Commercial Field Programmable Gate Arrays (FPGA) 800

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC8106-2PQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	1728	CMOS		6000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		1728 CLBS, 6000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	864 flip-flops; 3.3 V operation; OTP based						28 mm
XC6SLX45T-3NCS484C	Xilinx	FPGA	Commercial	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411		296		1.2		Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	70 °C (158 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			296		19 mm
XC8109-1PQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	2688	Yes	5.25 V	2688	CMOS	208	9000	5	3.3/5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	5.4 ns	2688 CLBS, 9000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	1344 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	208	225 °C (437 °F)	28 mm
XC8106-ESPQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	1728	CMOS		5616	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)	5.5 ns	1728 CLBS, 5616 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	MAX 130 I/OS; MAX 864 flip-flops; OTP based						28 mm
XC8106-2BG225C	Xilinx	FPGA	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.25 V	1728	CMOS		6000	5		Grid Array			4.75 V	1.5 mm	70 °C (158 °F)		1728 CLBS, 6000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B225		3.5 mm	27 mm	No	864 flip-flops; 3.3 V operation; OTP based						27 mm
XC3142-2TQ144C	Xilinx	FPGA	Commercial	Gull Wing	144	QFP	Square	Plastic/Epoxy	144	Yes			CMOS	96		5	5 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays		.5 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3			No		e0	325 MHz	30 s	96	225 °C (437 °F)
XC8101-1PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	384	Yes	5.25 V	384	CMOS	80	1000	5	3.3/5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	5.4 ns	384 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	192 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	80	225 °C (437 °F)	29.3116 mm
XC3020-70CQ100CSPC0110	Xilinx	FPGA	Commercial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	64	CMOS		2000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	9 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				17.272 mm
XC3020-125PC68CSPC0110	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	5.5 ns	64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		125 MHz				24.2316 mm
XC8109-3BG225C	Xilinx	FPGA	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.25 V	2688	CMOS		9000	5		Grid Array			4.75 V	1.5 mm	70 °C (158 °F)		2688 CLBS, 9000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B225		3.5 mm	27 mm	No	1344 flip-flops; 3.3 V operation; OTP based						27 mm
XC2064LPC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	64	CMOS		1000	3.3		Chip Carrier			3 V	1.27 mm	70 °C (158 °F)		64 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.445 mm	24.2316 mm	No	MAX 58 I/OS; 800 to 1000 available gates						24.2316 mm
XC8103-3PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		1024 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	512 flip-flops; 3.3 V operation; OTP based						29.3116 mm
XC3090-50PQ160CSPC0107	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS		9000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160		4.1 mm	28 mm	No	MAX 137 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				28 mm
XC3390-100PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes			CMOS	70		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	100 MHz	30 s	70	225 °C (437 °F)
XC3064-50PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	70	6400	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)		224 CLBS, 6400 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 70 I/OS; 688 flip-flops	e0	50 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3090-50PQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	138	9000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	MAX 137 I/OS; 928 flip-flops	e0	50 MHz	30 s	138	225 °C (437 °F)	28 mm
XC3120-3PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	2.7 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 1000-1500	e0	270 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC3120-4PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	3.3 ns	64 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Typical gates = 1000-1500		227 MHz		58		24.2316 mm
XC3020-50PC84CSPC0110	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				29.3116 mm
XC8106-1PQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	1728	Yes	5.25 V	1728	CMOS	168	6000	5	3.3/5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	5.4 ns	1728 CLBS, 6000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	864 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	168	225 °C (437 °F)	28 mm
XC3164-4PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	70	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	3.3 ns	224 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500	e0	230 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC4025-6MQ208C	Xilinx	FPGA	Commercial	Gull Wing	208	FQFP	Square	Metal	1024	Yes	5.25 V	1024	CMOS	256	20000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	70 °C (158 °F)	6 ns	1024 CLBS, 20000 Gates	0 °C (32 °F)		Quad	S-MQFP-G208	1	3.94 mm	27.64 mm	No	MAX 256 I/OS; 2560 flip-flops; Typical gates = 20000 - 25000		90.9 MHz		256		27.64 mm
XC3020-50PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 64 I/OS; 256 flip-flops	e0	50 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC3030-125PQ100CSPC0104	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)	5.5 ns	100 CLBS, 3000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.1496 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		125 MHz				20 mm
