Commercial Field Programmable Gate Arrays (FPGA) 800

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3142-3PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	82	3000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	2.7 ns	144 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	270 MHz	30 s	82	225 °C (437 °F)	20 mm
XC4013-5PQ256C	Xilinx	FPGA	Commercial	Gull Wing	256	QFP		Plastic/Epoxy	1368	Yes			CMOS	192		5	5 V	Flatpack	QFP256(UNSPEC)	Field Programmable Gate Arrays			70 °C (158 °F)			0 °C (32 °F)		Quad					No			133.3 MHz		192
XC3090-100CQ164CSPC0107	Xilinx	FPGA	Commercial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	320	CMOS		9000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	7 ns	320 CLBS, 9000 Gates	0 °C (32 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		100 MHz				27.432 mm
XC3020-100PC68CSPC0110	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	7 ns	64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		100 MHz				24.2316 mm
XC8101-2PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	384	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		384 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	192 flip-flops; 3.3 V operation; OTP based						29.3116 mm
XC3030-50PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	80	3000	5	5 V	Flatpack	QFP100,.7X1.0	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)		100 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.1496 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops	e0	50 MHz	30 s	80	225 °C (437 °F)	20 mm
XC3142-1PG132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic	144	No			CMOS	96		5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P132				No			325 MHz		96
XC8101-2PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	384	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		384 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No	192 flip-flops; 3.3 V operation; OTP based						16.5862 mm
XCV405E-6BGG560C	Xilinx	FPGA	Commercial	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	1.89 V	2400	CMOS		129600	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	70 °C (158 °F)	0.47 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	357 MHz	30 s		260 °C (500 °F)	42.5 mm
XC3142-2PP132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No			CMOS	96		5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-PPGA-P132				No			325 MHz		96
XC4006-7PG156C	Xilinx	FPGA	Commercial	Pin/Peg	156	PGA	Square	Ceramic	608	No			CMOS	125		5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P156				No			110 MHz		125
XC8103-1PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	1024	Yes	5.25 V	1024	CMOS	128	3000	5	3.3/5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	5.4 ns	1024 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	512 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	128	225 °C (437 °F)	29.3116 mm
XC3020-125CQ100C	Xilinx	FPGA	Commercial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	64	CMOS		2000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	5.5 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops	e0	125 MHz				17.272 mm
XC8100-1PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	192	Yes	5.25 V	192	CMOS	32	600	5	3.3/5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	5.4 ns	192 CLBS, 600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	96 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	32	225 °C (437 °F)	16.5862 mm
XC3120-5PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	1000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	4.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 1000-1500	e0	188 MHz	30 s	64	225 °C (437 °F)	20 mm
XC3195-3PQ208C	Xilinx	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS	176	6500	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	70 °C (158 °F)	2.7 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000	e0	270 MHz	30 s	176	225 °C (437 °F)	28 mm
XC3030-70PQ100CSPC0104	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)	9 ns	100 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100		3.1496 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				20 mm
XC3030-125PQ100CSPC0104	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)	5.5 ns	100 CLBS, 3000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.1496 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		125 MHz				20 mm
XC4003-10PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	238	Yes			CMOS	61		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	110 MHz	30 s	61	225 °C (437 °F)
XC6SLX150-3NCS484C	Xilinx	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519		338		1.2		Grid Array	BGA484,22X22,32		1.14 V	.8 mm	70 °C (158 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			338		19 mm
XC4002A-4VQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	FQFP	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	1600	5	5 V	Flatpack, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	70 °C (158 °F)	4 ns	64 CLBS, 1600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	2.07 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops; typical gates = 1600 - 2000	e0	133.3 MHz	30 s	64	240 °C (464 °F)	14 mm
XC3020A-1PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes			CMOS	64		5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3			No		e0	325 MHz	30 s	64	225 °C (437 °F)
XC8106-3BG225C	Xilinx	FPGA	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.25 V	1728	CMOS		6000	5		Grid Array			4.75 V	1.5 mm	70 °C (158 °F)		1728 CLBS, 6000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B225		3.5 mm	27 mm	No	864 flip-flops; 3.3 V operation; OTP based						27 mm
XC3090-100PG175CSPC0109	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	320	CMOS		9000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	7 ns	320 CLBS, 9000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175		3.5052 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		100 MHz				42.164 mm
5962-01-395-2614	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No			CMOS	110		5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-PPGA-P132				No			70 MHz		110
