Commercial Field Programmable Gate Arrays (FPGA) 800

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
A54SX32ACQ208	Microsemi	FPGA	Commercial	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	174	48000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	70 °C (158 °F)	1.2 ns	2880 CLBS, 48000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32A-CQ208	Microchip Technology	FPGA	Commercial	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	174	48000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	70 °C (158 °F)	1.2 ns	2880 CLBS, 48000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32CQ208	Actel	FPGA	Commercial	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	246	32000	3.3		3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	70 °C (158 °F)	1 ns	2880 CLBS, 32000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	205 MHz		246	225 °C (437 °F)	29.21 mm
M1A3P600-FG256	Microchip Technology	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		600000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
M7AFS600-FGG256	Microchip Technology	FPGA	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		600000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	70 °C (158 °F)		600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		30 s		250 °C (482 °F)	17 mm
A3P060-2VQ100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS		60000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	350 MHz				14 mm
A3PE3000L-1PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	147	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	250 MHz	30 s	147	245 °C (473 °F)	28 mm
M7A3P600-FG256	Microsemi	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS	177	600000	1.5		1.8/2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		600000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No			350 MHz		177		17 mm
A3P030-1QNG48	Microchip Technology	FPGA	Commercial	No Lead	48	HQCCN	Square			Yes	1.575 V	768	CMOS		30000	1.5	Tray		Chip Carrier, Heat Sink/Slug			1.425 V	.4 mm	85 °C (185 °F)		768 CLBS, 30000 Gates	0 °C (32 °F)		Quad	S-XQCC-N48	3		6 mm	No			350 MHz				6 mm
A3P060-1VQG100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS		60000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	350 MHz				14 mm
A3P125-1TQG144	Microchip Technology	FPGA	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS		125000	1.5	Tray		Flatpack, Low Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	350 MHz				20 mm
A3P400-2PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	9216	CMOS		400000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		9216 CLBS, 400000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
A3PE3000-FG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	341	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	350 MHz		341		23 mm
APA600-BG456	Microchip Technology	FPGA	Commercial	Ball	456	BGA	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS	356	600000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA456,26X26,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	70 °C (158 °F)		600000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B456	3	2.54 mm	35 mm	No			180 MHz		356		35 mm
AX250-FGG256	Microchip Technology	FPGA	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	4224	Yes	1.575 V	2816	CMOS	248	250000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)	0.99 ns	2816 CLBS, 250000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No	250000 system gates avaiable	e1	649 MHz	30 s	248	250 °C (482 °F)	17 mm
EX64TQ64	Actel	FPGA	Commercial	Gull Wing	64	LFQFP	Square	Plastic/Epoxy	192	Yes	2.7 V	128	CMOS	41	3000	2.5		2.5,2.5/5 V	Flatpack, Low Profile, Fine Pitch	QFP64,.47SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	70 °C (158 °F)	1 ns	128 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.6 mm	10 mm	No	Also requires 2.5 V OR 3.3 V OR 5 V supply	e0	250 MHz		41		10 mm
M1A3P400-FG256	Microchip Technology	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	9216	CMOS		400000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		9216 CLBS, 400000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
M1A3P600-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		600000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
M1A3P600-FGG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		600000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
A3P030-QNG48	Microchip Technology	FPGA	Commercial	No Lead	48	HQCCN	Square			Yes	1.575 V	768	CMOS		30000	1.5			Chip Carrier, Heat Sink/Slug			1.425 V	.4 mm	85 °C (185 °F)		768 CLBS, 30000 Gates	0 °C (32 °F)		Quad	S-XQCC-N48	3		6 mm	No			350 MHz				6 mm
A3P030-VQG100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	768	CMOS		30000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		768 CLBS, 30000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	350 MHz				14 mm
A3P1000L-PQG208	Microsemi	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	154	1000000	1.2		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	70 °C (158 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz		154		28 mm
A3P125-VQ100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS		125000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	350 MHz				14 mm
A3PE1500-FGG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS	280	1500000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s	280	250 °C (482 °F)	23 mm
