Pin/Peg Field Programmable Gate Arrays (FPGA) 1,265

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC4008E-1PGG191M

Xilinx

FPGA

Military

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

324

CMOS

6000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

324 CLBS, 6000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

e3

166 MHz

47.244 mm

XC4062XL-1PG475I

Xilinx

FPGA

Pin/Peg

475

HPGA

Square

Ceramic, Metal-Sealed Cofired

2304

No

3.6 V

2304

CMOS

384

40000

3.3

3.3 V

Grid Array, Heat Sink/Slug

SPGA475,41X41

Field Programmable Gate Arrays

3 V

2.54 mm

1.3 ns

2304 CLBS, 40000 Gates

Perpendicular

S-CPGA-P475

5.969 mm

54.864 mm

No

Max usable 62000 Logic gates

200 MHz

384

54.864 mm

XC4025E-2PGG223M

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

784

CMOS

13000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

784 CLBS, 13000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

e3

125 MHz

47.244 mm

XC3390A-3PG132I

Xilinx

FPGA

Pin/Peg

132

PGA

Rectangular

Plastic/Epoxy

No

CMOS

5

Grid Array

Perpendicular

R-PPGA-P132

No

XC3064-50PG132C

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

224

No

5.25 V

224

CMOS

110

6400

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

224 CLBS, 6400 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

MAX 110 I/OS; 688 flip-flops

50 MHz

110

37.084 mm

XC4005E-1PG156C

Xilinx

FPGA

Other

Pin/Peg

156

HPGA

Square

Ceramic, Metal-Sealed Cofired

196

No

5.25 V

196

CMOS

112

3000

5

5 V

Grid Array, Heat Sink/Slug

PGA156,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

1.3 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

Max usable 5000 Logic gates

166 MHz

112

42.164 mm

XC4005E-1PGG156M

Xilinx

FPGA

Military

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

196

CMOS

3000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

196 CLBS, 3000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

e3

166 MHz

42.164 mm

XC3030-100PG84M

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

100

CMOS

74

1500

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

7 ns

100 CLBS, 1500 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA

100 MHz

74

27.94 mm

XC3020-50PG84BSPC0107

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

64

CMOS

1000

5

Grid Array

2.54 mm

125 °C (257 °F)

14 ns

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

256 flip-flops; typical gates = 1000-1500

50 MHz

27.94 mm

XC4005H-6PG223C

Xilinx

FPGA

Other

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

466

No

5.25 V

196

CMOS

190

4000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

6 ns

196 CLBS, 4000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

392 flip-flops; typical gates = 4000-5000

e0

90.9 MHz

190

47.244 mm

XC4006E-1PG156C

Xilinx

FPGA

Other

Pin/Peg

156

HPGA

Square

Ceramic, Metal-Sealed Cofired

608

No

5.25 V

256

CMOS

125

4000

5

5 V

Grid Array, Heat Sink/Slug

PGA156,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

1.3 ns

256 CLBS, 4000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

Max usable 6000 Logic gates

166 MHz

125

42.164 mm

XC4062XL-08PG475I

Xilinx

FPGA

Pin/Peg

475

PGA

Square

Ceramic

2304

No

CMOS

384

3.3

3.3 V

Grid Array

SPGA475,41X41

Field Programmable Gate Arrays

1.27 mm

Perpendicular

S-XPGA-P475

No

e0

238 MHz

384

XC3090-50PP175ISPC0109

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

No

5.5 V

320

CMOS

9000

5

Grid Array

4.5 V

2.54 mm

85 °C (185 °F)

320 CLBS, 9000 Gates

-40 °C (-40 °F)

Perpendicular

S-PPGA-P175

3.937 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

50 MHz

42.164 mm

5962-8971302MZX

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

5

Grid Array

2.54 mm

125 °C (257 °F)

9 ns

-55 °C (-67 °F)

