Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 Class B |
8000 |
5 |
Grid Array, Heat Sink/Slug |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
e4 |
50 MHz |
39.88 mm |
|||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
132 |
PGA |
Square |
Ceramic |
684 |
No |
CMOS |
104 |
5 |
5 V |
Grid Array |
PGA132,13X13 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Perpendicular |
S-XPGA-P132 |
No |
50 MHz |
104 |
||||||||||||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
207 |
PGA |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
CMOS |
Grid Array |
70 °C (158 °F) |
0 °C (32 °F) |
R-CPGA-P207 |
No |
MAX 168 I/OS |
|||||||||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
295 |
No |
CMOS |
38535Q/M;38534H;883B |
57 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Perpendicular |
S-XPGA-P84 |
No |
57 |
||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
68 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
3000 |
5 |
Grid Array |
4.5 V |
125 °C (257 °F) |
3000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P68 |
No |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
68 |
PGA |
Ceramic |
295 |
No |
CMOS |
57 |
5 |
5 V |
Grid Array |
PGA68(UNSPEC) |
Field Programmable Gate Arrays |
85 °C (185 °F) |
-40 °C (-40 °F) |
Perpendicular |
No |
57 |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
6.1 ns |
8000 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P176 |
4.7498 mm |
39.878 mm |
No |
MAX 140 I/OS |
e4 |
41 MHz |
30 s |
225 °C (437 °F) |
39.878 mm |
||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
5.2 ns |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P176 |
4.7498 mm |
39.878 mm |
No |
e0 |
60 MHz |
30 s |
225 °C (437 °F) |
39.878 mm |
|||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
133 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
684 |
No |
5.5 V |
684 |
CMOS |
MIL-STD-883 Class B |
104 |
4000 |
5 |
5 V |
Grid Array |
PGA133M,13X13 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
16 ns |
684 CLBS, 4000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P133 |
4.27 mm |
34.544 mm |
No |
565 flip-flops |
50 MHz |
104 |
34.544 mm |
|||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
295 |
No |
5.5 V |
295 |
CMOS |
38535Q/M;38534H;883B |
57 |
1200 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
19.332 ns |
295 CLBS, 1200 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
5.21 mm |
27.94 mm |
No |
MAX 57 I/OS; 130 flip-flops |
100 MHz |
57 |
27.94 mm |
|||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
295 |
CMOS |
MIL-STD-883 |
1200 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
10.8 ns |
295 CLBS, 1200 Gates |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P84 |
4.318 mm |
27.94 mm |
No |
MAX 57 I/OS |
e0 |
27.94 mm |
||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
132 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
684 |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
5.2 ns |
684 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P132 |
4.318 mm |
34.544 mm |
No |
e0 |
63 MHz |
30 s |
225 °C (437 °F) |
34.544 mm |
|||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
176 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1232 |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
6.1 ns |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P176 |
4.7498 mm |
39.878 mm |
No |
41 MHz |
39.878 mm |
|||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
295 |
No |
CMOS |
38535Q/M;38534H;883B |
57 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Perpendicular |
S-XPGA-P84 |
No |
57 |
||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
547 |
No |
CMOS |
69 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
2.54 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Perpendicular |
S-XPGA-P84 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
176 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA176,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
1232 CLBS, 8000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P176 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
60 MHz |
140 |
39.88 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
547 |
CMOS |
1200 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
5.5 ns |
547 CLBS, 1200 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
4.318 mm |
27.94 mm |
No |
37 MHz |
27.94 mm |
|||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
547 |
CMOS |
1200 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
5.5 ns |
547 CLBS, 1200 Gates |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P84 |
4.318 mm |
27.94 mm |
No |
e0 |
37 MHz |
27.94 mm |
|||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