A3PE3000-2PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	147	3000000	1.5		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	147	245 °C (473 °F)	28 mm
A42MX16-FPL84	Microsemi	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	1232	CMOS		24000	3.3			Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	4 ns	1232 CLBS, 24000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e0	56 MHz				29.3116 mm
AGLN125V2-CSG81Y	Microchip Technology	FPGA	Commercial	Ball	81	VFBGA	Square	Plastic/Epoxy	3072	Yes	1.575 V	3072	CMOS	60	125000	1.2		1.2/1.5 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,20	Field Programmable Gate Arrays	1.14 V	.5 mm	70 °C (158 °F)		3072 CLBS, 125000 Gates	-20 °C (-4 °F)		Bottom	S-PBGA-B81	3	.8 mm	5 mm	No			160 MHz	30 s	60	260 °C (500 °F)	5 mm
AX250-2FG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	4224	Yes	1.575 V	2816	CMOS	248	250000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)	0.74 ns	2816 CLBS, 250000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	27 mm	No	250000 system gates avaiable	e0	870 MHz		248		27 mm
XC3020-50PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	2000	5		5 V	Flatpack	QFP100,.7X1.0	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.1496 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops	e0	50 MHz	30 s	64	225 °C (437 °F)	20 mm
XC3130-4PC44C	Rochester Electronics	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		2000	5			Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	3.3 ns	100 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700		230 MHz				16.5862 mm
XC3130-4PC68C	Rochester Electronics	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		2000	5			Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	3.3 ns	100 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700		230 MHz				24.2316 mm
XC3130-4PC84C	Rochester Electronics	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		2000	5			Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	3.3 ns	100 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700		230 MHz				29.3116 mm
XC3130-5PC44C	Rochester Electronics	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		2000	5			Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	4.1 ns	100 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700		190 MHz				16.5862 mm
XC3130-5TQ100C	Rochester Electronics	FPGA	Commercial	Gull Wing	100	FQFP	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		2000	5			Flatpack, Fine Pitch			4.75 V	.5 mm	70 °C (158 °F)	4.1 ns	100 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQFP-G100		1.75 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700		190 MHz				14 mm
A1280XL-PQ160C	Microsemi	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	1232	Yes			CMOS	125		5		5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQFP-G160				No			143 MHz		125
A1280XLPQ160C	Actel	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	1232	Yes	5.25 V	1232	CMOS	140	8000	5		5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)		1232 CLBS, 8000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e0	130 MHz		140		28 mm
A3P125-1PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS		125000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
A3P250-FG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	0 °C (32 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz				13 mm
A3PE1500-FG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS	280	1500000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0			280		23 mm
A40MX04-PLG44	Microchip Technology	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	547	CMOS		6000	3.3	Tube		Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	2.7 ns	547 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Also Operates at 5 V supply	e3	80 MHz				16.5862 mm
APA600-FG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS	370	600000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	2.3 V	1 mm	70 °C (158 °F)		600000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	180 MHz		370		23 mm
APA600-FGG256	Microchip Technology	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS	186	600000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.3 V	1 mm	70 °C (158 °F)		600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	180 MHz	30 s	186	250 °C (482 °F)	17 mm
M1A3P1000-FG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	350 MHz				23 mm
M1A3P1000L-1PQ208	Microsemi	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	154	1000000	1.2		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	70 °C (158 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	350 MHz		154		28 mm
M1A3P1000L-1PQG208	Microsemi	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	154	1000000	1.2		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	70 °C (158 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz		154		28 mm
M1A3PE1500-FG676	Microchip Technology	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS	444	1500000	1.5	Tray	1.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	350 MHz		444		27 mm
M1A3PE1500-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS	147	1500000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	147	245 °C (473 °F)	28 mm
M7A3P1000-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	97	1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	70 °C (158 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.