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

37.084 mm

XC5402-4PG156C

Xilinx

FPGA

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

5

Grid Array

2.54 mm

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

42.164 mm

XC3195A-2PG223I

Xilinx

FPGA

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

484

No

5.5 V

484

CMOS

176

6500

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

2.2 ns

484 CLBS, 6500 Gates

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

Typical gates = 6500-7500

323 MHz

176

47.244 mm

XC3190-5PP175C

Xilinx

FPGA

Commercial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

320

No

5.25 V

320

CMOS

144

5000

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

4.1 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P175

1

3.937 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500

190 MHz

144

42.164 mm

XC3042-50PG132M

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

144

CMOS

96

2000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P132

3.9116 mm

37.084 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

50 MHz

96

37.084 mm

XC4003E-4PG120C

Xilinx

FPGA

Other

Pin/Peg

120

HPGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

80

2000

5

5 V

Grid Array, Heat Sink/Slug

PGA120,13X13

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

2.7 ns

100 CLBS, 2000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P120

4.318 mm

34.544 mm

No

Max usable 3000 Logic gates

111 MHz

80

34.544 mm

XC4013E-2PG223C

Xilinx

FPGA

Other

Pin/Peg

223

HPGA

Square

Ceramic, Metal-Sealed Cofired

576

No

5.25 V

576

CMOS

192

10000

5

5 V

Grid Array, Heat Sink/Slug

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

1.6 ns

576 CLBS, 10000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

Max usable 13000 Logic gates

e0

125 MHz

192

47.244 mm

XC3164A-2PG132I

Xilinx

FPGA

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

224

No

5.5 V

224

CMOS

110

3500

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.5 V

2.54 mm

2.2 ns

224 CLBS, 3500 Gates

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

Typical gates = 3500-4500

323 MHz

110

37.084 mm

XC3064-50PP132C

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

224

No

5.25 V

224

CMOS

110

6400

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

224 CLBS, 6400 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-PPGA-P132

1

4.191 mm

37.084 mm

No

MAX 110 I/OS; 688 flip-flops

e0

50 MHz

110

37.084 mm

XC3195A-5PG175M

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

484

No

484

CMOS

144

6500

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

4.1 ns

484 CLBS, 6500 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

Typical gates = 6500-7500

188 MHz

144

42.164 mm

XC3190A-2PP175I

Xilinx

FPGA

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

320

No

5.5 V

320

CMOS

144

5000

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

2.2 ns

320 CLBS, 5000 Gates

Perpendicular

S-PPGA-P175

4.191 mm

42.164 mm

No

Max usable 6000 Logic gates

323 MHz

144

42.164 mm

XC3030-50PG84CSPC0104

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

100

CMOS

3000

5

Grid Array

4.75 V

2.54 mm

70 °C (158 °F)

100 CLBS, 3000 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C

e3

50 MHz

27.94 mm

XH4044XLPG411C

Xilinx

FPGA

Pin/Peg

411

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

3.3

Grid Array, Heat Sink/Slug, Interstitial Pitch

2.54 mm

Matte Tin

Perpendicular

S-CPGA-P411

5.334 mm

52.324 mm

No

e3

52.324 mm

5962-8863804XC

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

5

Grid Array

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

e4

27.94 mm

XC3142A-4PG132I

Xilinx

FPGA

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.5 V

144

CMOS

96

2000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.5 V

2.54 mm

3.3 ns

144 CLBS, 2000 Gates

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

Typical gates = 2000-3000

227 MHz

96

37.084 mm

XC5206-6PG191I

Xilinx

FPGA

Pin/Peg

191

HPGA

Square

Ceramic, Metal-Sealed Cofired

784

No

5.5 V

196

CMOS

148

6000

5

5 V

Grid Array, Heat Sink/Slug

PGA191M,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

5.6 ns

196 CLBS, 6000 Gates

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

MAX available 10000 Logic gates

83 MHz

148

47.244 mm

5962-9561002MXX

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

MIL-STD-883

5

Grid Array

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

e4

27.94 mm

XC4025-5PG223I

Xilinx

FPGA

Industrial

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

5.5 V

1024

CMOS

256

20000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

4.5 ns

1024 CLBS, 20000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

2560 flip-flops; typical gates = 20000-25000

133.3 MHz

256

47.244 mm

XC4028XL-2PG299I

Xilinx

FPGA

Pin/Peg

299

HPGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

3.6 V

1024

CMOS

256

18000

3.3

3.3 V

Grid Array, Heat Sink/Slug

PGA299,20X20

Field Programmable Gate Arrays

3 V

2.54 mm

1.5 ns

1024 CLBS, 18000 Gates

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

Max usable 28000 Logic gates

179 MHz

256

52.324 mm

XC3020-50PG84CSPC0110

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

64

CMOS

2000

5

Grid Array

4.75 V

2.54 mm

70 °C (158 °F)

64 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

e3

50 MHz

27.94 mm

XC3195-4PP175C

Xilinx

FPGA

Commercial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

484

No

5.25 V

484

CMOS

144

6500

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

3.3 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-PPGA-P175

1

3.937 mm

42.164 mm

No

MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000

e0

230 MHz

144

42.164 mm

XC4036XL-3PG411C

Xilinx

FPGA

Other

Pin/Peg

411

HPGA

Square

Ceramic, Metal-Sealed Cofired

1296

No

3.6 V

1296

CMOS

288

22000

3.3

3.3 V

Grid Array, Heat Sink/Slug

SPGA411,39X39

Field Programmable Gate Arrays

3 V

2.54 mm

85 °C (185 °F)

