Commercial Field Programmable Gate Arrays (FPGA) 800

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3142-4PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS	74	3000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	3.3 ns	144 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		230 MHz		74		27.94 mm
XC3190L-3TQ176C	Xilinx	FPGA	Commercial	Gull Wing	176	LFQFP	Square	Plastic/Epoxy	320	Yes	3.6 V	320	CMOS	144	5000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	70 °C (158 °F)	2.7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G176	3	1.6 mm	24 mm	No	Typical gates = 5000-6000	e0	270 MHz	30 s	144	225 °C (437 °F)	24 mm
XC3130-5PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	80	2000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	4.1 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	190 MHz	30 s	80	225 °C (437 °F)	20 mm
XC3142-2PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic	144	No			CMOS	74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P84				No			325 MHz		74
XC3190-5PQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	138	5000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	4.1 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.94 mm	28 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500	e0	190 MHz	30 s	138	225 °C (437 °F)	28 mm
XC3042-50PG132CSPC0107	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	144	CMOS		4200	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)		144 CLBS, 4200 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C	e3	50 MHz				37.084 mm
XC3042-50CQ100CSPC0107	Xilinx	FPGA	Commercial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	144	CMOS		4200	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)		144 CLBS, 4200 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 82 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				17.272 mm
XCV812E-7FGG900C	Xilinx	FPGA	Commercial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.89 V	4704	CMOS		254016	1.8		Grid Array			1.71 V	1 mm	70 °C (158 °F)	0.42 ns	4704 CLBS, 254016 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	400 MHz	30 s		250 °C (482 °F)	31 mm
XC6SLX150-1LCS484C	Xilinx	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519		338		1		Grid Array	BGA484,22X22,32		.95 V	.8 mm	70 °C (158 °F)	0.46 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			338		19 mm
XC3090-50PP175CSPC0109	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Plastic/Epoxy		No	5.25 V	320	CMOS		9000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P175		3.937 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		50 MHz				42.164 mm
XC4006-10PG156C	Xilinx	FPGA	Commercial	Pin/Peg	156	PGA	Square	Ceramic	608	No			CMOS	125		5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P156				No			110 MHz		125
XC3020-125PG84CSPC0110	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	64	CMOS		2000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	5.5 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e3	125 MHz				27.94 mm
XC3020-100PG84CSPC0110	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	64	CMOS		2000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	7 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e3	100 MHz				27.94 mm
XC3090-100CQ164C	Xilinx	FPGA	Commercial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes	5.25 V	320	CMOS	142	9000	5	5 V	Flatpack	QFL164,1.2SQ,25	Field Programmable Gate Arrays	4.75 V	.635 mm	70 °C (158 °F)	7 ns	320 CLBS, 9000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F164	1	3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops	e0	100 MHz		142		27.432 mm
XC3142-3PG132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS	96	3000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	2.7 ns	144 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		270 MHz		96		37.084 mm
XC3090-70CQ164CSPC0107	Xilinx	FPGA	Commercial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	320	CMOS		9000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	9 ns	320 CLBS, 9000 Gates	0 °C (32 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		70 MHz				27.432 mm
XC3030-50PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.25 V	100	CMOS	74	3000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)		100 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 74 I/OS; 360 flip-flops		50 MHz		74		27.94 mm
XC4010-7PG191C	Xilinx	FPGA	Commercial	Pin/Peg		PGA		Ceramic	400	No			CMOS	160		5	5 V	Grid Array	PGA(UNSPEC)	Field Programmable Gate Arrays			70 °C (158 °F)			0 °C (32 °F)		Perpendicular					No			110 MHz		160
XC3142-1PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic	144	No			CMOS	74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P84				No			325 MHz		74
XC2064-70PD48C	Xilinx	FPGA	Commercial	Through-Hole	48	DIP	Rectangular	Plastic	64	No			CMOS	40		5	5 V	In-Line	DIP48,.6	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T48				No			70 MHz		40
XCV405E-6FG676C	Xilinx	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	70 °C (158 °F)	0.47 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	357 MHz	30 s	404	225 °C (437 °F)	27 mm
XC3064-50PG132CSPC0107	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	224	CMOS		6400	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)		224 CLBS, 6400 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		50 MHz				37.084 mm
XC6SLX75T-3NCS484C	Xilinx	FPGA	Commercial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831		292		1.2		Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	70 °C (158 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			292		19 mm
5962-01-378-2415	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	74		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J84				No			70 MHz		74
XC8109-3PQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	2688	CMOS		9000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		2688 CLBS, 9000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	1344 flip-flops; 3.3 V operation; OTP based						28 mm
