1517 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2VP50-5FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	852		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	5904 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1050 MHz	30 s	852	225 °C (437 °F)	40 mm
XCVU095-2FFVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768		832		.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1			832		40 mm
XCKU085-1FLVA1517E	Xilinx	FPGA	Commercial Extended	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	676	245 °C (473 °F)	40 mm
XC2V3000-4FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS		3000000	1.5			Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.5 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	813.67 MHz	30 s		225 °C (437 °F)	40 mm
XCKU100-2FLVD1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	958440	Yes	.979 V	4200		338		.95			Grid Array			.922 V	1 mm	100 °C (212 °F)		4200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	338	245 °C (473 °F)	40 mm
XCKU085-3FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676		1			Grid Array	BGA1517,39X39,40		.97 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	676	245 °C (473 °F)	40 mm
XC2V4000-5FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	912	4000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	750 MHz	30 s	912	225 °C (437 °F)	40 mm
XC4VFX140-11FFG1517IS1	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	142128	Yes			CMOS	768				1.2,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4			No		e1	1181 MHz	30 s	768	245 °C (473 °F)
XCKU11P-2FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320		512		0.85			Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)		37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	512	245 °C (473 °F)	40 mm
XCKU060-3FFVA1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	2760		624		1		1 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		2760 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	624	245 °C (473 °F)	40 mm
XCKU085-L1FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190		676		0.9		0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.88 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	676	245 °C (473 °F)	40 mm
XCVU095-1FFVD1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		832		0.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XC2V10000-5FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5			Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.39 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	880 MHz	30 s		225 °C (437 °F)	40 mm
XC2VP70-6FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	964		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	8272 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1200 MHz	30 s	964	225 °C (437 °F)	40 mm
XC4VFX100-11XFF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes			CMOS	768				1.2,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1517	4			No		e0	1205 MHz	30 s	768	225 °C (437 °F)
XC4VFX100-10FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS	768		1.2			Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		10544 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1028 MHz	30 s	576	245 °C (473 °F)	40 mm
XCVU080-1FFVD1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	55714		832		0.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	85 °C (185 °F)		55714 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XCKU095-1FFVC1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95		0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	702	245 °C (473 °F)	40 mm
XC2VP40-7FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	804		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.29 ns	4848 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1350 MHz	30 s	804	225 °C (437 °F)	40 mm
XCKU115-3FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832		1			Grid Array	BGA1517,39X39,40		.97 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XCKU095-1LFFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768	CMOS	520		0.95	Tray		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	520	245 °C (473 °F)	40 mm
XCKU095-2FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95		0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	702	245 °C (473 °F)	40 mm
XC2V4000-6FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	912	4000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	5760 CLBS, 4000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	820 MHz	30 s	912	245 °C (473 °F)	40 mm
XC2V8000-4FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS	1108	8000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	11648 CLBS, 8000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	650 MHz	30 s	1108	225 °C (437 °F)	40 mm
XC4VFX100-10FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS	768		1.2			Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm			10544 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1028 MHz	30 s	576	245 °C (473 °F)	40 mm
XC2V6000-5FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	1104	6000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	8448 CLBS, 6000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	750 MHz	30 s	1104	245 °C (473 °F)	40 mm
XC2VP40-5FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	804		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.37 ns	4848 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1050 MHz	30 s	804	225 °C (437 °F)	40 mm
XQKU060-1RFA1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes		41460		624		.95			Grid Array					100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1517			40 mm			e0			624		40 mm
XC2V6000-4FF1517C0765	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes			CMOS	1104				1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1517	4			No		e0		30 s	1104	225 °C (437 °F)
XC4VFX100-11XFF1517C	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes			CMOS	768				1.2,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1517	4			No		e0	1205 MHz	30 s	768	225 °C (437 °F)
XC2VP50-5FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	852		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	5904 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1050 MHz	30 s	852	245 °C (473 °F)	40 mm
XCKU095-2FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95		0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	702	245 °C (473 °F)	40 mm
XC2V4000-4FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	912	4000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	5760 CLBS, 4000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	650 MHz	30 s	912	245 °C (473 °F)	40 mm
XCKU11P-L1FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.742 V	37320		512		0.72			Grid Array	BGA1517,39X39,40		.698 V	1 mm	100 °C (212 °F)		37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1			512		40 mm
XC2VP40-6FFG1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	4848	CMOS			1.5			Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.33 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1200 MHz	30 s		245 °C (473 °F)	40 mm
XC2V6000-4FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	1104	6000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	650 MHz	30 s	1104	245 °C (473 °F)	40 mm
XCKU11P-3FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.927 V	37320		512		0.9			Grid Array	BGA1517,39X39,40		.873 V	1 mm	100 °C (212 °F)		37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	512	245 °C (473 °F)	40 mm
XCKU095-3FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200		702		1			Grid Array	BGA1517,39X39,40		.97 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	702	245 °C (473 °F)	40 mm
XC2V8000-6FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.575 V	11648	CMOS		8000000	1.5			Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.35 ns	11648 CLBS, 8000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	820 MHz	30 s		245 °C (473 °F)	40 mm
XC2VP50-7FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.575 V	5904	CMOS			1.5			Grid Array			1.425 V	1 mm		0.28 ns	5904 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1350 MHz	30 s		245 °C (473 °F)	40 mm
XCKU075-1FFVA1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	756000	Yes	.979 V	2592		624		.95			Grid Array			.922 V	1 mm	85 °C (185 °F)		2592 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	624	245 °C (473 °F)	40 mm
XCVU3P-3FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.927 V	49260		520		0.9			Grid Array	BGA1517,39X39,40		.873 V	1 mm	100 °C (212 °F)		49260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	520	245 °C (473 °F)	40 mm
XCKU075-3FFVA1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	756000	Yes	1.03 V	2592		624		1			Grid Array			.97 V	1 mm	100 °C (212 °F)		2592 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	624	245 °C (473 °F)	40 mm
XQKU115-2RLA1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes		82920				.95			Grid Array							82920 CLBS		Tin Lead	Bottom	S-PBGA-B1517						e0
XC2V8000-6FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS	1108	8000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	11648 CLBS, 8000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	820 MHz	30 s	1108	225 °C (437 °F)	40 mm
XCKU085-1FFVA1517C	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.51 mm	40 mm						676		40 mm
XCKU035-L1FLVA1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391		520		0.9			Grid Array	BGA1517,39X39,40		.88 V	1 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		4.09 mm	40 mm		Also Operates at 0.95 V nominal supply				520		40 mm
XCKU095-1FFVA1517C	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.51 mm	40 mm						702		40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.