1760 Field Programmable Gate Arrays (FPGA) 738

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU025-L1FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm		Also Operates at 0.95 V nominal supply				312		42.5 mm
XCKU085-2FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						676		42.5 mm
XCKU040-1FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						520		42.5 mm
XCKU060-2FLVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						624		42.5 mm
XCKU025-3FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180		312	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						312		42.5 mm
XCKU115-2FLVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						832		42.5 mm
XCKU035-3FLVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						520		42.5 mm
XCKU025-1FLVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						312		42.5 mm
XCKU060-L1FLVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm		Also Operates at 0.95 V nominal supply				624		42.5 mm
XCKU115-3FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						832		42.5 mm
XCKU115-2FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						832		42.5 mm
XCKU060-2FLVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						624		42.5 mm
XCKU085-3FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						676		42.5 mm
XCKU115-L1FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920		832	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm		Also Operates at 0.95 V nominal supply				832		42.5 mm
XCKU095-2FLVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						702		42.5 mm
XCKU060-L1FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm		Also Operates at 0.95 V nominal supply				624		42.5 mm
XCKU025-L1FLVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm		Also Operates at 0.95 V nominal supply				312		42.5 mm
XCKU060-L1FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm		Also Operates at 0.95 V nominal supply				624		42.5 mm
XCKU025-2FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						312		42.5 mm
XCKU040-2FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						520		42.5 mm
XCKU040-2FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	85 °C (185 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						520		42.5 mm
XCKU035-2FLVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						520		42.5 mm
XCKU115-L1FLVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920		832	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm		Also Operates at 0.95 V nominal supply				832		42.5 mm
XCKU025-1FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						312		42.5 mm
XCKU060-L1FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm		Also Operates at 0.95 V nominal supply				624		42.5 mm
XCKU115-1FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						832		42.5 mm
XCKU040-L1FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	.92 V	30300		520	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm		Also Operates at 0.95 V nominal supply				520		42.5 mm
XCKU095-3FLVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200		702	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						702		42.5 mm
XCKU085-L1FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190		676	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm		Also Operates at 0.95 V nominal supply				676		42.5 mm
XCKU025-1FLVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						312		42.5 mm
XCKU040-L1FLVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	.92 V	30300		520	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm		Also Operates at 0.95 V nominal supply				520		42.5 mm
XCKU040-3FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300		520	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	85 °C (185 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						520		42.5 mm
XCKU115-L1FLVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920		832	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm		Also Operates at 0.95 V nominal supply				832		42.5 mm
XCKU035-3FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						520		42.5 mm
XCKU115-L1FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920		832	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm		Also Operates at 0.95 V nominal supply				832		42.5 mm
XCKU060-3FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460		624	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						624		42.5 mm
XC6VLX760-2FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	1.05 V		CMOS	1200	1	1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1	1286 MHz	30 s	1200	245 °C (473 °F)	42.5 mm
XCKU095-1FFVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm	No		e1		30 s	702	245 °C (473 °F)	42.5 mm
XC7V585T-1FF1761I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	582720	Yes			CMOS	750		1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1760				No		e0	1818 MHz		750
EP3SL340F1760C4	Altera	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	337500	Yes	.94 V		CMOS	1120	.9	1.2/3.3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.9 mm	42.5 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	1120	220 °C (428 °F)	42.5 mm
5SGXEBBR2H43C2LN	Altera	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	952000	Yes	.88 V	35920	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		35920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4 mm	45 mm	No					600		45 mm
5SGXEB9R1H43C2LN	Altera	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	840000	Yes	.88 V	31700	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		31700 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4 mm	45 mm	No					600		45 mm
EP3SL340F1760I2L	Altera	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	337500	Yes			CMOS	1120		1.2/3.3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1760	1			No		e0	100 MHz		1120
5SGXMB9R1H43I2N	Altera	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	840000	Yes	.93 V	31700	CMOS	600	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		31700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4 mm	45 mm	No					600		45 mm
EP4SE530F43C3	Altera	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	531200	Yes		212480	CMOS	976		0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		212480 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.7 mm	42.5 mm	No		e0		20 s	976	220 °C (428 °F)	42.5 mm
5SGXMBBR3H43I3N	Altera	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	952000	Yes	.88 V	35920	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		35920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4 mm	45 mm	No					600		45 mm
5SGXMB9R2H43I2	Altera	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	840000	Yes			CMOS	600		0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1760				No					600
5SGXEB9R3H43I4	Altera	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	840000	Yes	.88 V	31700	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		31700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4 mm	45 mm	No					600		45 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.