XC3190L-2TQ176C	Xilinx	FPGA	Commercial	Gull Wing	176	LFQFP	Square	Plastic/Epoxy	320	Yes	3.6 V	320	CMOS	144	5000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	70 °C (158 °F)	2.2 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G176	3	1.6 mm	24 mm	No	Typical gates = 5000-6000	e0	325 MHz	30 s	144	225 °C (437 °F)	24 mm
XC3064-100PG132CSPC0108	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	224	CMOS		6400	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	7 ns	224 CLBS, 6400 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		100 MHz				37.084 mm
XC3020A-1PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic	64	No			CMOS	64		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P84				No		e0	325 MHz		64
XC3020-50PC68CSPC0110	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz				24.2316 mm
XC3030-125PG84CSPC0104	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	100	CMOS		3000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	5.5 ns	100 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e3	125 MHz				27.94 mm
XC3030-125PC84CSPC0104	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	5.5 ns	100 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		125 MHz				29.3116 mm
XC8106-3PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	1728	CMOS		6000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		1728 CLBS, 6000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	864 flip-flops; 3.3 V operation; OTP based						29.3116 mm
XC3164-3PP132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No	5.25 V	224	CMOS	110	4000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	2.7 ns	224 CLBS, 4000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132	1	3.7338 mm	37.084 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500		270 MHz		110		37.084 mm
XC6SLX100-3NCS484C	Xilinx	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911		338		1.2		Grid Array	BGA484,22X22,32		1.14 V	.8 mm	70 °C (158 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			338		19 mm
XC8100-2VQ44C	Xilinx	FPGA	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy		Yes	5.25 V	192	CMOS		600	5		Flatpack, Thin Profile			4.75 V	.8 mm	70 °C (158 °F)		192 CLBS, 600 Gates	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	96 flip-flops; 3.3 V operation; OTP based						10 mm
XC4005H-4PQ240C	Xilinx	FPGA	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	466	Yes	5.25 V	196	CMOS	192	4000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	70 °C (158 °F)	4 ns	196 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	3.75 mm	32 mm	No	MAX 192 I/OS; 392 flip-flops; typical gates = 4000 - 5000	e0	133.3 MHz	30 s	192	225 °C (437 °F)	32 mm
XC6SLX75-3NCS484C	Xilinx	FPGA	Commercial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831		328		1.2		Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	70 °C (158 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			328		19 mm
XC2018LPC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	100	CMOS		1500	3.3		Chip Carrier			3 V	1.27 mm	70 °C (158 °F)		100 CLBS, 1500 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 74 I/OS; 1200 to 1500 available gates						29.3116 mm
XC8103-3VQ44C	Xilinx	FPGA	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3000	5		Flatpack, Thin Profile			4.75 V	.8 mm	70 °C (158 °F)		1024 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	512 flip-flops; 3.3 V operation; OTP based						10 mm
XC8106-1BG225C	Xilinx	FPGA	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	1728	Yes	5.25 V	1728	CMOS	168	6000	5	3.3/5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	70 °C (158 °F)	5.4 ns	1728 CLBS, 6000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	864 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	168	225 °C (437 °F)	27 mm
XC4003H-4PG191C	Xilinx	FPGA	Commercial	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired	238	No	5.25 V	100	CMOS	160	2500	5	5 V	Grid Array	PGA191M,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4 ns	100 CLBS, 2500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P191		4.064 mm	47.244 mm	No	MAX 160 I/OS; 200 flip-flops; typical gates = 2500 - 3000		133.3 MHz		160		47.244 mm
5962-01-292-9185	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic	100	No			CMOS	74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P84				No			70 MHz		74
XC8109-ESPC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	2688	CMOS		8700	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	5.5 ns	2688 CLBS, 8700 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	MAX 61 I/OS; MAX 1344 flip-flops; OTP based						29.3116 mm
XC3090-125PP175CSPC0109	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Plastic/Epoxy		No	5.25 V	320	CMOS		9000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	5.5 ns	320 CLBS, 9000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P175		3.937 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		125 MHz				42.164 mm
XC4010-10PG191C	Xilinx	FPGA	Commercial	Pin/Peg		PGA		Ceramic	400	No			CMOS	160		5	5 V	Grid Array	PGA(UNSPEC)	Field Programmable Gate Arrays			70 °C (158 °F)			0 °C (32 °F)		Perpendicular					No			110 MHz		160
XCV405E-8BGG560C	Xilinx	FPGA	Commercial	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	1.89 V	2400	CMOS		129600	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	70 °C (158 °F)	0.4 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	416 MHz	30 s		260 °C (500 °F)	42.5 mm
XC3030-50PC44CSPC0107	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		100 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		2.35 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		50 MHz				16.5862 mm
XC3190-3PQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	138	5000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	2.7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.94 mm	28 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500	e0	270 MHz	30 s	138	225 °C (437 °F)	28 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.