1517 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4VFX100-10FF1517IS1	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes			CMOS	768			1.2,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1517	4			No		e0	1028 MHz	30 s	768	225 °C (437 °F)
XCKU100-1FLVA1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	958440	Yes	.979 V	4200		524		.95		Grid Array			.922 V	1 mm	85 °C (185 °F)		4200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	524	245 °C (473 °F)	40 mm
XQKU115-2RLA1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes		82920				.95		Grid Array							82920 CLBS		Tin Lead	Bottom	S-PBGA-B1517						e0
XC2VP40-5FF1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	804		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.37 ns	4848 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1050 MHz	30 s	804	225 °C (437 °F)	40 mm
XC2V3000-6FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS		3000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XC2V4000-4FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	912	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	5760 CLBS, 4000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	650 MHz	30 s	912	225 °C (437 °F)	40 mm
XC2V4000-5FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	912	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	5760 CLBS, 4000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	750 MHz	30 s	912	225 °C (437 °F)	40 mm
XCVU125-1HFLVD1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	89520		884		0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		89520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm		Also Operates at 1 V nominal supply	e1		30 s	884	245 °C (473 °F)	40 mm
XC2VP70-5FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	964		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	8272 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1050 MHz	30 s	964	245 °C (473 °F)	40 mm
XC4VFX140-10FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	142128	Yes	1.26 V	15792	CMOS	768		1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		15792 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1028 MHz	30 s	768	225 °C (437 °F)	40 mm
XCVU080-L1FFVD1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.927 V	672				.9		Grid Array			.873 V	1 mm			672 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s		245 °C (473 °F)	40 mm
XC2VP50-6FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	852		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	5904 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1200 MHz	30 s	852	225 °C (437 °F)	40 mm
XCKU100-2FLVD1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	958440	Yes	.979 V	4200		338		.95		Grid Array			.922 V	1 mm	100 °C (212 °F)		4200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		4.09 mm	40 mm			e1			338		40 mm
XC2V10000-6FFG1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1		30 s		245 °C (473 °F)	40 mm
XCVU080-3FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	975000	Yes	1.03 V	672		832		1		Grid Array	BGA1517,39X39,40		.97 V	1 mm	100 °C (212 °F)		672 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XC2V8000-5FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS	1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	11648 CLBS, 8000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	750 MHz	30 s	1108	245 °C (473 °F)	40 mm
XQKU060-2RFA1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes		41460		624		.95		Grid Array					100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1517			40 mm			e0			624		40 mm
XC2V3000-5FFG1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS		3000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.44 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	934.58 MHz				40 mm
XCKU115-3FLVA1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	5520		832		1	1 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
XCVU095-2FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768		832		.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XCVU095-L1FFVC1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.927 V	768				.9		Grid Array			.873 V	1 mm			768 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s		245 °C (473 °F)	40 mm
XC2V6000-4FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	1104	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	8448 CLBS, 6000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	650 MHz	30 s	1104	225 °C (437 °F)	40 mm
XC2V8000-6FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS	1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	11648 CLBS, 8000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	820 MHz	30 s	1108	225 °C (437 °F)	40 mm
XCVU080-3FFVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	975000	Yes	1.03 V	672		832		1		Grid Array	BGA1517,39X39,40		.97 V	1 mm	100 °C (212 °F)		672 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XC2V6000-5FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	1104	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	750 MHz	30 s	1104	245 °C (473 °F)	40 mm
XC4VFX100-10FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS	768		1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		10544 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1028 MHz	30 s	576	225 °C (437 °F)	40 mm
XCKU115-1FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832		.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
XC2V4000-5FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	912	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	750 MHz	30 s	912	245 °C (473 °F)	40 mm
XCKU15P-1FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668		0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	668	245 °C (473 °F)	40 mm
XCKU115-L1FLVD1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.927 V	5520		832		.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.873 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	832	245 °C (473 °F)	40 mm
XC4VFX100-12FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS	768		1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		10544 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1181 MHz	30 s	576	225 °C (437 °F)	40 mm
XC4VFX140-11FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	142128	Yes	1.26 V	15792	CMOS	768		1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm			15792 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1181 MHz	30 s	768	245 °C (473 °F)	40 mm
XC2VP50-7FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	852		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	5904 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1350 MHz	30 s	852	245 °C (473 °F)	40 mm
XCKU100-1FLVA1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	958440	Yes	.979 V	4200		524		.95		Grid Array			.922 V	1 mm	100 °C (212 °F)		4200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		4.09 mm	40 mm			e1			524		40 mm
XQZU19EG-L1FFRB1517I	Xilinx	FPGA SOC		Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340				0.85		Grid Array	BGA1517,40X40,40		.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1517	4	3.71 mm	40 mm			e0		40 s		245 °C (473 °F)	40 mm
XC2VP50-6FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	852		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	5904 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1200 MHz	30 s	852	245 °C (473 °F)	40 mm
XCVU080-L1FFVC1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.927 V	672				.9		Grid Array			.873 V	1 mm			672 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s		245 °C (473 °F)	40 mm
XQZU19EG-1FFRB1517M	Xilinx	FPGA SOC		Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340				0.85		Grid Array	BGA1517,40X40,40		.825 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B1517	4	3.71 mm	40 mm			e0		40 s		245 °C (473 °F)	40 mm
XC2VP40-5FFG1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	4848	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.37 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1050 MHz	30 s		245 °C (473 °F)	40 mm
XC4VFX140-12FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.26 V	15792	CMOS			1.2		Grid Array			1.14 V	1 mm			15792 CLBS		Tin Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XC2V6000-6FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	1104	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	820 MHz	30 s	1104	245 °C (473 °F)	40 mm
XC2V6000-4FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	1104	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	8448 CLBS, 6000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	650 MHz	30 s	1104	245 °C (473 °F)	40 mm
XCKU115-2FLVD1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832		.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
XCKU115-1FLVA1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832		.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
XQZU19EG-2FFRB1517I	Xilinx	FPGA SOC		Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340				0.85		Grid Array	BGA1517,40X40,40		.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1517	4	3.71 mm	40 mm			e0		40 s		245 °C (473 °F)	40 mm
XC2V3000-6FFG1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS		3000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			3584 CLBS, 3000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1					40 mm
XC2VP70-7FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	964		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.28 ns	8272 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1350 MHz	30 s	964	225 °C (437 °F)	40 mm
XCVU095-2FFVD1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768		832		.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.