1.6 ns

1296 CLBS, 22000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P411

5.969 mm

52.324 mm

No

Max usable 36000 Logic gates

166 MHz

288

52.324 mm

XC4036XL-2PG411I

Xilinx

FPGA

Pin/Peg

411

HPGA

Square

Ceramic, Metal-Sealed Cofired

1296

No

3.6 V

1296

CMOS

288

22000

3.3

3.3 V

Grid Array, Heat Sink/Slug

SPGA411,39X39

Field Programmable Gate Arrays

3 V

2.54 mm

1.5 ns

1296 CLBS, 22000 Gates

Perpendicular

S-CPGA-P411

5.969 mm

52.324 mm

No

Max usable 36000 Logic gates

179 MHz

288

52.324 mm

XC3090-70PP175CSPC0107

Xilinx

FPGA

Other

Pin/Peg

175

PGA

Square

Plastic/Epoxy

No

5.25 V

320

CMOS

5000

5

Grid Array

4.75 V

2.54 mm

85 °C (185 °F)

9 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P175

3.937 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000

70 MHz

42.164 mm

XC4036EX-4PG411I

Xilinx

FPGA

Pin/Peg

411

HPGA

Square

Ceramic, Metal-Sealed Cofired

1296

No

1296

CMOS

288

22000

5

5 V

Grid Array, Heat Sink/Slug

SPGA411,39X39

Field Programmable Gate Arrays

2.54 mm

1296 CLBS, 22000 Gates

Perpendicular

S-CPGA-P411

5.969 mm

52.324 mm

No

Max usable 36000 Logic gates

143 MHz

288

52.324 mm

5962-8863802XC

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

100

CMOS

1800

5

Grid Array

2.54 mm

125 °C (257 °F)

15 ns

100 CLBS, 1800 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

e4

33 MHz

27.94 mm

5962-8994802XC

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Rectangular

Ceramic, Metal-Sealed Cofired

No

5.5 V

64

CMOS

MIL-STD-883

2000

5

Grid Array

4.5 V

125 °C (257 °F)

9 ns

64 CLBS, 2000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

R-CPGA-P84

No

e4

25 MHz

XC3042-125PP132C

Xilinx

FPGA

Other

Pin/Peg

132

PGA

Square

Plastic/Epoxy

144

No

5.25 V

144

CMOS

96

2000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

5.5 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-PPGA-P132

1

3.7338 mm

37.084 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

e0

125 MHz

96

37.084 mm

5962-9561201MXX

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

484

CMOS

MIL-STD-883

6500

5

Grid Array

2.54 mm

125 °C (257 °F)

4.1 ns

484 CLBS, 6500 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

Typical gates = 6500-7500

e4

188 MHz

42.164 mm

XC4005A-4PG156C

Xilinx

FPGA

Other

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

196

No

5.25 V

196

CMOS

112

4000

5

5 V

Grid Array

PGA156,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

4 ns

196 CLBS, 4000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P156

3.683 mm

42.164 mm

No

616 flip-flops; typical gates = 4000-5000

133.3 MHz

112

42.164 mm

XC3090-70PG175M

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

320

No

320

CMOS

144

5000

5

5 V

Grid Array

PGA176,16X16MOD

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

9 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

e3

70 MHz

144

42.164 mm

XC4004A-5PG120C

Xilinx

FPGA

Other

Pin/Peg

120

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.25 V

144

CMOS

95

3200

5

5 V

Grid Array

PGA120,13X13

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

4.5 ns

144 CLBS, 3200 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P120

3.81 mm

34.544 mm

No

480 flip-flops; typical gates = 3200-4000

133.3 MHz

95

34.544 mm

XC4028XL-1PG352C

Xilinx

FPGA

Other

Pin/Peg

352

PGA

Square

Ceramic, Metal-Sealed Cofired

No

3.6 V

1024

CMOS

18000

3.3

Grid Array

3 V

85 °C (185 °F)

1024 CLBS, 18000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P352

No

e0

200 MHz

XC4025E-3PG299M

Xilinx

FPGA

Military

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

784

CMOS

13000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

784 CLBS, 13000 Gates

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

e0

125 MHz

52.324 mm

XC3120-2PG84I

Xilinx

FPGA

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

64

CMOS

1000

5

Grid Array

4.5 V

2.54 mm

2.2 ns

64 CLBS, 1000 Gates

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1000-1500

323 MHz

27.94 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.