Commercial Extended Field Programmable Gate Arrays (FPGA) 573

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2S200E-6TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144		1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz				20 mm
XC2S200E-7PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz				28 mm
XC2S50E-6TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144		1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz				20 mm
XC3SD1800A-4FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	519	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	4160 CLBS, 1800000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	250 MHz		409		27 mm
XC2S200E-6FGG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	864	CMOS	289	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e1	357 MHz	30 s	289	250 °C (482 °F)	23 mm
XCKU115-1FLVA2104E	Xilinx	FPGA	Commercial Extended	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XC2S100E-6FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	600			37000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	600 CLBS, 37000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 100000	e0	357 MHz				27 mm
XC2S600E-7PQ208C	Xilinx	FPGA	Commercial Extended	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 150000	e0	357 MHz				28 mm
XC2S100E-7TQ144C	Xilinx	FPGA	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	202	37000	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.42 ns	600 CLBS, 37000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 100000	e0	400 MHz	30 s	202	225 °C (437 °F)	20 mm
XC2S50E-7FTGG256C	Xilinx	FPGA	Commercial Extended	B	256	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Maximum usable gates = 150000	e1	357 MHz				17 mm
XC2S300E-7FG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	329	93000	1.8	1.5/3.3,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 300000	e0	400 MHz	30 s	329	225 °C (437 °F)	23 mm
XC2S50E-7FT256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS	182	23000	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 50000	e0	400 MHz	30 s	182	240 °C (464 °F)	17 mm
XC5VSX95T-3FFG1136C	Xilinx	FPGA	Commercial Extended	Ball	1136	BGA	Square	Plastic/Epoxy	94208	Yes		7360	CMOS	640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		7360 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.4 mm	35 mm	No		e1	1205 MHz	30 s	640	245 °C (473 °F)	35 mm
XC2S100E-6FT256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	202	37000	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	600 CLBS, 37000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 100000	e0	357 MHz	30 s	202	240 °C (464 °F)	17 mm
XC2S150E-7FGG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	3888	Yes	1.89 V	864	CMOS	265	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e1	357 MHz	30 s	265	250 °C (482 °F)	23 mm
XC3SD3400A-5FGG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS	469	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	5968 CLBS, 3400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	280 MHz	30 s	409	260 °C (500 °F)	27 mm
XC2S50E-6FGG676I	Xilinx	FPGA	Commercial Extended	B	676	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	Maximum usable gates = 150000	e1	357 MHz				27 mm
XC2S100E-7FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	600			37000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.42 ns	600 CLBS, 37000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 100000	e0	400 MHz				27 mm
XC3SD1800A-4CS484C	Xilinx	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	309	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.71 ns	4160 CLBS, 1800000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3		19 mm	No		e0	250 MHz	30 s	249	225 °C (437 °F)	19 mm
XC2S150E-7TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144		1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz				20 mm
XC2S50E-7PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz				28 mm
XC2S150E-6FGG676C	Xilinx	FPGA	Commercial Extended	B	676	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	Maximum usable gates = 150000	e1	357 MHz				27 mm
XC2S50E-7TQ144C	Xilinx	FPGA	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS	182	23000	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.42 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 50000	e0	400 MHz	30 s	182	225 °C (437 °F)	20 mm
XC2S300E-7FT256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	329	93000	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 300000	e0	400 MHz	30 s	329	240 °C (464 °F)	17 mm
XC2S300E-7FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	1536			93000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 300000	e0	400 MHz				27 mm
XC2S100E-7PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz				28 mm
XC2S600E-7FT256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 150000	e0	357 MHz				17 mm
XC2S100E-6FG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	202	37000	1.8	1.5/3.3,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	600 CLBS, 37000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 100000	e0	357 MHz	30 s	202	225 °C (437 °F)	23 mm
XC2S150E-7TQ144C	Xilinx	FPGA	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Low Profile, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 150000	e0	357 MHz				20 mm
XC2S50E-7FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	384			23000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.42 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 50000	e0	400 MHz				27 mm
XCKU040-1SFVA784E	Xilinx	FPGA	Commercial Extended	Ball	784	FBGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		30300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.52 mm	23 mm			e1			520		23 mm
XC2S300E-6PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	1536			93000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	Maximum usable gates = 300000	e3	357 MHz				28 mm
XC2S200E-7FGG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	864	CMOS	289	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e1	357 MHz	30 s	289	250 °C (482 °F)	23 mm
XC2S100E-6TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144		1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz				20 mm
XC2S100E-6PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz				28 mm
XC2S150E-7FGG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 150000	e1	357 MHz				27 mm
XC2S50E-6FT256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS	182	23000	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 50000	e0	357 MHz	30 s	182	240 °C (464 °F)	17 mm
XC2S300E-6FT256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	329	93000	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 300000	e0	357 MHz	30 s	329	240 °C (464 °F)	17 mm
XC2S200E-6TQ144C	Xilinx	FPGA	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Low Profile, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 150000	e0	357 MHz				20 mm
XCKU115-1FLVD1924E	Xilinx	FPGA	Commercial Extended	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm			e1		30 s	832	245 °C (473 °F)	45 mm
XC2S100E-6TQ144C	Xilinx	FPGA	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	202	37000	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	600 CLBS, 37000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 100000	e0	357 MHz	30 s	202	225 °C (437 °F)	20 mm
XC2S150E-6TQ144C	Xilinx	FPGA	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.89 V	600			37000	1.8		Flatpack, Low Profile, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.42 ns	600 CLBS, 37000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 100000	e0	400 MHz				20 mm
XC2S200E-6PQGG208C	Xilinx	FPGA	Commercial Extended	G	208	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz				28 mm
XCKU025-1FFVA1156E	Xilinx	FPGA	Commercial Extended	Ball	1156	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312		0.95		Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1		30 s	312	245 °C (473 °F)	35 mm
XC2S100E-6PQ208C	Xilinx	FPGA	Commercial Extended	Gull Wing	208	FQFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	202	37000	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	600 CLBS, 37000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 100000	e0	357 MHz	30 s	202	225 °C (437 °F)	28 mm
XC2S400E-7FGG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	864	CMOS	410	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 150000	e1	357 MHz	30 s	410	250 °C (482 °F)	27 mm
XC2S200E-6FT256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	864	CMOS	289	52000	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	289	240 °C (464 °F)	17 mm
XC3SD1800A-5FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	519	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	4160 CLBS, 1800000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	280 MHz		409		27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.