Commercial Field Programmable Gate Arrays (FPGA) 800

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3020-50PG84CSPC0110	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	64	CMOS		2000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e3	50 MHz				27.94 mm
XC8101-3PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	384	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		384 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	192 flip-flops; 3.3 V operation; OTP based						29.3116 mm
XCV405E-7FG676C	Xilinx	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	70 °C (158 °F)	0.42 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	400 MHz	30 s	404	225 °C (437 °F)	27 mm
XC3195-4PP175C	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Plastic/Epoxy	484	No	5.25 V	484	CMOS	144	6500	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	3.3 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-PPGA-P175	1	3.937 mm	42.164 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000	e0	230 MHz		144		42.164 mm
XC3030-50PQ100CSPC0107	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		100 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100		3.1496 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				20 mm
XC3142-1PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes			CMOS	74		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	325 MHz	30 s	74	225 °C (437 °F)
XC3020-100PC84CSPC0110	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	7 ns	64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		100 MHz				29.3116 mm
XC2018-33PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic	100	No			CMOS	74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P84				No			33 MHz		74
XC4005H-4MQ240C	Xilinx	FPGA	Commercial	Gull Wing	240	FQFP	Square	Metal	466	Yes	5.25 V	196	CMOS	192	4000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	70 °C (158 °F)	4 ns	196 CLBS, 4000 Gates	0 °C (32 °F)		Quad	S-MQFP-G240	1	4.19 mm	31.64 mm	No	MAX 192 I/OS; 392 flip-flops; typical gates = 4000 - 5000		133.3 MHz		192		31.64 mm
XC8106-ESPQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	1728	CMOS		5616	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)	5.5 ns	1728 CLBS, 5616 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	MAX 78 I/OS; MAX 864 flip-flops; OTP based						20 mm
XC3090-50CQ164CSPC0109	Xilinx	FPGA	Commercial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	320	CMOS		9000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		50 MHz				27.432 mm
XC3142-3PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS	74	3000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	2.7 ns	144 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		270 MHz		74		27.94 mm
XC3120-5PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.25 V	64	CMOS	64	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1000-1500		188 MHz		64		27.94 mm
XC3142L-3TQ144C	Xilinx	FPGA	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	144	Yes	3.6 V	144	CMOS	96	2000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	70 °C (158 °F)	2.7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Typical gates = 2000-3000	e0	270 MHz	30 s	96	225 °C (437 °F)	20 mm
XC3195-5PG223C	Xilinx	FPGA	Commercial	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.25 V	484	CMOS	176	6500	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4.1 ns	484 CLBS, 6500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P223	1	4.064 mm	47.244 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000		190 MHz		176		47.244 mm
XC3020-70PQ100CSPC0110	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)	9 ns	64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.1496 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		70 MHz				20 mm
XC3130-3TQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	FQFP	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	80	2000	5	5 V	Flatpack, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	70 °C (158 °F)	2.7 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.75 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	270 MHz	30 s	80	225 °C (437 °F)	14 mm
XC3130-4TQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	FQFP	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	80	2000	5	5 V	Flatpack, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	70 °C (158 °F)	3.3 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.75 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	230 MHz	30 s	80	225 °C (437 °F)	14 mm
XC3190L-3PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	3.6 V	320	CMOS	70	5000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	70 °C (158 °F)	2.7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 5000-6000	e0	270 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3190-5PG175C	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No	5.25 V	320	CMOS	144	5000	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4.1 ns	320 CLBS, 5000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500		190 MHz		144		42.164 mm
XC8101-3PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	384	CMOS		1000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		384 CLBS, 1000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	192 flip-flops; 3.3 V operation; OTP based						20 mm
XC3020-50PC68CSPC0107	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz				24.2316 mm
XC3090-125PC84CSPC0109	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS		9000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	5.5 ns	320 CLBS, 9000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 70 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		125 MHz				29.3116 mm
XCV812E-7BG560C	Xilinx	FPGA	Commercial	Ball	560	LBGA	Square	Plastic/Epoxy	21168	Yes	1.89 V	4704	CMOS	404	254016	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	70 °C (158 °F)	0.42 ns	4704 CLBS, 254016 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	400 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC8106-1PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	1728	Yes	5.25 V	1728	CMOS	168	6000	5	3.3/5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	5.4 ns	1728 CLBS, 6000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	864 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	168	225 °C (437 °F)	20 mm
