1517 Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XCKU085-1FLVD1517I

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1088325

Yes

.979 V

62190

676

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

100 °C (212 °F)

62190 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

676

40 mm

XCKU060-3FLVD1517C

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

725550

Yes

1.03 V

41460

624

1

Grid Array

BGA1517,39X39,40

.97 V

1 mm

85 °C (185 °F)

41460 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

624

40 mm

XCKU095-3FLVD1517E

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1176000

Yes

1.03 V

67200

702

1

Grid Array

BGA1517,39X39,40

.97 V

1 mm

100 °C (212 °F)

67200 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

702

40 mm

XCKU025-1FFVA1517C

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

318150

Yes

.979 V

18180

312

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

85 °C (185 °F)

18180 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

312

40 mm

XCKU060-1FFVC1517E

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

725550

Yes

.979 V

41460

624

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

100 °C (212 °F)

41460 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

624

40 mm

XCKU095-1FLVA1517I

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1176000

Yes

.979 V

67200

702

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

100 °C (212 °F)

67200 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

702

40 mm

XCKU040-3FLVD1517I

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

530250

Yes

1.03 V

30300

520

1

Grid Array

BGA1517,39X39,40

.97 V

1 mm

100 °C (212 °F)

30300 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

520

40 mm

XCKU095-2FLVA1517E

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1176000

Yes

.979 V

67200

702

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

100 °C (212 °F)

67200 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

702

40 mm

XCKU085-1FFVA1517E

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1088325

Yes

.979 V

62190

676

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

100 °C (212 °F)

62190 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

676

40 mm

XCKU085-3FFVC1517E

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1088325

Yes

1.03 V

62190

676

1

Grid Array

BGA1517,39X39,40

.97 V

1 mm

100 °C (212 °F)

62190 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

676

40 mm

XCKU025-1FLVA1517C

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

318150

Yes

.979 V

18180

312

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

85 °C (185 °F)

18180 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

312

40 mm

XCKU095-2FFVA1517I

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1176000

Yes

.979 V

67200

702

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

100 °C (212 °F)

67200 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

702

40 mm

XCKU025-2FFVA1517C

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

318150

Yes

.979 V

18180

312

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

85 °C (185 °F)

18180 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

312

40 mm

XCKU095-L1FFVA1517C

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1176000

Yes

.92 V

67200

702

0.9

Grid Array

BGA1517,39X39,40

.88 V

1 mm

85 °C (185 °F)

67200 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

Also Operates at 0.95 V nominal supply

702

40 mm

XCKU060-1FFVC1517I

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

725550

Yes

.979 V

41460

624

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

100 °C (212 °F)

41460 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

624

40 mm

XCKU025-2FFVC1517I

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

318150

Yes

.979 V

18180

312

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

100 °C (212 °F)

18180 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

312

40 mm

XCKU115-3FFVA1517E

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1451100

Yes

1.03 V

82920

832

1

Grid Array

BGA1517,39X39,40

.97 V

1 mm

100 °C (212 °F)

82920 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

832

40 mm

XCKU040-L1FLVD1517I

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

530250

Yes

.92 V

30300

520

0.9

Grid Array

BGA1517,39X39,40

.88 V

1 mm

100 °C (212 °F)

30300 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

Also Operates at 0.95 V nominal supply

520

40 mm

XCKU040-L1FFVA1517C

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

530250

Yes

.92 V

30300

520

0.9

Grid Array

BGA1517,39X39,40

.88 V

1 mm

85 °C (185 °F)

30300 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

Also Operates at 0.95 V nominal supply

520

40 mm

XCKU025-3FFVC1517C

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

318150

Yes

1.03 V

18180

312

1

Grid Array

BGA1517,39X39,40

.97 V

1 mm

85 °C (185 °F)

18180 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

312

40 mm

XCKU060-2FLVD1517E

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

725550

Yes

.979 V

41460

624

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

100 °C (212 °F)

41460 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

624

40 mm

XCKU040-3FLVA1517E

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

530250

Yes

1.03 V

30300

520

1

Grid Array

BGA1517,39X39,40

.97 V

1 mm

100 °C (212 °F)

30300 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

520

40 mm

XCKU025-3FFVA1517C

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

318150

Yes

1.03 V

18180

312

1

Grid Array

BGA1517,39X39,40

.97 V

1 mm

85 °C (185 °F)

18180 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

312

40 mm

XCKU025-1FLVA1517E

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

318150

Yes

.979 V

18180

312

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

100 °C (212 °F)

18180 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

312

40 mm

XCKU040-3FLVD1517E

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

530250

Yes

1.03 V

30300

520

1

Grid Array

BGA1517,39X39,40

.97 V

1 mm

100 °C (212 °F)

30300 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

520

40 mm

XCKU040-1FFVC1517C

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

530250

Yes

.979 V

30300

520

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

85 °C (185 °F)

30300 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

520

40 mm

XCKU115-1FFVA1517C

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1451100

Yes

.979 V

82920

832

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

85 °C (185 °F)

82920 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

832

40 mm

XCKU115-L1FFVC1517C

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1451100

Yes

.92 V

82920

832

0.9

Grid Array

BGA1517,39X39,40

.88 V

1 mm

85 °C (185 °F)

