

5.5 V

64

CMOS

MIL-STD-883

2000

5

Grid Array

4.5 V

125 °C (257 °F)

14 ns

64 CLBS, 2000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

R-CPGA-P84

No

e4

16 MHz

XC4010E-3PG225I

Xilinx

FPGA

Pin/Peg

225

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

400

7000

5

Grid Array

4.5 V

2 ns

400 CLBS, 7000 Gates

Matte Tin

Perpendicular

S-CPGA-P225

No

Can also use 20000 gates

e3

125 MHz

XC4006E-2PG156C

Xilinx

FPGA

Other

Pin/Peg

156

HPGA

Square

Ceramic, Metal-Sealed Cofired

608

No

5.25 V

256

CMOS

125

4000

5

5 V

Grid Array, Heat Sink/Slug

PGA156,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

1.6 ns

256 CLBS, 4000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

Max usable 6000 Logic gates

125 MHz

125

42.164 mm

XC40150XV-8PG559I

Xilinx

FPGA

Pin/Peg

559

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

2.7 V

5184

CMOS

100000

2.5

Grid Array, Heat Sink/Slug, Interstitial Pitch

2.3 V

2.54 mm

1.1 ns

5184 CLBS, 100000 Gates

Perpendicular

S-CPGA-P559

5.334 mm

57.404 mm

No

217 MHz

57.404 mm

XC4003E-1PG120I

Xilinx

FPGA

Pin/Peg

120

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.5 V

100

CMOS

80

2000

5

5 V

Grid Array

PGA120,13X13

Field Programmable Gate Arrays

4.5 V

2.54 mm

100 CLBS, 2000 Gates

Perpendicular

S-CPGA-P120

4.318 mm

34.544 mm

No

e0

166 MHz

80

34.544 mm

XC5202-4PG156I

Xilinx

FPGA

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.5 V

64

CMOS

84

2000

5

5 V

Grid Array

PGA156,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

3.8 ns

64 CLBS, 2000 Gates

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

Typical gates = 2000-3000

83 MHz

84

42.164 mm

XC3090-70PG175CSPC0107

Xilinx

FPGA

Other

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

320

CMOS

5000

5

Grid Array

4.75 V

2.54 mm

85 °C (185 °F)

9 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000

70 MHz

42.164 mm

XC4006E-4PG156C

Xilinx

FPGA

Other

Pin/Peg

156

HPGA

Square

Ceramic, Metal-Sealed Cofired

608

No

5.25 V

256

CMOS

125

4000

5

5 V

Grid Array, Heat Sink/Slug

PGA156,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

2.7 ns

256 CLBS, 4000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

Max usable 6000 Logic gates

111 MHz

125

42.164 mm

XC3164-3PP132C

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

224

No

5.25 V

224

CMOS

110

4000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

2.7 ns

224 CLBS, 4000 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P132

1

3.7338 mm

37.084 mm

No

MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500

270 MHz

110

37.084 mm

XC3042A-7PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

HPGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.5 V

144

CMOS

74

2000

5

5 V

Grid Array, Heat Sink/Slug

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

5.1 ns

144 CLBS, 2000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Max usable 3000 Logic gates

113 MHz

74

27.94 mm

XC3090-70PG175MSPC0107

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

320

CMOS

5000

5

Grid Array

2.54 mm

125 °C (257 °F)

9 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000

70 MHz

42.164 mm

XC5215-4PQ299I

Xilinx

FPGA

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

484

15000

5

Grid Array

4.5 V

2.54 mm

3.8 ns

484 CLBS, 15000 Gates

Tin Lead

Perpendicular

S-CPGA-P299

4.2418 mm

52.324 mm

No

23000 Logic gates can also be used

e0

48 MHz

52.324 mm

XC3195-3PP175I

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

484

No

CMOS

144

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Perpendicular

S-PPGA-P175

No

144

XC3030-70PG84M

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

100

CMOS

74

1500

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

9 ns

100 CLBS, 1500 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA

70 MHz

74

27.94 mm

XC4013-6PG223B

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

576

No

5.5 V

576

CMOS

MIL-STD-883 Class B

192

10000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

125 °C (257 °F)

