1517 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCVU065-1HFFVC1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	783300	Yes	.979 V	44760			520		0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		44760 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 1 V nominal supply	e1		30 s	520	245 °C (473 °F)	40 mm
XCKU075-L1FFVA1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	756000	Yes	.927 V	2592			624		.9		Grid Array			.873 V	1 mm	100 °C (212 °F)		2592 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	624	245 °C (473 °F)	40 mm
XCVU065-H1FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	783300	Yes	.979 V	44760			520		0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		44760 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 1 V nominal supply	e1		30 s	520	245 °C (473 °F)	40 mm
XCVU125-3FLVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1566600	Yes	1.03 V	1200			884		1		Grid Array	BGA1517,39X39,40		.97 V	1 mm	100 °C (212 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	884	245 °C (473 °F)	40 mm
XQKU15P-L1FFRE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340		MIL-PRF-38535	564		0.72		Grid Array	BGA1517,39X39,40		.698 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1517	4	3.71 mm	40 mm			e0		20 s	564	225 °C (437 °F)	40 mm
XCVU080-1FFVD1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672			832		.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		672 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XCKU11P-L2FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.742 V	37320			512		0.72		Grid Array	BGA1517,39X39,40		.698 V	1 mm	110 °C (230 °F)		37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 0.85 V nominal supply	e1		30 s	512	245 °C (473 °F)	40 mm
XCVU080-2FFVD1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672			832		.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		672 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XCKU100-1FLVD1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	958440	Yes	.979 V	4200			338		.95		Grid Array			.922 V	1 mm	100 °C (212 °F)		4200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		4.09 mm	40 mm			e1			338		40 mm
XCVU080-2FFVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672			832		.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		672 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XC2V10000-6FF1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS			10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			15360 CLBS, 10000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XQZU19EG-1FFRB1517I	Xilinx	FPGA SOC		Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340					0.85		Grid Array	BGA1517,40X40,40		.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1517	4	3.71 mm	40 mm			e0		40 s		245 °C (473 °F)	40 mm
XCKU115-3FLVD1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920			832		1		Grid Array	BGA1517,39X39,40		.97 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XC4VFX140-11FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	142128	Yes	1.26 V	15792	CMOS		768		1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		15792 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1181 MHz	30 s	768	245 °C (473 °F)	40 mm
XCKU100-1FLVD1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	958440	Yes	.979 V	4200			338		.95		Grid Array			.922 V	1 mm	85 °C (185 °F)		4200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	338	245 °C (473 °F)	40 mm
XC2VP70-7FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.575 V	8272	CMOS				1.5		Grid Array			1.425 V	1 mm		0.28 ns	8272 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1350 MHz	30 s		245 °C (473 °F)	40 mm
XC2VP70-5FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS		964		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	8272 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1050 MHz	30 s	964	245 °C (473 °F)	40 mm
XC2VP50-6FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS		852		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	5904 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1200 MHz	30 s	852	245 °C (473 °F)	40 mm
XQVU065-2RFC1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	783300	Yes		44760			520		.95		Grid Array					100 °C (212 °F)		44760 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517			40 mm			e0			520		40 mm
XC2V3000-5FF1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS			3000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.44 ns	3584 CLBS, 3000000 Gates		Tin/Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	934.58 MHz	30 s		225 °C (437 °F)	40 mm
XC2V4000-6FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS		912	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	820 MHz	30 s	912	225 °C (437 °F)	40 mm
XC4VFX140-11FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	142128	Yes	1.26 V	15792	CMOS		768		1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm			15792 CLBS		Tin Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1181 MHz	30 s	768	225 °C (437 °F)	40 mm
XCVU080-1HFFVC1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	55714			832		0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		55714 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 1 V nominal supply	e1		30 s	832	245 °C (473 °F)	40 mm
XCVU095-1HFFVC1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			832		0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 1 V nominal supply	e1		30 s	832	245 °C (473 °F)	40 mm
XC2V10000-5FF1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS			10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.39 ns	15360 CLBS, 10000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	880 MHz	30 s		225 °C (437 °F)	40 mm
XC2V3000-5FFG1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS			3000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.44 ns	3584 CLBS, 3000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	934.58 MHz				40 mm
XC2V4000-4FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS		912	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	650 MHz	30 s	912	225 °C (437 °F)	40 mm
XCVU095-L1FFVD1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.927 V	768					.9		Grid Array			.873 V	1 mm			768 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s		245 °C (473 °F)	40 mm
XC2V4000-6FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS		912	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	820 MHz	30 s	912	245 °C (473 °F)	40 mm
XC2V8000-4FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS		1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	11648 CLBS, 8000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	650 MHz	30 s	1108	225 °C (437 °F)	40 mm
XC2V8000-5FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS		1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	11648 CLBS, 8000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	750 MHz	30 s	1108	225 °C (437 °F)	40 mm
XQKU115-1RLA1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes		82920					.95		Grid Array							82920 CLBS		Tin Lead	Bottom	S-PBGA-B1517						e0
XC4VFX140-11FFG1517CS1	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	142128	Yes			CMOS		768			1.2,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4			No		e1	1181 MHz	30 s	768	245 °C (473 °F)
XC2V3000-4FF1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS			3000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.5 ns	3584 CLBS, 3000000 Gates		Tin/Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	813.67 MHz	30 s		225 °C (437 °F)	40 mm
XC4VFX140-11XFF1517C	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	142128	Yes			CMOS		768			1.2,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1517	4			No		e0	1205 MHz	30 s	768	225 °C (437 °F)
XC4VFX100-10FF1517CS1	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes			CMOS		768			1.2,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4			No		e0	1028 MHz	30 s	768	225 °C (437 °F)
XCKU040-1FLVA1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300			520		0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		4.09 mm	40 mm						520		40 mm
XCKU115-L1FLVD1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920			832		0.9		Grid Array	BGA1517,39X39,40		.88 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		4.09 mm	40 mm		Also Operates at 0.95 V nominal supply				832		40 mm
XCKU040-L1FFVC1517C	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	530250	Yes	.92 V	30300			520		0.9		Grid Array	BGA1517,39X39,40		.88 V	1 mm	85 °C (185 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.51 mm	40 mm		Also Operates at 0.95 V nominal supply				520		40 mm
XCKU035-1FFVA1517C	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391			520		0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.51 mm	40 mm						520		40 mm
XCKU040-1FLVD1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300			520		0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		4.09 mm	40 mm						520		40 mm
XCKU095-L1FLVD1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200			702		0.9		Grid Array	BGA1517,39X39,40		.88 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		4.09 mm	40 mm		Also Operates at 0.95 V nominal supply				702		40 mm
XCKU035-L1FLVD1517C	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391			520		0.9		Grid Array	BGA1517,39X39,40		.88 V	1 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		4.09 mm	40 mm		Also Operates at 0.95 V nominal supply				520		40 mm
XCKU025-3FFVC1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180			312		1		Grid Array	BGA1517,39X39,40		.97 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.51 mm	40 mm						312		40 mm
XCKU085-L1FFVA1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190			676		0.9		Grid Array	BGA1517,39X39,40		.88 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.51 mm	40 mm		Also Operates at 0.95 V nominal supply				676		40 mm
XCKU095-3FFVA1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200			702		1		Grid Array	BGA1517,39X39,40		.97 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.51 mm	40 mm						702		40 mm
XCKU115-1FFVA1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920			832		0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.51 mm	40 mm						832		40 mm
XCKU085-1FLVD1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676		0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		4.09 mm	40 mm						676		40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.