82920 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

Also Operates at 0.95 V nominal supply

832

40 mm

XCKU060-3FFVC1517I

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

725550

Yes

1.03 V

41460

624

1

Grid Array

BGA1517,39X39,40

.97 V

1 mm

100 °C (212 °F)

41460 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

624

40 mm

XCKU035-2FFVA1517E

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

444343

Yes

.979 V

25391

520

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

100 °C (212 °F)

25391 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

520

40 mm

XCKU085-3FLVA1517C

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1088325

Yes

1.03 V

62190

676

1

Grid Array

BGA1517,39X39,40

.97 V

1 mm

85 °C (185 °F)

62190 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

676

40 mm

XCKU025-3FFVC1517I

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

318150

Yes

1.03 V

18180

312

1

Grid Array

BGA1517,39X39,40

.97 V

1 mm

100 °C (212 °F)

18180 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

312

40 mm

XCKU035-2FLVA1517I

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

444343

Yes

.979 V

25391

520

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

100 °C (212 °F)

25391 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

520

40 mm

XCKU095-1FLVA1517C

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1176000

Yes

.979 V

67200

702

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

85 °C (185 °F)

67200 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

702

40 mm

XCKU115-3FFVC1517I

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1451100

Yes

1.03 V

82920

832

1

Grid Array

BGA1517,39X39,40

.97 V

1 mm

100 °C (212 °F)

82920 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

832

40 mm

XCKU115-1FFVC1517E

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1451100

Yes

.979 V

82920

832

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

100 °C (212 °F)

82920 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

832

40 mm

XCKU085-L1FLVD1517E

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1088325

Yes

.92 V

62190

676

0.9

Grid Array

BGA1517,39X39,40

.88 V

1 mm

100 °C (212 °F)

62190 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

4.09 mm

40 mm

Also Operates at 0.95 V nominal supply

676

40 mm

XCKU115-2FFVC1517C

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1451100

Yes

.979 V

82920

832

0.95

Grid Array

BGA1517,39X39,40

.922 V

1 mm

85 °C (185 °F)

82920 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.51 mm

40 mm

832

40 mm

XCKU115-1LFLVA1517I

Xilinx

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

1451100

Yes

.979 V

5520

CMOS

624

0.95

Tray

Grid Array

BGA1517,39X39,40

.922 V

1 mm

100 °C (212 °F)

5520 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

4

4.09 mm

40 mm

e1

30 s

624

245 °C (473 °F)

40 mm

XQVU095-1RFC1517M

Xilinx

FPGA

Military

Ball

1517

BGA

Square

Plastic/Epoxy

1176000

Yes

67200

520

.95

Grid Array

125 °C (257 °F)

67200 CLBS

-55 °C (-67 °F)

Tin Lead

Bottom

S-PBGA-B1517

40 mm

e0

520

40 mm

XC2V10000-4FFG1517I

Xilinx

FPGA

Ball

1517

HBGA

Square

Plastic/Epoxy

Yes

1.575 V

15360

CMOS

10000000

1.5

Grid Array, Heat Sink/Slug

1.425 V

1 mm

0.45 ns

15360 CLBS, 10000000 Gates

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B1517

4

3.4 mm

40 mm

No

e1

765 MHz

30 s

245 °C (473 °F)

40 mm

XQVU065-1RFC1517I

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

783300

Yes

44760

520

.95

Grid Array

100 °C (212 °F)

44760 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B1517

40 mm

e0

520

40 mm

XC2V10000-4FFG1517C

Xilinx

FPGA

Other

Ball

1517

HBGA

Square

Plastic/Epoxy

Yes

1.575 V

15360

CMOS

10000000

1.5

Grid Array, Heat Sink/Slug

1.425 V

1 mm

85 °C (185 °F)

0.45 ns

15360 CLBS, 10000000 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B1517

4

3.4 mm

40 mm

No

e1

765 MHz

30 s

245 °C (473 °F)

40 mm

XCKU15P-L1FFVE1517I

Xilinx

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

1143450

Yes

.742 V

65340

668

0.72

Grid Array

BGA1517,39X39,40

.698 V

1 mm

100 °C (212 °F)

65340 CLBs

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

4

3.51 mm

40 mm

e1

668

40 mm

XQVU095-2RFC1517E

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

1176000

Yes

67200

520

.95

Grid Array

100 °C (212 °F)

67200 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1517

40 mm

e0

520

40 mm

XCKU100-3FLVD1517E

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

958440

Yes

1.03 V

4200

338

1

Grid Array

.97 V

1 mm

100 °C (212 °F)

4200 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

4.09 mm

40 mm

e1

338

40 mm

XC2V3000-5FF1517C

Xilinx

FPGA

Other

Ball

1517

HBGA

Square

Plastic/Epoxy

Yes

1.575 V

3584

CMOS

3000000

1.5

Grid Array, Heat Sink/Slug

1.425 V

1 mm

85 °C (185 °F)

0.44 ns

3584 CLBS, 3000000 Gates

0 °C (32 °F)

Tin/Lead

Bottom

S-PBGA-B1517

4

3.4 mm

40 mm

No

e0

934.58 MHz

30 s

225 °C (437 °F)

40 mm

XC4VFX100-10FFG1517IS1

Xilinx

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

94896

Yes

CMOS

768

1.2,1.2/3.3,2.5 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

1 mm

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B1517

4

No

e1

1028 MHz

30 s

768

245 °C (473 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.