Commercial Extended Field Programmable Gate Arrays (FPGA) 573

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP2C15AF256C8	Altera	FPGA	Commercial Extended	Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V			152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0		144		17 mm
EP2SGX90EF35C5NES	Altera	FPGA	Commercial Extended	Ball	35	BGA	Square	Plastic/Epoxy		Yes	1.25 V	4828	CMOS		1.2		Grid Array			1.15 V		85 °C (185 °F)	4828 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B35				No		e1
EP1S25F672C6	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	706	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2852 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	20 s	706	220 °C (428 °F)	27 mm
EP1S20F484C7	Altera	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V	2132	CMOS	586	1.5	1.5,1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2132 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No		e0	20 s	586	220 °C (428 °F)	23 mm
5ASXFB5H6F31C6N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
5ASXBB5G6F31C5N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
5ASXMB3E6F40C4N	Altera	FPGA	Commercial Extended	Ball	1517	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	540	1.1		Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					540		40 mm
5ASXFB3G6F40C5N	Altera	FPGA	Commercial Extended	Ball	1517	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	540	1.1		Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					540		40 mm
EP1S10F780C7N	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS	426	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	1200 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	40 s	426	245 °C (473 °F)	29 mm
EP1S10B956C6	Altera	FPGA	Commercial Extended	Ball	956	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B956				No		e0
EP1S20F672C7N	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V	2132	CMOS	586	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2132 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1		586	245 °C (473 °F)	27 mm
EP1S20B956C6	Altera	FPGA	Commercial Extended	Ball	956	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B956				No		e0
5ASXFB3H6F31C4N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
EP1S20F484C7N	Altera	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V	2132	CMOS	586	1.5	1.5,1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2132 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No		e1		586	245 °C (473 °F)	23 mm
EP2C15AF484C6	Altera	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	14448	Yes	1.25 V			315	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484		2.6 mm	23 mm	No	Also requires 3.3 V supply	e0		307		23 mm
EP1S40F780C6	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	822	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	4697 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0	20 s	822	220 °C (428 °F)	29 mm
5ASXMB3G6F31C4N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
EP1S20F484C6	Altera	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V	2132	CMOS	586	1.5	1.5,1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2132 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No		e0	20 s	586	220 °C (428 °F)	23 mm
EP1S30F672C7	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672				No		e0
EP1S60F672C7	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672				No		e0
5ASXMB5H6F35C6N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					385		35 mm
EP1S10F484C7N	Altera	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS	426	1.5	1.5,1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No		e1		426	245 °C (473 °F)	23 mm
5ASXBB5G6F31C4N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
5ASXFB5H6F35C6N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					385		35 mm
5ASXFB5E6F40C4N	Altera	FPGA	Commercial Extended	Ball	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	540	1.1		Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					540		40 mm
5ASXMB3D6F40C5N	Altera	FPGA	Commercial Extended	Ball	1517	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	540	1.1		Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					540		40 mm
5ASXBB3G6F31C5N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
EP1S40B956C6N	Altera	FPGA	Commercial Extended	Ball	956	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	822	1.5	1.5,1.5/3.3 V	Grid Array	BGA956,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	4697 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B956	3	3.5 mm	40 mm	No		e1		822		40 mm
5ASXBB3H6F35C5N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					385		35 mm
5ASXBB5H6F35C6N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					385		35 mm
EP1S60F484C7	Altera	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484				No		e0
5ASXBB5G6F40C5N	Altera	FPGA	Commercial Extended	Ball	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	540	1.1		Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					540		40 mm
5ASXFB3D6F40C6N	Altera	FPGA	Commercial Extended	Ball	1517	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	540	1.1		Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					540		40 mm
EP1S60F780C7	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780				No		e0
5ASXFB3H6F31C5N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
EP1S40B956C7	Altera	FPGA	Commercial Extended	Ball	956	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	822	1.5	1.5,1.5/3.3 V	Grid Array	BGA956,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	4697 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B956	3	3.5 mm	40 mm	No		e0	20 s	822	220 °C (428 °F)	40 mm
EP1S10F1508C5	Altera	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No		e0
5ASXBB5D6F35C5N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					385		35 mm
5ASXFB5D6F31C4N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
5ASXFB3D6F31C4N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
EP1S30F1508C5	Altera	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No		e0
5ASXMB5D6F35C5N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					385		35 mm
5ASXBB5G6F40C4N	Altera	FPGA	Commercial Extended	Ball	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	540	1.1		Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					540		40 mm
5ASXMB5D6F35C6N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					385		35 mm
5ASXFB3G6F31C6N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
5ASXBB5H6F31C5N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
EP2C15AF256C7	Altera	FPGA	Commercial Extended	Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V			152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0		144		17 mm
5ASXMB3H6F31C5N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.