Pin/Peg Field Programmable Gate Arrays (FPGA) 1,265

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3090A-7PG175I

Xilinx

FPGA

Pin/Peg

175

HPGA

Square

Ceramic, Metal-Sealed Cofired

320

No

5.5 V

320

CMOS

144

5000

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

5.1 ns

320 CLBS, 5000 Gates

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

Max usable 6000 Logic gates

113 MHz

144

42.164 mm

XC3042-125PG132CSPC0107

Xilinx

FPGA

Other

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

144

CMOS

2000

5

Grid Array

4.75 V

2.54 mm

85 °C (185 °F)

5.5 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P132

3.9116 mm

37.084 mm

No

480 flip-flops; typical gates = 2000-3000

e3

125 MHz

37.084 mm

5962-9561002MUC

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

CMOS

MIL-STD-883

96

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

e4

230 MHz

96

37.084 mm

XC4020E-4PGG223M

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

784

CMOS

13000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

784 CLBS, 13000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

e3

111 MHz

47.244 mm

XC3090-125PG175CSPC0109

Xilinx

FPGA

Commercial

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

320

CMOS

9000

5

Grid Array

4.75 V

2.54 mm

70 °C (158 °F)

5.5 ns

320 CLBS, 9000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

3.5052 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

125 MHz

42.164 mm

5962-8971302MZC

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

CMOS

MIL-STD-883

96

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

9 ns

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

e4

70 MHz

96

37.084 mm

XC4013E-3PGG223M

Xilinx

FPGA

Military

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

576

CMOS

10000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P223

4.318 mm

47.244 mm

No

e3

125 MHz

47.244 mm

XC2018-70PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.5 V

100

CMOS

74

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

10 ns

100 CLBS, 1000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

174 flip-flops; typical gates = 1000-1500

70 MHz

74

27.94 mm

XC5215-6PQG299I

Xilinx

FPGA

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

484

15000

5

Grid Array

4.5 V

2.54 mm

5.6 ns

484 CLBS, 15000 Gates

Matte Tin

Perpendicular

S-CPGA-P299

4.2418 mm

52.324 mm

No

23000 Logic gates can also be used

e3

36 MHz

52.324 mm

XC3190A-3PPG175C

Xilinx

FPGA

Other

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

No

5.25 V

320

CMOS

5000

5

Grid Array, Heat Sink/Slug

4.75 V

2.54 mm

85 °C (185 °F)

2.7 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P175

4.191 mm

42.164 mm

No

Max usable 6000 Logic gates

270 MHz

42.164 mm

XC3130-5PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.5 V

100

CMOS

74

2000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

4.1 ns

100 CLBS, 2000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700

190 MHz

74

27.94 mm

XC4010E-4PGG191M

Xilinx

FPGA

Military

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

400

7000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

2.7 ns

400 CLBS, 7000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P191

5.207 mm

47.244 mm

Max usable 20000 Logic gates

111 MHz

47.244 mm

XC4025-4PG223C

Xilinx

FPGA

Other

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

5.25 V

1024

CMOS

256

20000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

4 ns

1024 CLBS, 20000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

2560 flip-flops; typical gates = 20000-25000

e0

133.3 MHz

256

47.244 mm

5962-8863805XC

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

CMOS

MIL-STD-883

1800

5

Grid Array

4.5 V

125 °C (257 °F)

1800 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

No

XC4028XL-3PG299I

Xilinx

FPGA

Pin/Peg

299

HPGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

3.6 V

1024

CMOS

256

18000

3.3

3.3 V

Grid Array, Heat Sink/Slug

PGA299,20X20

Field Programmable Gate Arrays

3 V

2.54 mm

1.6 ns

1024 CLBS, 18000 Gates

Perpendicular

S-CPGA-P299

4.318 mm

52.324 mm

No

Max usable 28000 Logic gates

166 MHz

256

52.324 mm

XC4085XL-1PG559C

Xilinx

FPGA

Other

Pin/Peg

559

HPGA

Square

Ceramic, Metal-Sealed Cofired

3136

No

3.6 V

3136

CMOS

448

55000

3.3

3.3 V

Grid Array, Heat Sink/Slug

HSPGA559,43X43

Field Programmable Gate Arrays

3 V

2.54 mm

85 °C (185 °F)

1.3 ns

3136 CLBS, 55000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P559

5.969 mm

57.404 mm

No

Max usable 85000 Logic gates

200 MHz

448

57.404 mm

XC40250XV-7PG559C

Xilinx

FPGA

Other

Pin/Peg

559

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

2.7 V

8464

CMOS

180000

2.5

Grid Array, Heat Sink/Slug, Interstitial Pitch

2.3 V

2.54 mm

85 °C (185 °F)

