1517 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU075-L1FFVA1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	756000	Yes	.927 V	2592			624		.9			Grid Array			.873 V	1 mm	100 °C (212 °F)		2592 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	624	245 °C (473 °F)	40 mm
XCVU065-H1FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	783300	Yes	.979 V	44760			520		0.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		44760 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 1 V nominal supply	e1		30 s	520	245 °C (473 °F)	40 mm
XCVU125-3FLVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1566600	Yes	1.03 V	1200			884		1			Grid Array	BGA1517,39X39,40		.97 V	1 mm	100 °C (212 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	884	245 °C (473 °F)	40 mm
XQKU15P-L1FFRE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340		MIL-PRF-38535	564		0.72			Grid Array	BGA1517,39X39,40		.698 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1517	4	3.71 mm	40 mm			e0		20 s	564	225 °C (437 °F)	40 mm
XCVU080-1FFVD1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672			832		.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		672 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XCKU11P-L2FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.742 V	37320			512		0.72			Grid Array	BGA1517,39X39,40		.698 V	1 mm	110 °C (230 °F)		37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 0.85 V nominal supply	e1		30 s	512	245 °C (473 °F)	40 mm
XCVU080-2FFVD1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672			832		.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		672 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XCKU115-3FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920			832		1			Grid Array	BGA1517,39X39,40		.97 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XCKU095-1LFFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768	CMOS		520		0.95	Tray		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	520	245 °C (473 °F)	40 mm
XCKU095-2FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95		0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	702	245 °C (473 °F)	40 mm
XC2V4000-6FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS		912	4000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	5760 CLBS, 4000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	820 MHz	30 s	912	245 °C (473 °F)	40 mm
XC2V8000-4FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS		1108	8000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	11648 CLBS, 8000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	650 MHz	30 s	1108	225 °C (437 °F)	40 mm
XC4VFX100-10FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS		768		1.2			Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm			10544 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1028 MHz	30 s	576	245 °C (473 °F)	40 mm
XC4VFX100-10FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS		768		1.2			Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		10544 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1028 MHz	30 s	576	245 °C (473 °F)	40 mm
XCVU080-1FFVD1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	55714			832		0.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	85 °C (185 °F)		55714 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XCKU095-1FFVC1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95		0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	702	245 °C (473 °F)	40 mm
XC2VP40-7FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS		804		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.29 ns	4848 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1350 MHz	30 s	804	225 °C (437 °F)	40 mm
XC4VFX140-11FF1517CS1	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	142128	Yes			CMOS		768				1.2,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1517	4			No		e0	1181 MHz	30 s	768	225 °C (437 °F)
XC2VP50-8FF1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS				1.5			Grid Array, Heat Sink/Slug			1.425 V	1 mm			5648 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XCKU115-1LFLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520	CMOS		624		0.95	Tray		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	624	245 °C (473 °F)	40 mm
XQVU095-1RFC1517M	Xilinx	FPGA	Military	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes		67200			520		.95			Grid Array					125 °C (257 °F)		67200 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1517			40 mm			e0			520		40 mm
XC2V10000-4FFG1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS			10000000	1.5			Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.45 ns	15360 CLBS, 10000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	765 MHz	30 s		245 °C (473 °F)	40 mm
XQVU065-1RFC1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	783300	Yes		44760			520		.95			Grid Array					100 °C (212 °F)		44760 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1517			40 mm			e0			520		40 mm
XC2V10000-4FFG1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS			10000000	1.5			Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.45 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	765 MHz	30 s		245 °C (473 °F)	40 mm
XCKU15P-L1FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340			668		0.72			Grid Array	BGA1517,39X39,40		.698 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1			668		40 mm
XQVU095-2RFC1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes		67200			520		.95			Grid Array					100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517			40 mm			e0			520		40 mm
XCKU100-3FLVD1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	958440	Yes	1.03 V	4200			338		1			Grid Array			.97 V	1 mm	100 °C (212 °F)		4200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		4.09 mm	40 mm			e1			338		40 mm
XC2V3000-5FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS			3000000	1.5			Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.44 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	934.58 MHz	30 s		225 °C (437 °F)	40 mm
XC4VFX100-10FFG1517IS1	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes			CMOS		768				1.2,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4			No		e1	1028 MHz	30 s	768	245 °C (473 °F)
XC2VP50-5FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS		852		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	5904 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1050 MHz	30 s	852	225 °C (437 °F)	40 mm
XCVU095-2FFVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768			832		.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1			832		40 mm
XCKU085-1FLVA1517E	Xilinx	FPGA	Commercial Extended	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676		0.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	676	245 °C (473 °F)	40 mm
XC2V3000-4FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS			3000000	1.5			Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.5 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	813.67 MHz	30 s		225 °C (437 °F)	40 mm
XCKU100-2FLVD1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	958440	Yes	.979 V	4200			338		.95			Grid Array			.922 V	1 mm	100 °C (212 °F)		4200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	338	245 °C (473 °F)	40 mm
XCKU085-3FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190			676		1			Grid Array	BGA1517,39X39,40		.97 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	676	245 °C (473 °F)	40 mm
XC2V4000-5FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS		912	4000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	750 MHz	30 s	912	225 °C (437 °F)	40 mm
XC4VFX140-11FFG1517IS1	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	142128	Yes			CMOS		768				1.2,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4			No		e1	1181 MHz	30 s	768	245 °C (473 °F)
XCKU11P-2FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320			512		0.85			Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)		37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	512	245 °C (473 °F)	40 mm
XCKU060-3FFVA1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	2760			624		1		1 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		2760 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	624	245 °C (473 °F)	40 mm
XCKU085-L1FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190			676		0.9		0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.88 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	676	245 °C (473 °F)	40 mm
XCVU095-1FFVD1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			832		0.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XC2V10000-5FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS			10000000	1.5			Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.39 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	880 MHz	30 s		225 °C (437 °F)	40 mm
XC2VP70-6FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS		964		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	8272 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1200 MHz	30 s	964	225 °C (437 °F)	40 mm
XC4VFX100-11XFF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes			CMOS		768				1.2,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1517	4			No		e0	1205 MHz	30 s	768	225 °C (437 °F)
XC2V6000-5FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS		1104	6000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	8448 CLBS, 6000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	750 MHz	30 s	1104	245 °C (473 °F)	40 mm
XC2VP40-5FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS		804		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.37 ns	4848 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1050 MHz	30 s	804	225 °C (437 °F)	40 mm
XQKU060-1RFA1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes		41460			624		.95			Grid Array					100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1517			40 mm			e0			624		40 mm
XC2V6000-4FF1517C0765	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes			CMOS		1104				1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1517	4			No		e0		30 s	1104	225 °C (437 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.