Commercial Extended Field Programmable Gate Arrays (FPGA) 573

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP1S40F780C7N	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	822	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	4697 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	40 s	822	245 °C (473 °F)	29 mm
5ASXMB5D6F31C5N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
EP1S40F1020C5N	Altera	FPGA	Commercial Extended	Ball	1020	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	818	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,31X31,50	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	4697 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e1	40 s	818	245 °C (473 °F)	33 mm
EP1S10B672C7	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS	426	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	1200 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	35 mm	No		e0	20 s	426	220 °C (428 °F)	35 mm
EP1S80F1508C5N	Altera	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy	79040	Yes	1.575 V		CMOS	1238	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1508	3			No		e1		1238	245 °C (473 °F)
5ASXMB5E6F40C4N	Altera	FPGA	Commercial Extended	Ball	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	540	1.1		Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					540		40 mm
5ASXFB5G6F31C6N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
EP1S80F1508C5	Altera	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy	79040	Yes	1.575 V		CMOS	1238	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508	4			No		e0	20 s	1238	220 °C (428 °F)
5ASXMB5D6F31C6N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
5ASXMB3H6F35C6N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					385		35 mm
EP1S80B956C5	Altera	FPGA	Commercial Extended	Ball	956	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B956				No		e0
5ASXBB3G6F31C4N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
5ASXFB3H6F35C4N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					385		35 mm
EP1S80F1020C5	Altera	FPGA	Commercial Extended	Ball	1020	BGA	Square	Plastic/Epoxy	79040	Yes	1.575 V	9191	CMOS	1238	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	9191 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	4	3.5 mm	33 mm	No		e0	20 s	1238	220 °C (428 °F)	33 mm
5ASXBB3D6F40C6N	Altera	FPGA	Commercial Extended	Ball	1517	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207		540	1.1		Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					540		40 mm
5ASXMB5D6F31C4N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
5ASXBB3E6F35C4N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					385		35 mm
EP2C15AF256C6	Altera	FPGA	Commercial Extended	Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V			152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0		144		17 mm
EP1S60F672C5	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672				No		e0
EP1S25F780C5N	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	706	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2852 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	40 s	706	245 °C (473 °F)	29 mm
5ASXBB3E6F35C6N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					385		35 mm
EP1S30F780C7	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	32470	Yes	1.575 V	3819	CMOS	726	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	3819 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0	20 s	726	220 °C (428 °F)	29 mm
EP1S10F780C7	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS	426	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	1200 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0	20 s	426	220 °C (428 °F)	29 mm
EP1S25F1508C7	Altera	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No		e0
5ASXMB5H6F31C4N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
EP2SGX90EF35C4NES	Altera	FPGA	Commercial Extended	Ball	35	BGA	Square	Plastic/Epoxy		Yes	1.25 V	4828	CMOS		1.2		Grid Array			1.15 V		85 °C (185 °F)	4828 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B35				No		e1
EP1S25F780C7	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	706	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2852 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0	20 s	706	220 °C (428 °F)	29 mm
EP1S25F672C7	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	706	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2852 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	20 s	706	220 °C (428 °F)	27 mm
EP1S10F484C5N	Altera	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS	426	1.5	1.5,1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No		e1		426	245 °C (473 °F)	23 mm
EP1S30F672C6	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672				No		e0
EP1S40B956C5	Altera	FPGA	Commercial Extended	Ball	956	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	822	1.5	1.5,1.5/3.3 V	Grid Array	BGA956,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	4697 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B956	3	3.5 mm	40 mm	No		e0	20 s	822	220 °C (428 °F)	40 mm
EP1S20F672C5	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V	2132	CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	2132 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		3.5 mm	27 mm	No		e1				27 mm
EP1S60F1020C5	Altera	FPGA	Commercial Extended	Ball	1020	BGA	Square	Plastic/Epoxy	57120	Yes	1.575 V	6570	CMOS	1018	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,31X31,50	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	6570 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0	20 s	1018	220 °C (428 °F)	33 mm
EP1S20B672C7	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V	2132	CMOS	586	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	2132 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	35 mm	No		e0	20 s	586	220 °C (428 °F)	35 mm
EP2SGX90FF40C4NES	Altera	FPGA	Commercial Extended	Ball	40	BGA	Square	Plastic/Epoxy		Yes	1.25 V	4828	CMOS		1.2		Grid Array			1.15 V		85 °C (185 °F)	4828 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B40				No		e1
EP1S80F672C5	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672				No		e0
5ASXFB5H6F35C4N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					385		35 mm
EP1S60F1508C6N	Altera	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy	57120	Yes	1.575 V	6570	CMOS	1022	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	6570 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No		e1	40 s	1022	245 °C (473 °F)	40 mm
5ASXFB3D6F35C4N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					385		35 mm
EP1S25F780C7N	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	706	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2852 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	30 s	706	245 °C (473 °F)	29 mm
EP1S10F672C5	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1200	CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		3.5 mm	27 mm	No		e1				27 mm
5ASXBB5E6F40C6N	Altera	FPGA	Commercial Extended	Ball	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	540	1.1		Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					540		40 mm
EP2SGX130GF40C4NES	Altera	FPGA	Commercial Extended	Ball	40	BGA	Square	Plastic/Epoxy		Yes	1.25 V	7047	CMOS		1.2		Grid Array			1.15 V		85 °C (185 °F)	7047 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B40				No		e1
EP1S25F672C5	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V	2852	CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	2852 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		3.5 mm	27 mm	No		e1				27 mm
5ASXFB5G6F31C5N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
5ASXFB3D6F31C5N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
EP1S60F484C6	Altera	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484				No		e0
5ASXBB3D6F40C4N	Altera	FPGA	Commercial Extended	Ball	1517	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	540	1.1		Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					540		40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.