Pin/Peg Field Programmable Gate Arrays (FPGA) 1,265

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
XC3064-100PP132ISPC0107	Xilinx	FPGA		Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.5 V	224	CMOS			3500	5		Grid Array			4.5 V	2.54 mm		7 ns	224 CLBS, 3500 Gates			Perpendicular	S-PPGA-P132		3.7338 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500		100 MHz		37.084 mm
XC4006-10PG156C	Xilinx	FPGA	Commercial	Pin/Peg	156	PGA	Square	Ceramic	608	No			CMOS		125		5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P156				No			110 MHz	125
XC5202L-3PG156C	Xilinx	FPGA		Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	64	CMOS			2000	3.3		Grid Array			3 V	2.54 mm			64 CLBS, 2000 Gates			Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Typical gates = 2000-3000				42.164 mm
XC3064-100PP132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No	5.25 V	224	CMOS		110	3500	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	7 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-PPGA-P132	1	3.7338 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA	e0	100 MHz	110	37.084 mm
XC40250XV-09PG559I	Xilinx	FPGA		Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired	8464	No	2.7 V	8464	CMOS		448	180000	2.5	2.5,3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	HSPGA559,43X43	Field Programmable Gate Arrays	2.3 V	2.54 mm		1.3 ns	8464 CLBS, 180000 Gates			Perpendicular	S-CPGA-P559		5.969 mm	57.404 mm	No	Can also use 500000 gates		225 MHz	448	57.404 mm
XC3020-100PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No		64	CMOS	MIL-STD-883 Class B	64	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	7 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA		100 MHz	64	27.94 mm
XC3164A-4PG132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	224	No	5.25 V	224	CMOS		110	3500	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	3.3 ns	224 CLBS, 3500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	Typical gates = 3500-4500		227 MHz	110	37.084 mm
XC4006E-4PGG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	256	CMOS			4000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		256 CLBS, 4000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No		e3	111 MHz		42.164 mm
XC3020-125PG84CSPC0110	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	64	CMOS			2000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	5.5 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e3	125 MHz		27.94 mm
XC5210-4PG223C	Xilinx	FPGA	Other	Pin/Peg	223	HPGA	Square	Ceramic, Metal-Sealed Cofired	324	No	5.25 V	324	CMOS		196	10000	5	5 V	Grid Array, Heat Sink/Slug	PGA223,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	3.8 ns	324 CLBS, 10000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P223	1	4.318 mm	47.244 mm	No	MAX available 16000 Logic gates		83 MHz	196	47.244 mm
XC3020-100PG84CSPC0110	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	64	CMOS			2000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	7 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e3	100 MHz		27.94 mm
XC4425-3PG299C	Xilinx	FPGA		Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS				5		Grid Array				2.54 mm						Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No					52.324 mm
XC4044XL-1PG411C	Xilinx	FPGA	Other	Pin/Peg	411	HPGA	Square	Ceramic, Metal-Sealed Cofired	1600	No	3.6 V	1600	CMOS		320	27000	3.3	3.3 V	Grid Array, Heat Sink/Slug	SPGA411,39X39	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.3 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P411		5.969 mm	52.324 mm	No	Max usable 44000 Logic gates		200 MHz	320	52.324 mm
XC3090-50PG175MSPC0107	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No		320	CMOS			5000	5		Grid Array				2.54 mm	125 °C (257 °F)		320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000		50 MHz		42.164 mm
XC3142-4PP132I	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No			CMOS		96		5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)		Perpendicular	S-PPGA-P132				No				96
XC3090A-7PG175C	Xilinx	FPGA	Other	Pin/Peg	175	HPGA	Square	Ceramic, Metal-Sealed Cofired	320	No	5.25 V	320	CMOS		144	5000	5	5 V	Grid Array, Heat Sink/Slug	PGA175,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	5.1 ns	320 CLBS, 5000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	Max usable 6000 Logic gates		113 MHz	144	42.164 mm
XC4003-6PG120M	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square	Ceramic	238	No			CMOS		80		5	5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P120				No			90.9 MHz	80
XC3142-3PG132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS		96	3000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	2.7 ns	144 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		270 MHz	96	37.084 mm
XC3142A-1PP132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No	5.25 V	144	CMOS		96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.8 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	Typical gates = 2000-3000		323 MHz	96	37.084 mm
XC3042-100PG132MSPC0107	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No		144	CMOS			2000	5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000	e3	100 MHz		37.084 mm
5962-8863804MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No				MIL-STD-883					Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No					27.94 mm
5962-9851001QXC	Xilinx	FPGA	Military	Pin/Peg	411	HIPGA	Square	Ceramic, Metal-Sealed Cofired	3078	No	3.6 V	1296	CMOS	MIL-PRF-38535 Class Q	288	22000	3.3	3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	SPGA411,39X39	Field Programmable Gate Arrays	3 V	2.54 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P411		5.334 mm	52.324 mm	No		e4	166 MHz	288	52.324 mm
XC4010-6PG191I	Xilinx	FPGA	Industrial	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired	400	No	5.5 V	400	CMOS		160	8000	5	5 V	Grid Array	PGA191M,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	6 ns	400 CLBS, 8000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P191		4.064 mm	47.244 mm	No	1120 flip-flops; typical gates = 8000-10000			160	47.244 mm
XC3164-3PG132I	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Ceramic	224	No			CMOS		110		5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)		Perpendicular	S-XPGA-P132				No				110
