1760 Field Programmable Gate Arrays (FPGA) 738

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VLX760-L1FF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	.93 V		CMOS	1200	.9	1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC6VLX760-2FFG1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes			CMOS	1200		1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B1760	4			No		e1	1286 MHz	30 s	1200	245 °C (473 °F)
XCVU095-1HFFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		832	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		Also Operates at 1 V nominal supply	e1		30 s	832	245 °C (473 °F)	42.5 mm
XC5VLX330-2FF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920		1200	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	25920 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0		30 s	1200	225 °C (437 °F)	42.5 mm
XCKU100-1FLVB1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	958440	Yes	.979 V	4200		602	.95		Grid Array			.922 V		85 °C (185 °F)		4200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760			42.5 mm			e1			602		42.5 mm
XCVU095-L1FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy		Yes	.927 V	768			.9		Grid Array			.873 V	1 mm			768 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.81 mm	42.5 mm			e1		30 s		245 °C (473 °F)	42.5 mm
XC7VX485T-3FF1761E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS	700	1	1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1760				No		e0	1818 MHz		700
XC5VLX155-3FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	12160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1		30 s	800	245 °C (473 °F)	42.5 mm
XC5VLX330-1FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920		1200	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	25920 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0		30 s	1200	225 °C (437 °F)	42.5 mm
XC5VLX110-1FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	8640 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1		30 s	800	245 °C (473 °F)	42.5 mm
XC5VLX155-1FFV1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		800	1		Grid Array	BGA1760,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	12160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm					30 s	800	245 °C (473 °F)	42.5 mm
XC6VLX550T-1LFFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes	.93 V	42960	CMOS	1200	0.9		Grid Array	BGA1760,42X42,40		.87 V	1 mm	85 °C (185 °F)	0.85 ns	42960 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm			e1			1200		42.5 mm
XC5VLX220-2FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	17280 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1		30 s	800	225 °C (437 °F)	42.5 mm
XCKU19P-1FFVJ1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300		540	0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm			e1			540		42.5 mm
XC7VX690T-3FF1761E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	850		1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1760				No		e0	1818 MHz		850
XC4VFX140-11FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	142128	Yes	1.26 V	15792	CMOS	896	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		15792 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1	1205 MHz	30 s	896	225 °C (437 °F)	42.5 mm
XC5VLX220-2FF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	17280 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0		30 s	800	225 °C (437 °F)	42.5 mm
XCKU19P-2FFVJ1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300		540	0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		105300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm			e1			540		42.5 mm
XQZU11EG-2FFRC1760I	Xilinx	FPGA SOC		Ball	1760	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320		512	0.85		Grid Array	BGA1760,42.5X42.5,40		.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e0		40 s	512	245 °C (473 °F)	42.5 mm
XCKU115-3FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm			e1		30 s	832	245 °C (473 °F)	42.5 mm
XC7V585T-3FF1761E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	582720	Yes			CMOS	750		1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1760				No		e0	1818 MHz		750
XC5VLX330-1FF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920		1200	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	25920 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0		30 s	1200	225 °C (437 °F)	42.5 mm
XCKU075-3FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	756000	Yes	1.03 V	2592		702	1		Grid Array			.97 V	1 mm	100 °C (212 °F)		2592 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.81 mm	42.5 mm			e1		30 s	702	245 °C (473 °F)	42.5 mm
XCKU100-L1FLVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	958440	Yes	.927 V	4200		602	.9		Grid Array			.873 V		100 °C (212 °F)		4200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760			42.5 mm			e1			602		42.5 mm
XC5VLX110-1FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	8640 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0		30 s	800	225 °C (437 °F)	42.5 mm
XC7V2000T-G2FH1761E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V		CMOS	850	1	1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1760				No		e0	1818 MHz		850
XC5VLX155-3FFV1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		800	1		Grid Array	BGA1760,42X42,40		.95 V	1 mm	85 °C (185 °F)	0.67 ns	12160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm					30 s	800	245 °C (473 °F)	42.5 mm
XCVU125-3FLVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1566600	Yes	1.03 V	1200		884	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm			e1		30 s	884	245 °C (473 °F)	42.5 mm
XC4VFX140-10FF1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy		Yes	1.26 V	15792	CMOS		1.2		Grid Array			1.14 V	1 mm			15792 CLBS		Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0		30 s		225 °C (437 °F)	42.5 mm
XC5VLX110-2FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	8640 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1		30 s	800	245 °C (473 °F)	42.5 mm
XC5VLX330-2FFV1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920		1200	1		Grid Array	BGA1760,42X42,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	25920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm					30 s	1200	245 °C (473 °F)	42.5 mm
XCKU115-1FLVB1760E	Xilinx	FPGA	Commercial Extended	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm			e1		30 s	832	245 °C (473 °F)	42.5 mm
XCKU035-3FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						520		42.5 mm
XCKU060-1FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						624		42.5 mm
XCKU085-3FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						676		42.5 mm
XCKU025-L1FLVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm		Also Operates at 0.95 V nominal supply				312		42.5 mm
XCKU115-3FLVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						832		42.5 mm
XCKU040-2FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						520		42.5 mm
XCKU025-L1FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm		Also Operates at 0.95 V nominal supply				312		42.5 mm
XCKU095-2FLVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						702		42.5 mm
XCKU095-L1FFVB1760C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200		702	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm		Also Operates at 0.95 V nominal supply				702		42.5 mm
XCKU095-1FLVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						702		42.5 mm
XCKU060-L1FLVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm		Also Operates at 0.95 V nominal supply				624		42.5 mm
XCKU035-L1FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391		520	0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm		Also Operates at 0.95 V nominal supply				520		42.5 mm
XCKU035-2FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						520		42.5 mm
XCKU085-1FFVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						676		42.5 mm
XCKU035-3FLVB1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520	1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4.11 mm	42.5 mm						520		42.5 mm
XCKU060-1FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.71 mm	42.5 mm						624		42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.