5962-01-387-9466	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	58		5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J68				No			100 MHz		58
XC3195-3PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS	70	6500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	2.7 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000	e0	270 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC8101-3PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	384	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		384 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No	192 flip-flops; 3.3 V operation; OTP based						16.5862 mm
XCV812E-6BG560C	Xilinx	FPGA	Commercial	Ball	560	LBGA	Square	Plastic/Epoxy	21168	Yes	1.89 V	4704	CMOS	404	254016	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	70 °C (158 °F)	0.47 ns	4704 CLBS, 254016 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	357 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC3142-3PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	74	3000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	2.7 ns	144 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	270 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XCV405E-8FG676C	Xilinx	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	70 °C (158 °F)	0.4 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	416 MHz	30 s	404	225 °C (437 °F)	27 mm
XC8109-1BG225C	Xilinx	FPGA	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	2688	Yes	5.25 V	2688	CMOS	208	9000	5	3.3/5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	70 °C (158 °F)	5.4 ns	2688 CLBS, 9000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	1344 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	208	225 °C (437 °F)	27 mm
XC3142-5TQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	FQFP	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	82	3000	5	5 V	Flatpack, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	70 °C (158 °F)	4.1 ns	144 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.75 mm	14 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	190 MHz	30 s	82	225 °C (437 °F)	14 mm
XC3142-1PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes			CMOS	82		5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3			No		e0	325 MHz	30 s	82	225 °C (437 °F)
XC3030-100PC84CSPC0104	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	7 ns	100 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		100 MHz				29.3116 mm
XC3130-3PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	80	2000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	2.7 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	270 MHz	30 s	80	225 °C (437 °F)	20 mm
XCV812E-8FGG900C	Xilinx	FPGA	Commercial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.89 V	4704	CMOS		254016	1.8		Grid Array			1.71 V	1 mm	70 °C (158 °F)	0.4 ns	4704 CLBS, 254016 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	416 MHz	30 s		250 °C (482 °F)	31 mm
XC3164-5PG132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	224	No	5.25 V	224	CMOS	110	4000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4.1 ns	224 CLBS, 4000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500		190 MHz		110		37.084 mm
XC3030-50PC68CSPC0107	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		100 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				24.2316 mm
XC3164-4PQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	120	4000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	3.3 ns	224 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.94 mm	28 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500	e0	230 MHz	30 s	120	225 °C (437 °F)	28 mm
XC3120-4PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	1000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	3.3 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 1000-1500	e0	227 MHz	30 s	64	225 °C (437 °F)	20 mm
XC3190L-3TQ144C	Xilinx	FPGA	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	320	Yes	3.6 V	320	CMOS	122	5000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	70 °C (158 °F)	2.7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Typical gates = 5000-6000	e0	270 MHz	30 s	122	225 °C (437 °F)	20 mm
XC3064-50PP132CSPC0107	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.25 V	224	CMOS		6400	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)		224 CLBS, 6400 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132		4.191 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		50 MHz				37.084 mm
XC3195-4PG223C	Xilinx	FPGA	Commercial	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.25 V	484	CMOS	176	6500	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	3.3 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P223	1	4.064 mm	47.244 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000	e0	230 MHz		176		47.244 mm
XC8100-1PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	192	Yes	5.25 V	192	CMOS	32	600	5	3.3/5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	5.4 ns	192 CLBS, 600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	96 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	32	225 °C (437 °F)	16.5862 mm
XC3120-5PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	1000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	4.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 1000-1500	e0	188 MHz	30 s	64	225 °C (437 °F)	20 mm
XC3195-3PQ208C	Xilinx	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS	176	6500	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	70 °C (158 °F)	2.7 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000	e0	270 MHz	30 s	176	225 °C (437 °F)	28 mm
XC3030-70PQ100CSPC0104	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)	9 ns	100 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100		3.1496 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.