17.55 ns |
1232 CLBS, 8000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
MAX 140 I/OS; 998 flip-flops |
43 MHz |
140 |
39.88 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
6000 |
5 |
Grid Array |
4.5 V |
125 °C (257 °F) |
6000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
No |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
39 MHz |
140 |
39.88 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
208 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
11000 |
5 |
Grid Array |
4.5 V |
125 °C (257 °F) |
11000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P208 |
No |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
295 |
No |
CMOS |
57 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Perpendicular |
S-XPGA-P84 |
No |
57 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
120 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
125 °C (257 °F) |
8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P120 |
No |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
133 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
684 |
No |
5.5 V |
684 |
CMOS |
MIL-STD-883 |
104 |
4000 |
5 |
5 V |
Grid Array |
PGA133M,13X13 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
684 CLBS, 4000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P133 |
4.27 mm |
34.544 mm |
No |
55 MHz |
104 |
34.544 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
144 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
11000 |
5 |
Grid Array |
4.5 V |
125 °C (257 °F) |
11000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P144 |
No |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
177 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
1232 |
No |
5.5 V |
1232 |
CMOS |
MIL-STD-883 |
140 |
8000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
HPGA177,15X15 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
1232 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P177 |
5.46 mm |
39.88 mm |
No |
50 MHz |
140 |
39.88 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
132 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
684 |
No |
5.5 V |
684 |
CMOS |
38535Q/M;38534H;883B |
104 |
8000 |
5 |
5 V |
Grid Array |
PGA133M,13X13 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
5.2 ns |
684 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P132 |
4.318 mm |
34.544 mm |
No |
63 MHz |
104 |
34.544 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
547 |
No |
CMOS |
69 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Perpendicular |
S-XPGA-P84 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
68 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
4000 |
5 |
Grid Array |
4.5 V |
125 °C (257 °F) |
4000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P68 |
No |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
68 |
PGA |
Ceramic |
295 |
No |
CMOS |
38535Q/M;38534H;883B |
57 |
5 |
5 V |
Grid Array |
PGA68(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Perpendicular |
No |
57 |
|||||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
133 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
684 |
No |
5.5 V |
684 |
CMOS |
104 |
4000 |
5 |
5 V |
Grid Array |
PGA133M,13X13 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
15 ns |
684 CLBS, 4000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P133 |
4.27 mm |
34.544 mm |
No |
MAX 92 I/OS; 565 flip-flops |
55 MHz |
104 |
34.544 mm |
||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
100 |
PGA |
Square |
Ceramic |
451 |
No |
CMOS |
83 |
5 |
5 V |
Grid Array |
PGA100(UNSPEC) |
Field Programmable Gate Arrays |
85 °C (185 °F) |
-40 °C (-40 °F) |
Perpendicular |
S-XPGA-P100 |
No |
66 MHz |
83 |
|||||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
191 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
784 |
No |
5.25 V |
196 |
CMOS |
148 |
6000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA191M,18X18 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
5.6 ns |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P191 |
4.318 mm |
47.244 mm |
No |
MAX available 10000 Logic gates |
83 MHz |
148 |
47.244 mm |
|||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
132 |
PGA |
Square |
Plastic/Epoxy |
No |
5.25 V |
144 |
CMOS |
2000 |
5 |
Grid Array |
4.75 V |
2.54 mm |
85 °C (185 °F) |
9 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Perpendicular |
S-PPGA-P132 |
3.7338 mm |
37.084 mm |
No |
480 flip-flops; typical gates = 2000-3000 |
70 MHz |
37.084 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
100 |
No |
5.5 V |
100 |
CMOS |
MIL-STD-883 Class B |
74 |
1000 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
20 ns |
100 CLBS, 1000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
