Pin/Peg Field Programmable Gate Arrays (FPGA) 1,265

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC4020E-4PG223M

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

784

CMOS

13000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

784 CLBS, 13000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

111 MHz

47.244 mm

XH4428EX-3PG299I

Xilinx

FPGA

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

3.3

Grid Array

2.54 mm

Matte Tin

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

e3

52.324 mm

XC3030A-7PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.5 V

100

CMOS

74

1500

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

5.1 ns

100 CLBS, 1500 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1500-2000

113 MHz

74

27.94 mm

XC4025-6PG299I

Xilinx

FPGA

Industrial

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

5.5 V

1024

CMOS

256

20000

5

5 V

Grid Array

PGA299,20X20

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

6 ns

1024 CLBS, 20000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P299

4.2418 mm

52.324 mm

No

2560 flip-flops; typical gates = 20000-25000

90.9 MHz

256

52.324 mm

XC3190-4PP175C

Xilinx

FPGA

Commercial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

320

No

5.25 V

320

CMOS

144

5000

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

3.3 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P175

1

3.937 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500

230 MHz

144

42.164 mm

5962-01-425-4363

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic

64

No

CMOS

64

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Perpendicular

S-XPGA-P84

No

70 MHz

64

XC3064A-7PG132I

Xilinx

FPGA

Industrial

Pin/Peg

132

HPGA

Square

Ceramic, Metal-Sealed Cofired

224

No

5.5 V

224

CMOS

110

3500

5

5 V

Grid Array, Heat Sink/Slug

PGA132,14X14

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

5.1 ns

224 CLBS, 3500 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

Max usable 4500 Logic gates

113 MHz

110

37.084 mm

XC4025E-3PG223I

Xilinx

FPGA

Pin/Peg

223

HPGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

5.5 V

1024

CMOS

256

15000

5

5 V

Grid Array, Heat Sink/Slug

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

2 ns

1024 CLBS, 15000 Gates

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

Max usable 25000 Logic gates

125 MHz

256

47.244 mm

XC3190A-1PPG175C

Xilinx

FPGA

Other

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

No

5.25 V

320

CMOS

5000

5

Grid Array, Heat Sink/Slug

4.75 V

2.54 mm

85 °C (185 °F)

1.75 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-PPGA-P175

4.191 mm

42.164 mm

No

Max usable 6000 Logic gates

e3

323 MHz

42.164 mm

5962-8971301MZC

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

CMOS

MIL-STD-883

96

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

14 ns

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

e4

50 MHz

96

37.084 mm

XC3195A-4PG175C

Xilinx

FPGA

Other

Pin/Peg

175

HPGA

Square

Ceramic, Metal-Sealed Cofired

484

No

5.25 V

484

CMOS

144

6500

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

3.3 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

Max usable 7500 Logic gates

227 MHz

144

42.164 mm

XC4036XL-08PG411I

Xilinx

FPGA

Pin/Peg

411

PGA

Square

Ceramic

1296

No

CMOS

288

3.3

3.3 V

Grid Array

SPGA411,39X39

Field Programmable Gate Arrays

1.27 mm

Perpendicular

S-XPGA-P411

No

238 MHz

288

XC3164A-4PP132I

Xilinx

FPGA

Pin/Peg

132

PGA

Square

Plastic/Epoxy

224

No

5.5 V

224

CMOS

110

3500

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.5 V

2.54 mm

3.3 ns

224 CLBS, 3500 Gates

Perpendicular

S-PPGA-P132

1

4.191 mm

37.084 mm

No

Typical gates = 3500-4500

227 MHz

110

37.084 mm

XC3120A-5PG84C

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.25 V

64

CMOS

64

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

4.1 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1000-1500

188 MHz

64

27.94 mm

XC3064-125PP132CSPC0107

Xilinx

FPGA

Other

Pin/Peg

132

PGA

Square

Plastic/Epoxy

No

5.25 V

224

CMOS

3500

5

Grid Array

4.75 V

2.54 mm

85 °C (185 °F)