0.9 ns

8464 CLBS, 180000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P559

5.334 mm

57.404 mm

No

250 MHz

57.404 mm

5962-8971301MXC

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

144

CMOS

MIL-STD-883

74

4200

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

14 ns

144 CLBS, 4200 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

e4

50 MHz

74

27.94 mm

XC3042-70PG84ISPC0107

Xilinx

FPGA

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

144

CMOS

2000

5

Grid Array

4.5 V

2.54 mm

9 ns

144 CLBS, 2000 Gates

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

480 flip-flops; typical gates = 2000-3000

e3

70 MHz

27.94 mm

5962-9471201MXC

Xilinx

FPGA

Military

Pin/Peg

120

PGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

MIL-STD-883

5

Grid Array

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P120

4.318 mm

34.544 mm

No

e4

34.544 mm

XC5206-5PG191C

Xilinx

FPGA

Other

Pin/Peg

191

HPGA

Square

Ceramic, Metal-Sealed Cofired

784

No

5.25 V

196

CMOS

148

6000

5

5 V

Grid Array, Heat Sink/Slug

PGA191M,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

4.6 ns

196 CLBS, 6000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

MAX available 10000 Logic gates

83 MHz

148

47.244 mm

XC4025-6PG223C

Xilinx

FPGA

Other

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

1024

No

5.25 V

1024

CMOS

256

20000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

6 ns

1024 CLBS, 20000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

2560 flip-flops; typical gates = 20000-25000

90.9 MHz

256

47.244 mm

XC40250XV-08PG559I

Xilinx

FPGA

Pin/Peg

559

HIPGA

Square

Ceramic, Metal-Sealed Cofired

8464

No

2.7 V

8464

CMOS

448

180000

2.5

2.5,3.3 V

Grid Array, Heat Sink/Slug, Interstitial Pitch

HSPGA559,43X43

Field Programmable Gate Arrays

2.3 V

2.54 mm

1.1 ns

8464 CLBS, 180000 Gates

Perpendicular

S-CPGA-P559

5.969 mm

57.404 mm

No

Can also use 500000 gates

258 MHz

448

57.404 mm

XC3142-1PG132C

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Ceramic

144

No

CMOS

96

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Perpendicular

S-XPGA-P132

No

325 MHz

96

XC5404-4PG156C

Xilinx

FPGA

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

5

Grid Array

2.54 mm

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

42.164 mm

XC3090-100PG175C

Xilinx

FPGA

Other

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

320

No

5.25 V

320

CMOS

144

5000

5

5 V

Grid Array

PGA176,16X16MOD

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

7 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

100 MHz

144

42.164 mm

XC3030-70PG84MSPC0107

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

100

CMOS

1500

5

Grid Array

2.54 mm

125 °C (257 °F)

9 ns

100 CLBS, 1500 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

360 flip-flops; typical gates = 1500-2000

70 MHz

27.94 mm

XC3020-70PG84BSPC0110

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

64

CMOS

2000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

9 ns

64 CLBS, 2000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

70 MHz

27.94 mm

XC3020-100PG84MSPC0107

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

64

CMOS

1000

5

Grid Array

2.54 mm

125 °C (257 °F)

7 ns

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

256 flip-flops; typical gates = 1000-1500

e3

100 MHz

27.94 mm

XC4062XLPG475C

Xilinx

FPGA

Pin/Peg

475

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

2304

CMOS

40000

5

Grid Array, Heat Sink/Slug, Interstitial Pitch

4.75 V

2.54 mm

2304 CLBS, 40000 Gates

Perpendicular

S-CPGA-P475

5.334 mm

54.864 mm

No

Typical gates = 40000-130000

54.864 mm

XC5402-4PG156I

Xilinx

FPGA

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

5

Grid Array

2.54 mm

Perpendicular

S-CPGA-P156

4.318 mm

42.164 mm

No

42.164 mm

XC3190A-5PP175I

Xilinx

FPGA

Pin/Peg

175

PGA

Square

Plastic/Epoxy

320

No

5.5 V

320

CMOS

144

5000

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

4.1 ns

320 CLBS, 5000 Gates

Perpendicular

S-PPGA-P175

1

4.191 mm

42.164 mm

No

Typical gates = 5000-6000

188 MHz

144

42.164 mm

XC3142-5PG132M

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

144

CMOS

96

3000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

4.1 ns

144 CLBS, 3000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P132

3.9116 mm

37.084 mm

No

MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700

190 MHz

96

37.084 mm

XC3142-2PP132C

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

144

No

CMOS

96

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Perpendicular

S-PPGA-P132

No

325 MHz

96

XC3064-50PG132M

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

224

No

224

CMOS

110

3500

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

224 CLBS, 3500 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P132

3.9116 mm

37.084 mm

No

688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA

50 MHz

110

37.084 mm

5962-9957501QXB

Xilinx

FPGA

Military

Pin/Peg

475

HIPGA

Square

Ceramic, Metal-Sealed Cofired

No

3.6 V

3136

CMOS

MIL-PRF-38535 Class Q

55000

3.3

Grid Array, Heat Sink/Slug, Interstitial Pitch

3 V

2.54 mm

125 °C (257 °F)