XC3164A-4PP132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No	5.25 V	224	CMOS		110	3500	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	3.3 ns	224 CLBS, 3500 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	Typical gates = 3500-4500		227 MHz	110	37.084 mm
5962-8982302XC	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Rectangular	Ceramic, Metal-Sealed Cofired		No	5.5 V	320	CMOS	MIL-STD-883		9000	5		Grid Array			4.5 V		125 °C (257 °F)	9 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	R-CPGA-P175				No		e4	25 MHz
XC3030-50PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.25 V	100	CMOS		74	3000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)		100 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 74 I/OS; 360 flip-flops		50 MHz	74	27.94 mm
XC4028XL-1PG299C	Xilinx	FPGA	Other	Pin/Peg	299	HPGA	Square	Ceramic, Metal-Sealed Cofired	1024	No	3.6 V	1024	CMOS		256	18000	3.3	3.3 V	Grid Array, Heat Sink/Slug	PGA299,20X20	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.3 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Max usable 28000 Logic gates		200 MHz	256	52.324 mm
XC3090-100PP175CSPC0107	Xilinx	FPGA	Other	Pin/Peg	175	PGA	Square	Plastic/Epoxy		No	5.25 V	320	CMOS			5000	5		Grid Array			4.75 V	2.54 mm	85 °C (185 °F)	7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P175		3.937 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000		100 MHz		42.164 mm
5962-8863803MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No				MIL-STD-883					Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No					27.94 mm
5962-9851101QXB	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	2304	CMOS	MIL-PRF-38535 Class Q		40000	3.3		Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P475		5.969 mm	54.864 mm	No		e0	166 MHz		54.864 mm
XC3042A-6PG132C	Xilinx	FPGA	Other	Pin/Peg	132	HPGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS		96	2000	5	5 V	Grid Array, Heat Sink/Slug	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.1 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	Max usable 3000 Logic gates		135 MHz	96	37.084 mm
XC4425-3PG299I	Xilinx	FPGA		Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS				5		Grid Array				2.54 mm						Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No					52.324 mm
XC3190A-4PGG175I	Xilinx	FPGA		Pin/Peg	175	HPGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	320	CMOS			5000	5		Grid Array, Heat Sink/Slug			4.5 V	2.54 mm		3.3 ns	320 CLBS, 5000 Gates			Perpendicular	S-CPGA-P175			42.164 mm		Max usable 6000 Logic gates		227 MHz		42.164 mm
XC3064-70PP132ISPC0107	Xilinx	FPGA		Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.5 V	224	CMOS			3500	5		Grid Array			4.5 V	2.54 mm		9 ns	224 CLBS, 3500 Gates			Perpendicular	S-PPGA-P132		3.7338 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500		70 MHz		37.084 mm
XQ4028EX-4PG299M	Xilinx	FPGA	Military	Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired	2432	No	5.5 V	1024	CMOS	MIL-PRF-38535	256	18000	5	5 V	Grid Array	PGA299,20X20	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.2 ns	1024 CLBS, 18000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Maximum usable gates = 50000	e3	143 MHz	256	52.324 mm
XQ4062XL-3PG475M	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired	5472	No	3.6 V	2304	CMOS	MIL-PRF-38535	352	40000	3.3	3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	SPGA475,41X41	Field Programmable Gate Arrays	3 V	2.54 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P475		5.969 mm	54.864 mm	No	Typical gates = 40000 to 130000	e3	166 MHz	352	54.864 mm
XC4010-7PG191C	Xilinx	FPGA	Commercial	Pin/Peg		PGA		Ceramic	400	No			CMOS		160		5	5 V	Grid Array	PGA(UNSPEC)	Field Programmable Gate Arrays			70 °C (158 °F)			0 °C (32 °F)		Perpendicular					No			110 MHz	160
XC3064A-6PG132C	Xilinx	FPGA	Other	Pin/Peg	132	HPGA	Square	Ceramic, Metal-Sealed Cofired	224	No	5.25 V	224	CMOS		110	3500	5	5 V	Grid Array, Heat Sink/Slug	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.1 ns	224 CLBS, 3500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	Max usable 4500 Logic gates		135 MHz	110	37.084 mm
XC4013E-2PGG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	576	CMOS			10000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		576 CLBS, 10000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e3	125 MHz		47.244 mm
XC4003A-5PG120C	Xilinx	FPGA	Other	Pin/Peg	120	PGA	Square	Ceramic, Metal-Sealed Cofired	238	No	5.25 V	100	CMOS		80	2500	5	5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.5 ns	100 CLBS, 2500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P120		3.81 mm	34.544 mm	No	360 flip-flops; typical gates = 2500-3000		133.3 MHz	80	34.544 mm
XC3142-1PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic	144	No			CMOS		74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P84				No			325 MHz	74
XC3195A-2PG175I	Xilinx	FPGA		Pin/Peg	175	HPGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.5 V	484	CMOS		144	6500	5	5 V	Grid Array, Heat Sink/Slug	PGA175,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm		2.2 ns	484 CLBS, 6500 Gates			Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	Max usable 7500 Logic gates		323 MHz	144	42.164 mm
XC3042-70PG84MSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		144	CMOS			2000	5		Grid Array				2.54 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000		70 MHz		27.94 mm
XC5210-5PG223C	Xilinx	FPGA	Other	Pin/Peg	223	HPGA	Square	Ceramic, Metal-Sealed Cofired	324	No	5.25 V	324	CMOS		196	10000	5	5 V	Grid Array, Heat Sink/Slug	PGA223,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.6 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P223	1	4.318 mm	47.244 mm	No	MAX available 16000 Logic gates	e0	83 MHz	196	47.244 mm
XC4020E-2PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No			125 MHz		47.244 mm
XC4010E-1PGG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	400	CMOS			7000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		400 CLBS, 7000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No		e3	166 MHz		47.244 mm
5962-8982303MXC	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No	5.5 V	320	CMOS	MIL-STD-883	144	9000	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	7 ns	9000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No		e4	100 MHz	144	42.164 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.