5.5 ns

224 CLBS, 3500 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P132

3.7338 mm

37.084 mm

No

688 flip-flops; typical gates = 3500-4500

125 MHz

37.084 mm

XC4020E-3PGG223M

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

784

CMOS

13000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

784 CLBS, 13000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

e3

125 MHz

47.244 mm

XC3020-50PG84MSPC0110

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

64

CMOS

2000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

64 CLBS, 2000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

50 MHz

27.94 mm

5962-8994802MXX

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

5

Grid Array

2.54 mm

125 °C (257 °F)

9 ns

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

27.94 mm

XC3042-50PP132ISPC0107

Xilinx

FPGA

Industrial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

No

5.5 V

144

CMOS

4200

5

Grid Array

4.5 V

2.54 mm

85 °C (185 °F)

144 CLBS, 4200 Gates

-40 °C (-40 °F)

Perpendicular

S-PPGA-P132

4.191 mm

37.084 mm

No

MAX 96 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C

50 MHz

37.084 mm

XC3130-4PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.5 V

100

CMOS

74

2000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

3.3 ns

100 CLBS, 2000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700

230 MHz

74

27.94 mm

XC4013-6PGG223B

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

576

CMOS

MIL-STD-883 Class B

10000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

6 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

1536 flip-flops; typical gates = 10000-13000

e3

47.244 mm

XC4044EX-4PG411C

Xilinx

FPGA

Pin/Peg

411

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

1600

CMOS

27000

5

Grid Array, Heat Sink/Slug, Interstitial Pitch

4.75 V

2.54 mm

85 °C (185 °F)

