Commercial Field Programmable Gate Arrays (FPGA) 800

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3190L-3PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	3.6 V	320	CMOS	70	5000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	70 °C (158 °F)	2.7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 5000-6000	e0	270 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3190-5PG175C	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No	5.25 V	320	CMOS	144	5000	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4.1 ns	320 CLBS, 5000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500		190 MHz		144		42.164 mm
XC8101-3PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	384	CMOS		1000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		384 CLBS, 1000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	192 flip-flops; 3.3 V operation; OTP based						20 mm
XC3020-50PC68CSPC0107	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz				24.2316 mm
XC3195-5PQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS	138	6500	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	4.1 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.94 mm	28 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000	e0	190 MHz	30 s	138	225 °C (437 °F)	28 mm
XC8103-2VQ44C	Xilinx	FPGA	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3000	5		Flatpack, Thin Profile			4.75 V	.8 mm	70 °C (158 °F)		1024 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	512 flip-flops; 3.3 V operation; OTP based						10 mm
XC3090-50PG175CSPC0109	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	320	CMOS		9000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175		3.5052 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		50 MHz				42.164 mm
XC8103-3PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		1024 CLBS, 3000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	512 flip-flops; 3.3 V operation; OTP based						20 mm
XC3064-125PP132CSPC0108	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.25 V	224	CMOS		6400	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	5.5 ns	224 CLBS, 6400 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132		4.191 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		125 MHz				37.084 mm
XCV405E-8FGG676C	Xilinx	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	2400	CMOS		129600	1.8		Grid Array			1.71 V	1 mm	70 °C (158 °F)	0.4 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	416 MHz	30 s		250 °C (482 °F)	27 mm
XC3064-100PC84CSPC0108	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	224	CMOS		6400	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	7 ns	224 CLBS, 6400 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 70 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		100 MHz				29.3116 mm
XC3195-5PG175C	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.25 V	484	CMOS	144	6500	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4.1 ns	484 CLBS, 6500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000		190 MHz		144		42.164 mm
XCV405E-6FGG676C	Xilinx	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	2400	CMOS		129600	1.8		Grid Array			1.71 V	1 mm	70 °C (158 °F)	0.47 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	357 MHz	30 s		250 °C (482 °F)	27 mm
XC3020-100CQ100CSPC0107	Xilinx	FPGA	Commercial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	64	CMOS		2000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	7 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	100 MHz				17.272 mm
XC6SLX45-1LCS484C	Xilinx	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.05 V	3411		320		1		Grid Array	BGA484,22X22,32		.95 V	.8 mm	70 °C (158 °F)	0.46 ns	3411 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			320		19 mm
XC3064-125PC84CSPC0108	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	224	CMOS		6400	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	5.5 ns	224 CLBS, 6400 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 70 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		125 MHz				29.3116 mm
XC3130-3PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	2000	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	2.7 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	270 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3190-3PP175C	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Plastic/Epoxy	320	No	5.25 V	320	CMOS	144	5000	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	2.7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P175	1	3.937 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500		270 MHz		144		42.164 mm
XC3164-5PQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	120	4000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	4.1 ns	224 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.94 mm	28 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500	e0	190 MHz	30 s	120	225 °C (437 °F)	28 mm
XC3020-50CQ100CSPC0107	Xilinx	FPGA	Commercial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	64	CMOS		2000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				17.272 mm
XC3020-50PC84CSPC0107	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				29.3116 mm
XC3030-50PC44CSPC0104	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		100 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		50 MHz				16.5862 mm
XC8103-2PQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		1024 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	512 flip-flops; 3.3 V operation; OTP based						28 mm
XC3142L-3PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	3.6 V	144	CMOS	74	2000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	70 °C (158 °F)	2.7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 2000-3000	e0	270 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XCV812E-6FG900C	Xilinx	FPGA	Commercial	Ball	900	BGA	Square	Plastic/Epoxy	21168	Yes	1.89 V	4704	CMOS	556	254016	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	70 °C (158 °F)	0.47 ns	4704 CLBS, 254016 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	357 MHz	30 s	556	225 °C (437 °F)	31 mm
