Commercial Field Programmable Gate Arrays (FPGA) 800

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
M7A3P1000-PQ208	Microsemi	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5			Flatpack, Fine Pitch			1.425 V	.5 mm	70 °C (158 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	350 MHz				28 mm
XC3020-50PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	58	2000	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68	1	4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops		50 MHz		58		24.2316 mm
XC3020-50PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.25 V	64	CMOS	64	2000	5		5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops		50 MHz		64		27.94 mm
A3P1000-2FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
APA150-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	2.7 V		CMOS	100	150000	2.5	Tray	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	2.3 V	1 mm	70 °C (158 °F)		150000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	180 MHz	30 s	100	260 °C (500 °F)	13 mm
AX2000-FG896	Microchip Technology	FPGA	Commercial	Ball	896	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	21504	CMOS	684	2000000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)	0.99 ns	21504 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No	2000000 system gates avaiable	e0	649 MHz	20 s	684	225 °C (437 °F)	31 mm
A42MX16-PL84	Microsemi	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	1232	CMOS		24000	3.3			Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	2.8 ns	1232 CLBS, 24000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e0	94 MHz				29.3116 mm
A42MX16-PLG84	Microchip Technology	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	1232	CMOS		24000	3.3	Tube		Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	2.8 ns	1232 CLBS, 24000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3	94 MHz				29.3116 mm
OR4E02-1BA352C	Lattice Semiconductor	FPGA	Commercial	Ball	352	BGA	Square	Plastic/Epoxy	4992	Yes	1.575 V	624	CMOS	262	201000	1.5		1.5/3.3 V	Grid Array	BGA352,26X26,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	70 °C (158 °F)	1.1 ns	624 CLBS, 201000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B352	3	2.54 mm	35 mm	No	Maximum no of usable gates is 397000		420 MHz	30 s	262	225 °C (437 °F)	35 mm
A3P060-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS		60000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P1000-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P125-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS		125000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P600-FGG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		600000	1.5			Grid Array			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
A3PE1500-2FG676	Microchip Technology	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.575 V	38400	CMOS		1500000	1.5	Tray		Grid Array			1.425 V	1 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0					27 mm
A3PE1500-2FGG676	Microchip Technology	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.575 V	38400	CMOS		1500000	1.5	Tray		Grid Array			1.425 V	1 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1		30 s		250 °C (482 °F)	27 mm
A3PE1500-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS	147	1500000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	147	245 °C (473 °F)	28 mm
A3PE3000L-FGG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	250 MHz	30 s	341	250 °C (482 °F)	23 mm
A3PE3000L-FGG896	Microchip Technology	FPGA	Commercial	Ball	896	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	620	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No		e1	250 MHz	30 s	620	245 °C (473 °F)	31 mm
A40MX04-FPLG44	Microchip Technology	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	547	CMOS		6000	3.3	Tube		Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	3.7 ns	547 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Also Operates at 5 V supply	e3	48 MHz				16.5862 mm
A42MX09-VQG100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	684	Yes	3.6 V	684	CMOS	104	14000	3.3	Tray	3.3,3.3/5,5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	70 °C (158 °F)	2.5 ns	684 CLBS, 14000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Also Operates at 5 V supply	e3	117 MHz		104		14 mm
A42MX16-PQG160	Microchip Technology	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	3.6 V	1232	CMOS		24000	3.3	Tray		Flatpack			3 V	.65 mm	70 °C (158 °F)	2.8 ns	1232 CLBS, 24000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Also Operates at 5 V supply	e3	94 MHz	30 s		245 °C (473 °F)	28 mm
A42MX16-VQG100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1232	Yes	3.6 V	1232	CMOS		24000	3.3	Tray		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm	70 °C (158 °F)	2.8 ns	1232 CLBS, 24000 Gates	0 °C (32 °F)		Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Also Operates at 5 V supply		94 MHz				14 mm
A42MX24-PLG84	Microchip Technology	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	1866	Yes	3.6 V	1890	CMOS	176	36000	3.3	Tube	3.3,3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	70 °C (158 °F)	2.5 ns	1890 CLBS, 36000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3			176		29.3116 mm
A54SX08A-FTQG144	Microchip Technology	FPGA	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	768	Yes	2.75 V	768	CMOS	113	12000	2.5	Tray	2.5,3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	70 °C (158 °F)	1.7 ns	768 CLBS, 12000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	8000 typical gates available	e3	172 MHz		113		20 mm
APA600-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS	158	600000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	70 °C (158 °F)		600000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
M1A3PE3000-1FGG896	Microchip Technology	FPGA	Commercial	Ball	896	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	620	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No		e1	350 MHz	30 s	620	245 °C (473 °F)	31 mm
TPC1020BVE-100C1	Texas Instruments	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	547	Yes			CMOS	69		5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	R-PQFP-G100				No					69