5962-01-309-5037	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	58		5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J68				No			70 MHz		58
XC3090-70PC84CSPC0109	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS		9000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	9 ns	320 CLBS, 9000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 70 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				29.3116 mm
XC3142-4PG132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS	96	3000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	3.3 ns	144 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		230 MHz		96		37.084 mm
XC8103-1PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	5.4 ns	1024 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No	512 flip-flops; 3.3 V operation; OTP based		144 MHz				16.5862 mm
XC3142-5PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	82	3000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	4.1 ns	144 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	190 MHz	30 s	82	225 °C (437 °F)	20 mm
XC8106-1PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	1728	Yes	5.25 V	1728	CMOS	168	6000	5	3.3/5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	5.4 ns	1728 CLBS, 6000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	864 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	168	225 °C (437 °F)	29.3116 mm
XC8106-ESPC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	1728	CMOS		5616	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	5.5 ns	1728 CLBS, 5616 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	MAX 61 I/OS; MAX 864 flip-flops; OTP based						29.3116 mm
XC8101-2PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	384	CMOS		1000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		384 CLBS, 1000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	192 flip-flops; 3.3 V operation; OTP based						20 mm
XC3020-70PC68CSPC0110	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	9 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				24.2316 mm
XC8103-ESPC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3328	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	5.5 ns	1024 CLBS, 3328 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	MAX 61 I/OS; MAX 512 flip-flops; OTP based						29.3116 mm
XC3020A-2PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic	64	No			CMOS	64		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P84				No		e0	325 MHz		64
XC3042-125CQ100C	Xilinx	FPGA	Commercial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	144	CMOS		4200	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	5.5 ns	144 CLBS, 4200 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 82 I/OS; 480 flip-flops	e0	125 MHz				17.272 mm
XCV812E-7BGG560C	Xilinx	FPGA	Commercial	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	1.89 V	4704	CMOS		254016	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	70 °C (158 °F)	0.42 ns	4704 CLBS, 254016 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	400 MHz	30 s		260 °C (500 °F)	42.5 mm
XC2018LVQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	100	CMOS		1500	3.3		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	70 °C (158 °F)		100 CLBS, 1500 Gates	0 °C (32 °F)		Quad	S-PQFP-G100		1.32 mm	14 mm	No	MAX 74 I/OS; 1200 to 1500 available gates						14 mm
XC3190L-2TQ144C	Xilinx	FPGA	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	320	Yes	3.6 V	320	CMOS	122	5000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	70 °C (158 °F)	2.2 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Typical gates = 5000-6000	e0	325 MHz	30 s	122	225 °C (437 °F)	20 mm
XC8103-2PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		1024 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	512 flip-flops; 3.3 V operation; OTP based						29.3116 mm
XC3042-50PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	74	4200	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)		144 CLBS, 4200 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 74 I/OS; 480 flip-flops	e0	50 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3120-5PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	4.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 1000-1500	e0	188 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC8101-1PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	384	Yes	5.25 V	384	CMOS	80	1000	5	3.3/5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	5.4 ns	384 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	192 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	80	225 °C (437 °F)	20 mm
XC3090-70PG175CSPC0109	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	320	CMOS		9000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	9 ns	320 CLBS, 9000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175		3.5052 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		70 MHz				42.164 mm
XC3090-125PG175CSPC0109	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	320	CMOS		9000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	5.5 ns	320 CLBS, 9000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175		3.5052 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		125 MHz				42.164 mm
XC4025E-4HQ208C	Xilinx	FPGA	Commercial	Gull Wing	208	HLFQFP	Square	Plastic/Epoxy	1024	Yes			CMOS	256		5	5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		.5 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3			No		e0		30 s	256	225 °C (437 °F)
XC3020A-2PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes			CMOS	64		5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3			No		e0	325 MHz	30 s	64	225 °C (437 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.