5.207 mm |
27.94 mm |
No |
174 flip-flops; typical gates = 1000-1500 |
33 MHz |
74 |
27.94 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
175 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
484 |
No |
5.25 V |
484 |
CMOS |
144 |
6500 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA175,16X16 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
1.75 ns |
484 CLBS, 6500 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P175 |
4.318 mm |
42.164 mm |
No |
Max usable 7500 Logic gates |
323 MHz |
144 |
42.164 mm |
|||||||||
Xilinx |
FPGA |
Pin/Peg |
175 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
320 |
CMOS |
5000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
9 ns |
320 CLBS, 5000 Gates |
Perpendicular |
S-CPGA-P175 |
3.81 mm |
42.164 mm |
No |
928 flip-flops; typical gates = 5000-6000 |
70 MHz |
42.164 mm |
|||||||||||||||||||
|
Xilinx |
FPGA |
Military |
Pin/Peg |
68 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
64 |
No |
5.5 V |
64 |
CMOS |
58 |
600 |
5 |
5 V |
Grid Array |
PGA68,11X11 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
15 ns |
64 CLBS, 600 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P68 |
4.064 mm |
27.94 mm |
No |
122 flip-flops; typical gates = 600-1000 |
50 MHz |
58 |
27.94 mm |
|||||||||
Xilinx |
FPGA |
Pin/Peg |
120 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
100 |
No |
5.5 V |
100 |
CMOS |
80 |
2000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA120,13X13 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
2.7 ns |
100 CLBS, 2000 Gates |
Perpendicular |
S-CPGA-P120 |
4.318 mm |
34.544 mm |
No |
Max usable 3000 Logic gates |
111 MHz |
80 |
34.544 mm |
|||||||||||||
Xilinx |
FPGA |
Pin/Peg |
411 |
HIPGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
1600 |
CMOS |
27000 |
5 |
Grid Array, Heat Sink/Slug, Interstitial Pitch |
4.5 V |
2.54 mm |
100 °C (212 °F) |
1600 CLBS, 27000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P411 |
4.318 mm |
52.324 mm |
No |
Typical gates = 27000-80000 |
e0 |
111 MHz |
52.324 mm |
||||||||||||||||
Xilinx |
FPGA |
Military |
Pin/Peg |
132 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
144 |
CMOS |
2000 |
5 |
Grid Array |
2.54 mm |
125 °C (257 °F) |
14 ns |
144 CLBS, 2000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P132 |
3.9116 mm |
37.084 mm |
No |
480 flip-flops; typical gates = 2000-3000 |
50 MHz |
37.084 mm |
||||||||||||||||||
Xilinx |
FPGA |
Military |
Pin/Peg |
132 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
CMOS |
MIL-STD-883 |
5 |
Grid Array |
2.54 mm |
125 °C (257 °F) |
7 ns |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P132 |
4.318 mm |
37.084 mm |
No |
37.084 mm |
||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
175 |
HPGA |
Square |
Ceramic, Metal-Sealed Cofired |
320 |
No |
5.25 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Grid Array, Heat Sink/Slug |
PGA175,16X16 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
2.7 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P175 |
4.318 mm |
42.164 mm |
No |
Max usable 6000 Logic gates |
e0 |
270 MHz |
144 |
42.164 mm |
||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
175 |
PGA |
Square |
Plastic/Epoxy |
320 |
No |
5.25 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Grid Array |
PGA176,16X16MOD |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
9 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-PPGA-P175 |
1 |
3.937 mm |
42.164 mm |
No |
928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA |
e0 |
70 MHz |
144 |
42.164 mm |
|||||||
Xilinx |
FPGA |
Pin/Peg |
191 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
324 |
No |
5.5 V |
324 |
CMOS |
144 |
6000 |
5 |
5 V |
Grid Array |
PGA191M,18X18 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
324 CLBS, 6000 Gates |
Perpendicular |
S-CPGA-P191 |
4.318 mm |
47.244 mm |
No |
166 MHz |
144 |
47.244 mm |
|||||||||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
64 |
No |
5.25 V |
64 |
CMOS |
64 |
1000 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
5.1 ns |
64 CLBS, 1000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P84 |
5.207 mm |
27.94 mm |
No |
Typical gates = 1000-1500 |
113 MHz |
64 |
27.94 mm |
|||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
191 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
400 |
No |
5.25 V |
400 |
CMOS |
160 |
8000 |
5 |
5 V |
Grid Array |
PGA191M,18X18 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
4.5 ns |
400 CLBS, 8000 Gates |
0 °C (32 °F) |
Tin Silver Copper |
Perpendicular |
S-CPGA-P191 |
4.064 mm |
47.244 mm |
No |
1120 flip-flops; typical gates = 8000-10000 |
e1 |
133.3 MHz |
160 |
47.244 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.