1760 Field Programmable Gate Arrays (FPGA) 738

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU035-L1FLVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391		520	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm		Also Operates at 0.95 V nominal supply				520		42.5 mm
XCKU025-3FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180		312	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						312		42.5 mm
XCKU040-L1FLVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	.92 V	30300		520	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	85 °C (185 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm		Also Operates at 0.95 V nominal supply				520		42.5 mm
XCKU085-L1FLVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190		676	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm		Also Operates at 0.95 V nominal supply				676		42.5 mm
XCKU035-1FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						520		42.5 mm
XCKU060-1FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						624		42.5 mm
XCKU085-3FLVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						676		42.5 mm
XCKU095-2FLVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						702		42.5 mm
XCKU035-1FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						520		42.5 mm
XCKU025-1FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						312		42.5 mm
XCKU040-2FLVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						520		42.5 mm
XCKU040-3FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300		520	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						520		42.5 mm
XCKU040-L1FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	.92 V	30300		520	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm		Also Operates at 0.95 V nominal supply				520		42.5 mm
XCKU060-3FLVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460		624	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						624		42.5 mm
XCKU025-L1FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm		Also Operates at 0.95 V nominal supply				312		42.5 mm
XCKU040-3FLVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300		520	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	85 °C (185 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						520		42.5 mm
XCKU040-1FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						520		42.5 mm
XCKU085-1FLVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						676		42.5 mm
XCKU060-2FLVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						624		42.5 mm
XCKU025-3FLVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180		312	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						312		42.5 mm
XCKU035-1FLVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						520		42.5 mm
XCKU095-L1FLVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200		702	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm		Also Operates at 0.95 V nominal supply				702		42.5 mm
XCKU095-1FLVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						702		42.5 mm
XCKU025-2FLVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						312		42.5 mm
XCKU040-1FLVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						520		42.5 mm
XCKU060-2FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						624		42.5 mm
XCKU115-3FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						832		42.5 mm
XCKU040-3FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300		520	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						520		42.5 mm
XCKU085-2FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						676		42.5 mm
XCKU035-2FLVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						520		42.5 mm
XCKU040-3FLVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300		520	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						520		42.5 mm
XCKU035-3FLVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						520		42.5 mm
XCKU025-1FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						312		42.5 mm
XCKU035-L1FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391		520	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm		Also Operates at 0.95 V nominal supply				520		42.5 mm
XCKU095-1FLVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						702		42.5 mm
XCKU095-L1FLVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200		702	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm		Also Operates at 0.95 V nominal supply				702		42.5 mm
XCKU095-2FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						702		42.5 mm
XC5VLX110-1FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	8640 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1		30 s	800	245 °C (473 °F)	42.5 mm
XC5VLX220-2FFV1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280		800	1		Grid Array	BGA1760,42X42,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	17280 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm					30 s	800	245 °C (473 °F)	42.5 mm
XC6VLX550T-1FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS	1200	1	1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XCVU125-2FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200		884	.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		1200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm			e1		30 s	884	245 °C (473 °F)	42.5 mm
XC7VX485T-2FF1761I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS	700	1	1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1760				No		e0	1818 MHz		700
XC7VX330T-3FF1761E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	326400	Yes			CMOS	650		1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1760				No		e0	1818 MHz		650
XC5VLX155-2FFV1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		800	1		Grid Array	BGA1760,42X42,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	12160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm					30 s	800	245 °C (473 °F)	42.5 mm
XC5VLX110-2FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	8640 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1		30 s	800	245 °C (473 °F)	42.5 mm
XCVU095-2FFVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768		832	.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.81 mm	42.5 mm			e1		30 s	832	245 °C (473 °F)	42.5 mm
XC6VLX760-L1FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	.93 V		CMOS	1200	.9	1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1	1098 MHz	30 s	1200	245 °C (473 °F)	42.5 mm
XC7VX485T-2FF1761C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS	700	1	1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1760				No		e0	1818 MHz		700

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.