1.3 ns

3136 CLBS, 55000 Gates

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P475

5.969 mm

54.864 mm

No

e0

200 MHz

54.864 mm

XC4008E-4PGG191M

Xilinx

FPGA

Military

Pin/Peg

191

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

324

CMOS

6000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

324 CLBS, 6000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

e3

111 MHz

47.244 mm

XC4010E-1PG191C

Xilinx

FPGA

Other

Pin/Peg

191

HPGA

Square

Ceramic, Metal-Sealed Cofired

400

No

5.25 V

400

CMOS

160

7000

5

5 V

Grid Array, Heat Sink/Slug

PGA191M,18X18

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

1.3 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P191

4.318 mm

47.244 mm

No

Max usable 10000 Logic gates

166 MHz

160

47.244 mm

XC4044XL-3PG411C

Xilinx

FPGA

Other

Pin/Peg

411

HPGA

Square

Ceramic, Metal-Sealed Cofired

1600

No

3.6 V

1600

CMOS

320

27000

3.3

3.3 V

Grid Array, Heat Sink/Slug

SPGA411,39X39

Field Programmable Gate Arrays

3 V

2.54 mm

85 °C (185 °F)

1.6 ns

1600 CLBS, 27000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P411

5.969 mm

52.324 mm

No

Max usable 44000 Logic gates

166 MHz

320

52.324 mm

XC4006-7PG156C

Xilinx

FPGA

Commercial

Pin/Peg

156

PGA

Square

Ceramic

608

No

CMOS

125

5

5 V

Grid Array

PGA156,16X16

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Perpendicular

S-XPGA-P156

No

110 MHz

125

XC3042-50PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.5 V

144

CMOS

74

4200

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

144 CLBS, 4200 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 74 I/OS; 480 flip-flops

50 MHz

74

27.94 mm

XC3195A-5PG223I

Xilinx

FPGA

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

484

No

5.5 V

484

CMOS

176

6500

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

4.1 ns

484 CLBS, 6500 Gates

Perpendicular

S-CPGA-P223

1

4.318 mm

47.244 mm

No

Typical gates = 6500-7500

188 MHz

176

47.244 mm

XC3090-50PP175I

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

320

No

5.5 V

320

CMOS

144

9000

5

5 V

Grid Array

PGA176,16X16MOD

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

320 CLBS, 9000 Gates

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-PPGA-P175

1

3.937 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops

e0

50 MHz

144

42.164 mm

XC4005H-6PG223I

Xilinx

FPGA

Industrial

Pin/Peg

223

PGA

Square

Ceramic, Metal-Sealed Cofired

466

No

5.5 V

196

CMOS

190

4000

5

5 V

Grid Array

PGA223,18X18

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

6 ns

196 CLBS, 4000 Gates

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-CPGA-P223

1

4.064 mm

47.244 mm

No

392 flip-flops; typical gates = 4000-5000

e0

90.9 MHz

190

47.244 mm

XC4005-10PG156M

Xilinx

FPGA

Military

Pin/Peg

156

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

196

CMOS

4000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

196 CLBS, 4000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P156

3.683 mm

42.164 mm

No

616 flip-flops; typical gates = 4000-5000

42.164 mm

XC3390A-3PG175I

Xilinx

FPGA

Pin/Peg

175

PGA

Rectangular

Plastic/Epoxy

No

CMOS

5

Grid Array

Perpendicular

R-PPGA-P175

No

XC3190-4PP175I

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

320

No

5.5 V

320

CMOS

144

5000

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

3.3 ns

320 CLBS, 5000 Gates

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-PPGA-P175

1

3.937 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500

e0

230 MHz

144

42.164 mm

XC5215-3PQ299I

Xilinx

FPGA

Pin/Peg

299

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

484

15000

5

Grid Array

4.5 V

2.54 mm

3 ns

484 CLBS, 15000 Gates

Tin Lead

Perpendicular

S-CPGA-P299

4.2418 mm

52.324 mm

No

23000 Logic gates can also be used

e0

52 MHz

52.324 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.