6 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

1536 flip-flops; typical gates = 10000-13000

e0

90.9 MHz

192

47.244 mm

XC4005E-2PG156C

Xilinx

FPGA

Other

Pin/Peg

156

HPGA

Square

Ceramic, Metal-Sealed Cofired

196

No

5.25 V

196

CMOS

112

3000

5

5 V

Grid Array, Heat Sink/Slug

PGA156,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

1.6 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

Max usable 5000 Logic gates

125 MHz

112

42.164 mm

XC4028EX-4PG299I

Xilinx

FPGA

Pin/Peg

299

HPGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

1024

CMOS

256

18000

5

5 V

Grid Array, Heat Sink/Slug

PGA299,20X20

Field Programmable Gate Arrays

2.54 mm

1024 CLBS, 18000 Gates

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

Max usable 28000 Logic gates

143 MHz

256

52.324 mm

XC4003H-4PG191C

Xilinx

FPGA

Commercial

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

238

No

5.25 V

100

CMOS

160

2500

5

5 V

Grid Array

PGA191M,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

4 ns

100 CLBS, 2500 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P191

4.064 mm

47.244 mm

No

MAX 160 I/OS; 200 flip-flops; typical gates = 2500 - 3000

133.3 MHz

160

47.244 mm

XC4005E-3PGG156M

Xilinx

FPGA

Military

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

196

CMOS

3000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

196 CLBS, 3000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

e3

125 MHz

42.164 mm

XC3195A-4PP175C

Xilinx

FPGA

Other

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

484

No

5.25 V

484

CMOS

144

6500

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

3.3 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-PPGA-P175

1

4.191 mm

42.164 mm

No

Max usable 7500 Logic gates

e0

227 MHz

144

42.164 mm

5962-01-292-9185

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic

100

No

CMOS

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Perpendicular

S-XPGA-P84

No

70 MHz

74

XC3020-70PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.5 V

64

CMOS

64

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

9 ns

64 CLBS, 1000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA

70 MHz

64

27.94 mm

XC3064-50PG132I

Xilinx

FPGA

Industrial

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

224

No

5.5 V

224

CMOS

110

6400

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

224 CLBS, 6400 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

MAX 110 I/OS; 688 flip-flops

50 MHz

110

37.084 mm

XC3090-125PP175CSPC0109

Xilinx

FPGA

Commercial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

No

5.25 V

320

CMOS

9000

5

Grid Array

4.75 V

2.54 mm

70 °C (158 °F)

5.5 ns

320 CLBS, 9000 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P175

3.937 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

125 MHz

42.164 mm

XC3190A-3PP175I

Xilinx

FPGA

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

320

No

5.5 V

320

CMOS

144

5000

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

2.7 ns

320 CLBS, 5000 Gates

Perpendicular

S-PPGA-P175

4.191 mm

42.164 mm

No

Max usable 6000 Logic gates

270 MHz

144

42.164 mm

XC4010E-1PG225C

Xilinx

FPGA

Other

Pin/Peg

225

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

400

7000

5

Grid Array

4.75 V

85 °C (185 °F)

1.3 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P225

No

Can also use 20000 gates

e3

166 MHz

XC4013-6PG223I

Xilinx

FPGA

Industrial

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

576

No

5.5 V

576

CMOS

192

10000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

6 ns

576 CLBS, 10000 Gates

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

1536 flip-flops; typical gates = 10000-13000

e0

90.9 MHz

192

47.244 mm

XC2018-100PG84C

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

7.5 ns

100 CLBS, 1000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

174 flip-flops; typical gates = 1000-1500

100 MHz

74

27.94 mm

XC3020-100PG84ISPC0107

Xilinx

FPGA

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

64

CMOS

1000

5

Grid Array

4.5 V

2.54 mm

7 ns

64 CLBS, 1000 Gates

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

256 flip-flops; typical gates = 1000-1500

e3

100 MHz

27.94 mm

XC2064-130PG68C

Xilinx

FPGA

Other

Pin/Peg

68

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.25 V

64

CMOS

58

600

5

5 V

Grid Array

PGA68,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

5.5 ns

64 CLBS, 600 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P68

4.064 mm

27.94 mm

No

122 flip-flops; typical gates = 600-1000

130 MHz

58

27.94 mm

5962-01-382-7899

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic

100

No

CMOS

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Perpendicular

S-XPGA-P84

No

50 MHz

74

XC4010-10PG191C

Xilinx

FPGA

Commercial

Pin/Peg

PGA

Ceramic

400

No

CMOS

160

5

5 V

Grid Array

PGA(UNSPEC)

Field Programmable Gate Arrays

70 °C (158 °F)

0 °C (32 °F)

Perpendicular

No

110 MHz

160

XC2064-100PG68C

Xilinx

FPGA

Other

Pin/Peg

68

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.25 V

64

CMOS

58

600

5

5 V

Grid Array

PGA68,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

7.5 ns

64 CLBS, 600 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P68

4.064 mm

27.94 mm

No

122 flip-flops; typical gates = 600-1000

100 MHz

58

27.94 mm

XC3090A-7PP175C

Xilinx

FPGA

Other

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

320

No

5.25 V

320

CMOS

144

5000

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

5.1 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-PPGA-P175

1

4.191 mm

42.164 mm

No

Max usable 6000 Logic gates

e0

113 MHz

144

42.164 mm

XC4004A-6PG120C

Xilinx

FPGA

Other

Pin/Peg

120

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.25 V

144

CMOS

95

3200

5

5 V

Grid Array

PGA120,13X13

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

6 ns

144 CLBS, 3200 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P120

3.81 mm

34.544 mm

No

480 flip-flops; typical gates = 3200-4000

90.9 MHz

95

34.544 mm

XC3090-50PP175ISPC0107

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

No

5.5 V

320

CMOS

9000

5

Grid Array

4.5 V

2.54 mm

85 °C (185 °F)

320 CLBS, 9000 Gates

-40 °C (-40 °F)

Perpendicular

S-PPGA-P175

3.937 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

50 MHz

42.164 mm

XC4010E-3PG191I

Xilinx

FPGA

Pin/Peg

191

HPGA

Square

Ceramic, Metal-Sealed Cofired

400

No

5.5 V

400

CMOS

160

7000

5

5 V

Grid Array, Heat Sink/Slug

PGA191M,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

2 ns

400 CLBS, 7000 Gates

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

Max usable 10000 Logic gates

125 MHz

160

47.244 mm

XC5215-3PQG299I

Xilinx

FPGA

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

484

15000

5

Grid Array

4.5 V

2.54 mm

3 ns

484 CLBS, 15000 Gates

Matte Tin

Perpendicular

S-CPGA-P299

4.2418 mm

52.324 mm

No

23000 Logic gates can also be used

e3

52 MHz

52.324 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.