XC4003-10PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	238	Yes			CMOS	61		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	110 MHz	30 s	61	225 °C (437 °F)
XC6SLX150-3NCS484C	Xilinx	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519		338		1.2		Grid Array	BGA484,22X22,32		1.14 V	.8 mm	70 °C (158 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			338		19 mm
XC4002A-4VQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	FQFP	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	1600	5	5 V	Flatpack, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	70 °C (158 °F)	4 ns	64 CLBS, 1600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	2.07 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops; typical gates = 1600 - 2000	e0	133.3 MHz	30 s	64	240 °C (464 °F)	14 mm
XC3020A-1PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes			CMOS	64		5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3			No		e0	325 MHz	30 s	64	225 °C (437 °F)
XC8106-3BG225C	Xilinx	FPGA	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		Yes	5.25 V	1728	CMOS		6000	5		Grid Array			4.75 V	1.5 mm	70 °C (158 °F)		1728 CLBS, 6000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B225		3.5 mm	27 mm	No	864 flip-flops; 3.3 V operation; OTP based						27 mm
XC3090-100PG175CSPC0109	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	320	CMOS		9000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	7 ns	320 CLBS, 9000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175		3.5052 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		100 MHz				42.164 mm
5962-01-395-2614	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No			CMOS	110		5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-PPGA-P132				No			70 MHz		110
XC3190L-2TQ176C	Xilinx	FPGA	Commercial	Gull Wing	176	LFQFP	Square	Plastic/Epoxy	320	Yes	3.6 V	320	CMOS	144	5000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	70 °C (158 °F)	2.2 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G176	3	1.6 mm	24 mm	No	Typical gates = 5000-6000	e0	325 MHz	30 s	144	225 °C (437 °F)	24 mm
XC3064-100PG132CSPC0108	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	224	CMOS		6400	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	7 ns	224 CLBS, 6400 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		100 MHz				37.084 mm
XC3020A-1PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic	64	No			CMOS	64		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P84				No		e0	325 MHz		64
XC3020-50PC68CSPC0110	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz				24.2316 mm
XC3030-125PG84CSPC0104	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	100	CMOS		3000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	5.5 ns	100 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e3	125 MHz				27.94 mm
XC3090-50PG175CSPC0107	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	320	CMOS		9000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175		3.5052 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		50 MHz				42.164 mm
XC3142-2PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes			CMOS	74		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	325 MHz	30 s	74	225 °C (437 °F)
XC8103-1PQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)	5.4 ns	1024 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	512 flip-flops; 3.3 V operation; OTP based		144 MHz				28 mm
XC3090-100PC84CSPC0109	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS		9000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	7 ns	320 CLBS, 9000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 70 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		100 MHz				29.3116 mm
XC3090-50CQ164C	Xilinx	FPGA	Commercial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes	5.25 V	320	CMOS	142	9000	5	5 V	Flatpack	QFL164,1.2SQ,25	Field Programmable Gate Arrays	4.75 V	.635 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)		Quad	S-CQFP-F164	1	3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops		50 MHz		142		27.432 mm
XC4008-10PG191C	Xilinx	FPGA	Commercial	Pin/Peg		PGA		Ceramic	770	No			CMOS	144		5	5 V	Grid Array	PGA(UNSPEC)	Field Programmable Gate Arrays			70 °C (158 °F)			0 °C (32 °F)		Perpendicular					No			110 MHz		144
XC4005H-4PG223C	Xilinx	FPGA	Commercial	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	466	No	5.25 V	196	CMOS	190	4000	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4 ns	196 CLBS, 4000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P223	1	4.064 mm	47.244 mm	No	MAX 192 I/OS; 392 flip-flops; typical gates = 4000 - 5000		133.3 MHz		190		47.244 mm
XC8103-3PQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		1024 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	512 flip-flops; 3.3 V operation; OTP based						28 mm
XC3164-3PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	70	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	2.7 ns	224 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500	e0	270 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3130-4PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.25 V	100	CMOS	74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	3.3 ns	100 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700		230 MHz		74		27.94 mm
XC8106-2PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	1728	CMOS		6000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		1728 CLBS, 6000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	864 flip-flops; 3.3 V operation; OTP based						29.3116 mm
XC3042-125CQ100CSPC0107	Xilinx	FPGA	Commercial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	144	CMOS		4200	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	5.5 ns	144 CLBS, 4200 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 82 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C	e0	125 MHz				17.272 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.