1517 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU060-1FFVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	2760		624	.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)	2760 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	624	245 °C (473 °F)	40 mm
XCKU060-1FFVA1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	2760		624	.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)	2760 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	624	245 °C (473 °F)	40 mm
XCKU115-2FLVA1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832	.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)	5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
XCKU060-2FFVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	2760		624	.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)	2760 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	624	245 °C (473 °F)	40 mm
XCKU060-2FFVA1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	2760		624	.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)	2760 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	624	245 °C (473 °F)	40 mm
XCVU3P-2FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.876 V	49260		520	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	49260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1			520		40 mm
XCKU085-2FLVA1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)	62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	676	245 °C (473 °F)	40 mm
XCVU3P-1FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.876 V	49260		520	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	49260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	520	245 °C (473 °F)	40 mm
XCVU3P-2FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.876 V	49260		520	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	49260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	520	245 °C (473 °F)	40 mm
EP4SGX530KH40I4G	Intel	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	531200	Yes	.93 V	21248			0.9		Grid Array	BGA1517,39X39,40		.87 V	1 mm	100 °C (212 °F)	21248 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.4 mm	42.5 mm								42.5 mm
10AX066N2F40E2SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V	25168	TSMC	588	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	25168 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm	No	Also Operates at 0.95 V nominal supply				588		40 mm
5AGXBB1D4F40I5N	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321		704	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)	11321 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	3	2.7 mm	40 mm	No		e1	622 MHz		704		40 mm
EP2AGZ225HF40I3N	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	224000	Yes	.93 V		CMOS	734	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		3.5 mm	40 mm	No		e1	500 MHz		734		40 mm
XCKU085-2FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)	62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	676	245 °C (473 °F)	40 mm
XCVU3P-L2FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.742 V	49260		520	0.72		Grid Array	BGA1517,39X39,40		.698 V	1 mm	110 °C (230 °F)	49260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 0.85 V nominal supply	e1		30 s	520	245 °C (473 °F)	40 mm
5AGXFB3H4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)	13688 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						704		40 mm
XCKU11P-1FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320		512	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	512	245 °C (473 °F)	40 mm
XCKU115-2FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832	.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)	5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
XCKU085-1FLVA1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)	62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1		30 s	676	245 °C (473 °F)	40 mm
XCKU085-1FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)	62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	676	245 °C (473 °F)	40 mm
XC4VFX100-12FFG1517CS1	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes			CMOS	768		1.2,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm				Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4			No		e1	1181 MHz	30 s	768	245 °C (473 °F)
10AX066K4F40E3SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V	25168	TSMC	696	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	25168 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					696		40 mm
XCKU060-2FFVA1517C	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	85 °C (185 °F)	41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.51 mm	40 mm						624		40 mm
XCKU15P-1FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	668	245 °C (473 °F)	40 mm
XCKU15P-2FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	668	245 °C (473 °F)	40 mm
10AX115N1F40E1SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	600	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm	No	Also Operates at 0.95 V nominal supply				600		40 mm
10AX115N4F40I3SGES	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm								40 mm
5AGXFB7K4F40C4N	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	504000	Yes	1.13 V	19024		704	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	19024 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	3	2.7 mm	40 mm	No		e1	670 MHz		704		40 mm
XCKU15P-L2FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340		668	0.72		Grid Array	BGA1517,39X39,40		.698 V	1 mm	110 °C (230 °F)	65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 0.85 V nominal supply	e1		30 s	668	245 °C (473 °F)	40 mm
XCVU3P-1FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.876 V	49260		520	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	49260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	520	245 °C (473 °F)	40 mm
10AX066N1F40I1HG	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes		25168	TSMC	588			Grid Array	BGA1517,39X39,40			1 mm	100 °C (212 °F)	25168 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm						588		40 mm
XCKU15P-2FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	668	245 °C (473 °F)	40 mm
5AGXFB3H4F40C5N	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688		704	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	13688 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	3	2.7 mm	40 mm	No		e1	622 MHz		704		40 mm
5AGXFB5K4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	420000	Yes	1.13 V	15849	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)	15849 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						704		40 mm
XCKU11P-1FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320		512	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	512	245 °C (473 °F)	40 mm
10AX066K3F40I2SG	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V	25168	TSMC	696	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	25168 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No	Also Operates at 0.95 V nominal supply				696		40 mm
5SGXEABK2H40C2N	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	952000	Yes	.93 V	35920	CMOS	696	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	35920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.9 mm	45 mm	No					696		45 mm
XCKU11P-2FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320		512	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	512	245 °C (473 °F)	40 mm
XCVU065-1FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	783300	Yes	.979 V	600		520	.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)	600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	520	245 °C (473 °F)	40 mm
XQKU115-1RLD1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes		82920			.95		Grid Array				1 mm		82920 CLBS		Tin Lead	Bottom	S-PBGA-B1517		4.14 mm	40 mm			e0					40 mm
XQKU115-2RLD1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes		82920			.95		Grid Array				1 mm		82920 CLBS		Tin Lead	Bottom	S-PBGA-B1517		4.14 mm	40 mm			e0					40 mm
10AX057K2F40E2SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V	21708	TSMC	696	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	21708 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No	Also Operates at 0.95 V nominal supply				696		40 mm
5AGXBB1D4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)	11321 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						704		40 mm
EP4SGX230KF40C2G	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V	9120		744	.9		Grid Array	BGA1517,39X39,40		.87 V	1 mm	85 °C (185 °F)	9120 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm								40 mm
EP4SGX530KH40C4NES	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V	21248			.9		Grid Array			.87 V	1 mm	85 °C (185 °F)	21248 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B		3.8 mm	42.5 mm	No		e1	717 MHz				42.5 mm
XCVU065-3FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	783300	Yes	1.03 V	600		520	1		Grid Array	BGA1517,39X39,40		.97 V	1 mm	100 °C (212 °F)	600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	520	245 °C (473 °F)	40 mm
10AX057K4F40E3SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V	21708	TSMC	696	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	21708 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					696		40 mm
10AX066N2F40E1HG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes		25168	TSMC	588			Grid Array	BGA1517,39X39,40			1 mm	100 °C (212 °F)	25168 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm						588		40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.