Commercial Extended Field Programmable Gate Arrays (FPGA) 573

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2S200E-6PQ208C	Xilinx	FPGA	Commercial Extended	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5292	Yes	1.89 V	864	CMOS	289	52000	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	289	225 °C (437 °F)	28 mm
XC2S600E-7FGG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	864	CMOS	514	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e1	357 MHz	30 s	514	250 °C (482 °F)	23 mm
XC2S300E-6FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	1536			93000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 300000	e0	357 MHz				27 mm
XC2S100E-7PQ208C	Xilinx	FPGA	Commercial Extended	Gull Wing	208	FQFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	202	37000	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.42 ns	600 CLBS, 37000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 100000	e0	400 MHz	30 s	202	225 °C (437 °F)	28 mm
XC2S300E-6FGG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	329	93000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 300000	e1	357 MHz	30 s	329	250 °C (482 °F)	23 mm
XC2S300E-6TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	1536			93000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144		1.6 mm	20 mm	No	Maximum usable gates = 300000		357 MHz				20 mm
XC2S600E-7TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144		1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz				20 mm
XC2S150E-7FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 150000	e0	357 MHz				27 mm
XC2S300E-7FGG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	1536			93000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 300000	e1	400 MHz				27 mm
XC2S150E-7PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz				28 mm
XC2S150E-6PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz				28 mm
XC2S200E-7FT256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	864	CMOS	289	52000	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	289	240 °C (464 °F)	17 mm
XCKU035-1FFVA1156E	Xilinx	FPGA	Commercial Extended	Ball	1156	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520		0.95		Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1			520		35 mm
XC2S150E-6FT256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	1.89 V	864	CMOS	263	52000	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	263	240 °C (464 °F)	17 mm
XC2S100E-6FGG676C	Xilinx	FPGA	Commercial Extended	B	676	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	Maximum usable gates = 150000	e1	357 MHz				27 mm
XC2S200E-7TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144		1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz				20 mm
XC2S150E-7FG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	3888	Yes	1.89 V	864	CMOS	263	52000	1.8	1.5/3.3,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	263	225 °C (437 °F)	23 mm
XC3SD3400A-5FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS	469	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	5968 CLBS, 3400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	280 MHz		409		27 mm
XCKU095-1FFVA1156E	Xilinx	FPGA	Commercial Extended	Ball	1156	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95		Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1		30 s	702	245 °C (473 °F)	35 mm
XC2S50E-6FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	384			23000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 50000	e0	357 MHz				27 mm
XC2S400E-7FG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	864	CMOS	410	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	410	225 °C (437 °F)	23 mm
XCKU040-1FBVA900E	Xilinx	FPGA	Commercial Extended	Ball	900	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		30300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm			e1		30 s	520	245 °C (473 °F)	31 mm
XC2S600E-7PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz				28 mm
XCKU115-1FLVF1924E	Xilinx	FPGA	Commercial Extended	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm			e1		30 s	832	245 °C (473 °F)	45 mm
XCKU060-1FFVA1517E	Xilinx	FPGA	Commercial Extended	Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624		0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	624	245 °C (473 °F)	40 mm
XC2S50E-6PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz				28 mm
XC3SD3400A-4FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS	469	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	5968 CLBS, 3400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	250 MHz		409		27 mm
XCKU115-1FLVD1517E	Xilinx	FPGA	Commercial Extended	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XC2S200E-7PQ208C	Xilinx	FPGA	Commercial Extended	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5292	Yes	1.89 V	864	CMOS	289	52000	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	289	225 °C (437 °F)	28 mm
XC2S150E-7FT256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	1.89 V	864	CMOS	263	52000	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	263	240 °C (464 °F)	17 mm
XC2S50E-7FG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.89 V	384			23000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.42 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 50000	e0	400 MHz				23 mm
XC2S50E-6TQ144C	Xilinx	FPGA	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS	182	23000	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 50000	e0	357 MHz	30 s	182	225 °C (437 °F)	20 mm
XC3SD3400A-5CS484C	Xilinx	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS	309	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.62 ns	5968 CLBS, 3400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3		19 mm	No		e0	280 MHz	30 s	249	225 °C (437 °F)	19 mm
XC5VSX95T-3FF1136C	Xilinx	FPGA	Commercial Extended	Ball	1136	BGA	Square	Plastic/Epoxy	94208	Yes	1.05 V	7360	CMOS	640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)		7360 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.4 mm	35 mm	No		e0	550 MHz	30 s	640	225 °C (437 °F)	35 mm
XC2S300E-6FTGG256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.89 V	1536			93000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2 mm	17 mm	No	Maximum usable gates = 300000	e1	357 MHz				17 mm
XC2S400E-7TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144		1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz				20 mm
XC3SD1800A-5FGG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	519	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	4160 CLBS, 1800000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	280 MHz	30 s	409	260 °C (500 °F)	27 mm
XC2S200E-7FTGG256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2 mm	17 mm	No	Maximum usable gates = 150000	e1	357 MHz				17 mm
XC2S150E-7FTGG256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2 mm	17 mm	No	Maximum usable gates = 150000	e1	357 MHz				17 mm
XC2S400E-7TQ144C	Xilinx	FPGA	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Low Profile, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 150000	e0	357 MHz				20 mm
XCKU115-1FLVB1760E	Xilinx	FPGA	Commercial Extended	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm			e1		30 s	832	245 °C (473 °F)	42.5 mm
XC2S300E-6FG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	329	93000	1.8	1.5/3.3,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 300000	e0	357 MHz	30 s	329	225 °C (437 °F)	23 mm
XC2S50E-6FTGG256C	Xilinx	FPGA	Commercial Extended	B	256	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Maximum usable gates = 150000	e1	357 MHz				17 mm
XC2S150E-6FG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	3888	Yes	1.89 V	864	CMOS	263	52000	1.8	1.5/3.3,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	263	225 °C (437 °F)	23 mm
XC2S300E-7TQ144C	Xilinx	FPGA	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.89 V	1536			93000	1.8		Flatpack, Low Profile, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 300000	e0	400 MHz				20 mm
XC2S400E-7PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz				28 mm
XC2S150E-6FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 150000	e0	357 MHz				27 mm
EP1S60F1020C7	Altera	FPGA	Commercial Extended	Ball	1020	BGA	Square	Plastic/Epoxy	57120	Yes	1.575 V	6570	CMOS	1018		1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,31X31,50	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		6570 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0		20 s	1018	220 °C (428 °F)	33 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.