Commercial Field Programmable Gate Arrays (FPGA) 800

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3020-50PG84CSPC0107	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	64	CMOS		2000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e3	50 MHz				27.94 mm
XC6SLX100-1LCS484C	Xilinx	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.05 V	7911		338		1		Grid Array	BGA484,22X22,32		.95 V	.8 mm	70 °C (158 °F)	0.46 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			338		19 mm
XC3195-4PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS	70	6500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	3.3 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000	e0	230 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3064-50PP132CSPC0108	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.25 V	224	CMOS		6400	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)		224 CLBS, 6400 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132		4.191 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		50 MHz				37.084 mm
XC3030-70PG84CSPC0104	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	100	CMOS		3000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	9 ns	100 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e3	70 MHz				27.94 mm
XC4005-7PG156C	Xilinx	FPGA	Commercial	Pin/Peg	156	PGA	Square	Ceramic	196	No			CMOS	112		5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P156				No			110 MHz		112
XC3064-50PQ160CSPC0107	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	224	CMOS		6400	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		224 CLBS, 6400 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160		4.1 mm	28 mm	No	MAX 120 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				28 mm
XC8109-1PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	2688	Yes	5.25 V	2688	CMOS	208	9000	5	3.3/5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	5.4 ns	2688 CLBS, 9000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	1344 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	208	225 °C (437 °F)	29.3116 mm
XC3142-5PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	74	3000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	4.1 ns	144 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	190 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3164-4PG132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	224	No	5.25 V	224	CMOS	110	4000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	3.3 ns	224 CLBS, 4000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500		230 MHz		110		37.084 mm
XC8103-1PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	1024	Yes	5.25 V	1024	CMOS	128	3000	5	3.3/5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	5.4 ns	1024 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	512 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	128	225 °C (437 °F)	20 mm
XC3030-70PC68CSPC0104	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	9 ns	100 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				24.2316 mm
XC3042-100CQ100CSPC0107	Xilinx	FPGA	Commercial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	144	CMOS		4200	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	7 ns	144 CLBS, 4200 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 82 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C	e0	100 MHz				17.272 mm
XC3164-3PQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	120	4000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	2.7 ns	224 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.94 mm	28 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500	e0	270 MHz	30 s	120	225 °C (437 °F)	28 mm
XC3090-50PQ160CSPC0109	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS		9000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160		4.1 mm	28 mm	No	MAX 137 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				28 mm
XC3090-50PC84CSPC0107	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS		9000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 70 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				29.3116 mm
XC3195-5PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS	70	6500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	4.1 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000	e0	190 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3120-4PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.25 V	64	CMOS	64	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	3.3 ns	64 CLBS, 1000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1000-1500		227 MHz		64		27.94 mm
XC3142-5PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS	74	3000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4.1 ns	144 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		190 MHz		74		27.94 mm
XC3064L-8PC84I	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	3.6 V	224	CMOS	70	3500	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	70 °C (158 °F)	6.7 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 4500 Logic gates	e0	80 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3042-50PC84CSPC0107	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS		4200	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		144 CLBS, 4200 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 74 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C		50 MHz				29.3116 mm
XC3130-5PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	2000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	4.1 ns	100 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700		190 MHz		58		24.2316 mm
XC3030-50PG84CSPC0107	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	100	CMOS		3000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)		100 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e3	50 MHz				27.94 mm
XC2018-33PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	74		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	33 MHz	30 s	74	225 °C (437 °F)
XC3130-4PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	80	2000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	3.3 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	230 MHz	30 s	80	225 °C (437 °F)	20 mm
XC3190-4PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	70	5000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	3.3 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500	e0	230 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XCV405E-8BG560C	Xilinx	FPGA	Commercial	Ball	560	LBGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	70 °C (158 °F)	0.4 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	416 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC3020-50CQ100CSPC0110	Xilinx	FPGA	Commercial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	64	CMOS		2000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				17.272 mm
XCV812E-8BG560C	Xilinx	FPGA	Commercial	Ball	560	LBGA	Square	Plastic/Epoxy	21168	Yes	1.89 V	4704	CMOS	404	254016	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	70 °C (158 °F)	0.4 ns	4704 CLBS, 254016 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	416 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC3030-70PC44CSPC0104	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	9 ns	100 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				16.5862 mm
5962-01-394-9044	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes			CMOS	70		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J84				No			70 MHz		70
XC3195-5PP175C	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Plastic/Epoxy	484	No	5.25 V	484	CMOS	144	6500	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4.1 ns	484 CLBS, 6500 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P175	1	3.937 mm	42.164 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000		190 MHz		144		42.164 mm
XC3142-4PP132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No	5.25 V	144	CMOS	96	3000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	3.3 ns	144 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132	1	3.7338 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		230 MHz		96		37.084 mm
XC3330-100PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	58		5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J68				No			100 MHz		58
XC8109-1PG223C	Xilinx	FPGA	Commercial	Pin/Peg	223	PGA	Square	Ceramic	2688	No			CMOS	208			3.3/5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P223				No			144 MHz		208
XC3042-50PG132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS	96	4200	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)		144 CLBS, 4200 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops		50 MHz		96		37.084 mm
XC3090-50PG175C	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No	5.25 V	320	CMOS	144	9000	5	5 V	Grid Array	PGA176,16X16MOD	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175		3.5052 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops		50 MHz		144		42.164 mm
XC3020-50PQ100CSPC0107	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.1496 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz				20 mm
XC4004A-4PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	61	3200	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	4 ns	144 CLBS, 3200 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3200 - 4000	e0	133.3 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC4005-7PQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	196	Yes			CMOS	112		5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3			No		e0	110 MHz	30 s	112	225 °C (437 °F)
XC4003-7PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	238	Yes			CMOS	61		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	110 MHz	30 s	61	225 °C (437 °F)
XC3020-70CQ100CSPC0107	Xilinx	FPGA	Commercial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	64	CMOS		2000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	9 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				17.272 mm
XC4005-7PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes			CMOS	112		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	110 MHz	30 s	112	225 °C (437 °F)
XC3130-3PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	2000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	2.7 ns	100 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700		270 MHz		58		24.2316 mm
XC3342-100PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes			CMOS	82		5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3			No		e0	100 MHz	30 s	82	225 °C (437 °F)
XC3020-100PQ100CSPC0110	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)	7 ns	64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.1496 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		100 MHz				20 mm
XC3164-5PP132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No	5.25 V	224	CMOS	110	4000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4.1 ns	224 CLBS, 4000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132	1	3.7338 mm	37.084 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500		190 MHz		110		37.084 mm
XC8101-3VQ44C	Xilinx	FPGA	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy		Yes	5.25 V	384	CMOS		1000	5		Flatpack, Thin Profile			4.75 V	.8 mm	70 °C (158 °F)		384 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	192 flip-flops; 3.3 V operation; OTP based						10 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.