1600 CLBS, 27000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P411

4.318 mm

52.324 mm

No

Typical gates = 27000-80000

e0

111 MHz

52.324 mm

XC4003-6PG120C

Xilinx

FPGA

Other

Pin/Peg

120

PGA

Square

Ceramic, Metal-Sealed Cofired

238

No

5.25 V

100

CMOS

80

2500

5

5 V

Grid Array

PGA120,13X13

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

6 ns

100 CLBS, 2500 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P120

3.81 mm

34.544 mm

No

360 flip-flops; typical gates = 2500-3000

e3

90.9 MHz

80

34.544 mm

5962-9473002MXC

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

1368

No

576

CMOS

MIL-STD-883

192

10000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

6 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

e4

90.9 MHz

192

47.244 mm

XC4025E-3PGG299M

Xilinx

FPGA

Military

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

784

CMOS

13000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

784 CLBS, 13000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

e3

125 MHz

52.324 mm

XC4006-5PG156I

Xilinx

FPGA

Industrial

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

608

No

5.5 V

256

CMOS

125

5000

5

5 V

Grid Array

PGA156,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

4.5 ns

256 CLBS, 5000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P156

3.683 mm

42.164 mm

No

768 flip-flops; typical gates = 5000-6000

133.3 MHz

125

42.164 mm

XC3090-100PP175I

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

320

No

5.5 V

320

CMOS

144

5000

5

5 V

Grid Array

PGA176,16X16MOD

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

7 ns

320 CLBS, 5000 Gates

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-PPGA-P175

3.937 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

e0

100 MHz

144

42.164 mm

XC3164-3PG132C

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

224

No

5.25 V

224

CMOS

110

4000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

2.7 ns

224 CLBS, 4000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P132

3.9116 mm

37.084 mm

No

MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500

270 MHz

110

37.084 mm

XC4020E-3PG223M

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

784

CMOS

13000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

784 CLBS, 13000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

125 MHz

47.244 mm

XC4013E-1PG223I

Xilinx

FPGA

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

576

No

5.5 V

576

CMOS

192

10000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

576 CLBS, 10000 Gates

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

166 MHz

192

47.244 mm

XC4025E-4PG223M

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

784

CMOS

13000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

784 CLBS, 13000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

111 MHz

47.244 mm

XC4013E-4PG223C

Xilinx

FPGA

Other

Pin/Peg

223

HPGA

Square

Ceramic, Metal-Sealed Cofired

576

No

5.25 V

576

CMOS

192

10000

5

5 V

Grid Array, Heat Sink/Slug

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

2.7 ns

576 CLBS, 10000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

Max usable 13000 Logic gates

e0

111 MHz

192

47.244 mm

XC4006E-2PGG156M

Xilinx

FPGA

Military

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

256

CMOS

4000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

256 CLBS, 4000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

e3

125 MHz

42.164 mm

XC3042-50PG84M

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

144

CMOS

74

2000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

50 MHz

74

27.94 mm

XC4006E-4PG156M

Xilinx

FPGA

Military

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

608

No

5.5 V

256

CMOS

125

4000

5

5 V

Grid Array

PGA156,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

125 °C (257 °F)

256 CLBS, 4000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

111 MHz

125

42.164 mm

XC4028EX-4PG299C

Xilinx

FPGA

Other

Pin/Peg

299

HPGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

1024

CMOS

256

18000

5

5 V

Grid Array, Heat Sink/Slug

PGA299,20X20

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

1024 CLBS, 18000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

Max usable 28000 Logic gates

143 MHz

256

52.324 mm

5962-9230501MXX

Xilinx

FPGA

Military

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

MIL-STD-883

5

Grid Array

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

e4

47.244 mm

XC3090-70PP175I

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

320

No

5.5 V

320

CMOS

144

5000

5

5 V

Grid Array

PGA176,16X16MOD

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

9 ns

320 CLBS, 5000 Gates

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-PPGA-P175

1

3.937 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

e0

70 MHz

144

42.164 mm

XC4010E-2PG191M

Xilinx

FPGA

Military

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

400

CMOS

7000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

400 CLBS, 7000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

125 MHz

47.244 mm

XC2018-50PG84M

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.5 V

100

CMOS

74

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

125 °C (257 °F)

15 ns

100 CLBS, 1000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

174 flip-flops; typical gates = 1000-1500

50 MHz

74

27.94 mm

XC4025E-1PG223I

Xilinx

FPGA

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

5.5 V

784

CMOS

256

13000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

784 CLBS, 13000 Gates

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

166 MHz

256

47.244 mm

XC3090-50PG175ISPC0109

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

320

CMOS

9000

5

Grid Array

4.5 V

2.54 mm

85 °C (185 °F)

320 CLBS, 9000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P175

3.5052 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

50 MHz

42.164 mm

XC3130-3PG84C

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

2000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

2.7 ns

100 CLBS, 2000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700

270 MHz

74

27.94 mm

XC5206-3PG191C

Xilinx

FPGA

Other

Pin/Peg

191

HPGA

Square

Ceramic, Metal-Sealed Cofired

784

No

5.25 V

196

CMOS

148

6000

5

5 V

Grid Array, Heat Sink/Slug

PGA191M,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

3 ns

196 CLBS, 6000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

MAX available 10000 Logic gates

83 MHz

148

47.244 mm

XC4020-5PG299I

Xilinx

FPGA

Industrial

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

1862

No

5.5 V

784

CMOS

256

16000

5

5 V

Grid Array

PGA299,20X20

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

4.5 ns

784 CLBS, 16000 Gates

-40 °C (-40 °F)

Matte Tin

Perpendicular

S-CPGA-P299

4.2418 mm

52.324 mm

No

2016 flip-flops; typical gates = 16000-20000

e3

133.3 MHz

256

52.324 mm

XC3142A-5PG132I

Xilinx

FPGA

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.5 V

144

CMOS

96

2000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.5 V

2.54 mm

4.1 ns

144 CLBS, 2000 Gates

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

Typical gates = 2000-3000

188 MHz

96

37.084 mm

XH4036EX-3PG411C

Xilinx

FPGA

Pin/Peg

411

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

5

Grid Array, Heat Sink/Slug, Interstitial Pitch

2.54 mm

Matte Tin

Perpendicular

S-CPGA-P411

5.334 mm

52.324 mm

No

e3

52.324 mm

XC3142-5PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.5 V

144

CMOS

74

3000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

4.1 ns

144 CLBS, 3000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700

190 MHz

74

27.94 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.