XC3020A-2PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes			CMOS	64		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	325 MHz	30 s	64	225 °C (437 °F)
XC8103-ESPQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3328	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)	5.5 ns	1024 CLBS, 3328 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	MAX 128 I/OS; MAX 512 flip-flops; OTP based						28 mm
XC3142-4TQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	FQFP	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	82	3000	5	5 V	Flatpack, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	70 °C (158 °F)	3.3 ns	144 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.75 mm	14 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	230 MHz	30 s	82	225 °C (437 °F)	14 mm
XC3195-4PG175C	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.25 V	484	CMOS	144	6500	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	3.3 ns	484 CLBS, 6500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000		230 MHz		144		42.164 mm
XC8109-2BG225C	Xilinx	FPGA	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.25 V	2688	CMOS		9000	5		Grid Array			4.75 V	1.5 mm	70 °C (158 °F)		2688 CLBS, 9000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B225		3.5 mm	27 mm	No	1344 flip-flops; 3.3 V operation; OTP based						27 mm
XC3020A-2PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes			CMOS	58		5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68				No		e0	325 MHz		58
XC3130-5PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	4.1 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	190 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3064-50PC84CSPC0107	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	224	CMOS		6400	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		224 CLBS, 6400 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 70 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				29.3116 mm
XC3142-5PP132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No	5.25 V	144	CMOS	96	3000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4.1 ns	144 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132	1	3.7338 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		190 MHz		96		37.084 mm
XC3020-50CQ100C	Xilinx	FPGA	Commercial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired	64	Yes	5.25 V	64	CMOS	64	2000	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.75 V	.635 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-CQFP-F100	1	3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops		50 MHz		64		17.272 mm
XC2018-50PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	15 ns	100 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	MAX 74 I/OS; 174 flip-flops; typical gates = 1000 - 1500	e0	50 MHz		58		24.2316 mm
XC2018-50PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	74	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	15 ns	100 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 74 I/OS; 174 flip-flops; typical gates = 1000 - 1500	e0	50 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3090-100PP175CSPC0109	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Plastic/Epoxy		No	5.25 V	320	CMOS		9000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	7 ns	320 CLBS, 9000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P175		3.937 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		100 MHz				42.164 mm
XC3120-3PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.25 V	64	CMOS	64	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	2.7 ns	64 CLBS, 1000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1000-1500		270 MHz		64		27.94 mm
XC8109-ESPQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	2688	CMOS		8700	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)	5.5 ns	2688 CLBS, 8700 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	MAX 78 I/OS; MAX 1344 flip-flops; OTP based						20 mm
XC6SLX150T-3NCS484C	Xilinx	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519		296		1.2		Grid Array	BGA484,22X22,32		1.14 V	.8 mm	70 °C (158 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			296		19 mm
CP20220PLCC84A-0C	Renesas Electronics	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	1896	Yes			CMOS	91		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J84				No		e0			91
CP20420PQFP160A-0C	Renesas Electronics	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	3584	Yes			CMOS	130		5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G160				No		e0			130
CP20420PLCC84A-0C	Renesas Electronics	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	3584	Yes			CMOS	130		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J84				No		e0			130
CP20840PQFP208A-0C	Renesas Electronics	FPGA	Commercial	Gull Wing	208	QFP	Square	Plastic/Epoxy	6740	Yes			CMOS	180		5	5 V	Flatpack	QFP208,1.2SQ,20	Field Programmable Gate Arrays		.5 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G208				No		e0			180
CP20840CQFP208A-0C	Renesas Electronics	FPGA	Commercial	Gull Wing	208	QFP	Square	Ceramic	6740	Yes			CMOS	180		5	5 V	Flatpack	QFP208,1.2SQ,20	Field Programmable Gate Arrays		.5 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Quad	S-XQFP-G208				No		e0			180
CP21200PQFP208A-0C	Renesas Electronics	FPGA	Commercial	Gull Wing	208	QFP	Square	Plastic/Epoxy	8960	Yes			CMOS	203		5	5 V	Flatpack	QFP208,1.2SQ,20	Field Programmable Gate Arrays		.5 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G208				No		e0			203
CP20840CPGA223A-0C	Renesas Electronics	FPGA	Commercial	Pin/Peg	223	PGA	Square	Ceramic	6740	No			CMOS	180		5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Perpendicular	S-XPGA-P223				No		e0			180

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.