TPC1010BFN-044C	Texas Instruments	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	295	Yes	5.25 V	295	CMOS	57	1200	5		5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	16.632 ns	295 CLBS, 1200 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	MAX 34 I/OS; 130 flip-flops		100 MHz		57		16.5862 mm
TPC1280VE-160C1	Texas Instruments	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	1232	CMOS		8000	5			Flatpack			4.75 V	.65 mm	70 °C (158 °F)		1232 CLBS, 8000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.07 mm	28 mm	No			65 MHz				28 mm
TPC1280GB-177C	Texas Instruments	FPGA	Commercial	Pin/Peg	177	HPGA	Square	Ceramic, Metal-Sealed Cofired	1232	No	5.25 V	1232	CMOS	140	8000	5		5 V	Grid Array, Heat Sink/Slug	HPGA177,15X15	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	16.38 ns	1232 CLBS, 8000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P177		5.46 mm	39.88 mm	No	MAX 140 I/OS; 998 flip-flops		48 MHz		140		39.88 mm
TPC1280VE-160C	Texas Instruments	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	1232	CMOS		8000	5			Flatpack			4.75 V	.65 mm	70 °C (158 °F)		1232 CLBS, 8000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.07 mm	28 mm	No			48 MHz				28 mm
TPC1020BFN-084C2	Texas Instruments	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	547	Yes			CMOS	69		5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J84				No					69
TPC1280VB-160C	Texas Instruments	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	1232	Yes	5.25 V	1232	CMOS	140	8000	5		5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)		1232 CLBS, 8000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.07 mm	28 mm	No			48 MHz		140		28 mm
TPC1020AVE-100C1	Texas Instruments	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	547	Yes	5.25 V	547	CMOS	69	2000	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	13.824 ns	547 CLBS, 2000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	MAX 69 I/OS; 273 flip-flops				69		20 mm
TPC1225AFN-84C1	Texas Instruments	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	451	Yes	5.25 V	451	CMOS	83	2500	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)		451 CLBS, 2500 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No			85 MHz		83		29.3116 mm
TPC1225GB100C	Texas Instruments	FPGA	Commercial	Pin/Peg	100	PGA	Square	Ceramic	451	No			CMOS	83		5		5 V	Grid Array	PGA100(UNSPEC)	Field Programmable Gate Arrays			70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P100				No			75 MHz		83
TPC1425FN-84C	Texas Instruments	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS						Chip Carrier				1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No							29.3116 mm
TPC1225AVE-100C	Texas Instruments	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	451	Yes	5.25 V	451	CMOS	83	2500	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)		451 CLBS, 2500 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			75 MHz		83		20 mm
TPC1020AFJ-084C	Texas Instruments	FPGA	Commercial	J Bend	84	QCCJ	Square	Ceramic	547	Yes			CMOS	69		5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-XQCC-J84				No					69
TPC1240GB-133C1	Texas Instruments	FPGA	Commercial	Pin/Peg	133	PGA	Square	Ceramic, Metal-Sealed Cofired	684	No	5.25 V	684	CMOS	104	4000	5		5 V	Grid Array	PGA133M,13X13	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)		684 CLBS, 4000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P133		4.27 mm	34.544 mm	No			75 MHz		104		34.544 mm
TPC1225AFN-84C	Texas Instruments	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	451	Yes	5.25 V	451	CMOS	83	2500	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)		451 CLBS, 2500 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No			75 MHz		83		29.3116 mm
TPC1010BFN-044C1	Texas Instruments	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	295	Yes	5.25 V	295	CMOS	57	1200	5		5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	13.824 ns	295 CLBS, 1200 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	MAX 34 I/OS; 130 flip-flops				57		16.5862 mm
TPC1280GB-176C	Texas Instruments	FPGA	Commercial	Pin/Peg	176	HPGA	Square	Ceramic, Metal-Sealed Cofired	1232	No	5.25 V	1232	CMOS	140	8000	5		5 V	Grid Array, Heat Sink/Slug	HPGA176,15X15	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	16.38 ns	1232 CLBS, 8000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P176		5.46 mm	39.88 mm	No	MAX 140 I/OS; 998 flip-flops		48 MHz		140		39.88 mm
TPC1425GB-133C	Texas Instruments	FPGA	Commercial	Pin/Peg	133	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS						Grid Array				2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-CPGA-P133		4.27 mm	34.544 mm	No	MAX 100 I/OS						34.544 mm
TPC1280GB-177C1	Texas Instruments	FPGA	Commercial	Pin/Peg	177	HPGA	Square	Ceramic, Metal-Sealed Cofired	1232	No	5.25 V	1232	CMOS	140	8000	5		5 V	Grid Array, Heat Sink/Slug	HPGA177,15X15	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)		1232 CLBS, 8000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P177		5.46 mm	39.88 mm	No	MAX 140 I/OS; 998 flip-flops		65 MHz		140		39.88 mm
TPC1010BVE-100C	Texas Instruments	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	295	Yes			CMOS	57		5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	R-PQFP-G100				No					57
TPC1020AVE-100C	Texas Instruments	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	547	Yes	5.25 V	547	CMOS	69	2000	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	16.632 ns	547 CLBS, 2000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	MAX 69 I/OS; 273 flip-flops		100 MHz		69		20 mm
TPC1280GB-176C1	Texas Instruments	FPGA	Commercial	Pin/Peg	176	HPGA	Square	Ceramic, Metal-Sealed Cofired	1232	No	5.25 V	1232	CMOS	140	8000	5		5 V	Grid Array, Heat Sink/Slug	HPGA176,15X15	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)		1232 CLBS, 8000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P176		5.46 mm	39.88 mm	No	MAX 140 I/OS; 998 flip-flops		65 MHz		140		39.88 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.