1760 Field Programmable Gate Arrays (FPGA) 738

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VLX760-L1FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	.93 V		CMOS	1200	.9		1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0	1098 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC7V2000T-L2FH1761E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V		CMOS	850	1		1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1760				No	e0	1818 MHz		850
XC6VLX550T-2FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS	1200	1		1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1	1286 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC6VLX550T-L1FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes	.93 V		CMOS	1200	.9		1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1	1098 MHz	30 s	1200	245 °C (473 °F)	42.5 mm
XCKU15P-3FFVE1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.927 V	65340		668	0.9			Grid Array	BGA1760,42X42,40		.873 V	1 mm	100 °C (212 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e1		30 s	668	245 °C (473 °F)	42.5 mm
XC6VLX760-2FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	1.05 V		CMOS	1200	1		1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0	1286 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC5VLX110-3FF1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	8640	Yes			CMOS	800			1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1760	4			No	e0	710 MHz	30 s	800	225 °C (437 °F)
XC6VLX550T-1FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS	1200	1		1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1	1098 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC5VLX110-3FFG1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	8640	Yes			CMOS	800			1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B1760	4			No	e1	710 MHz	30 s	800	245 °C (473 °F)
XC5VLX330-1FFV1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920		1200	1			Grid Array	BGA1760,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	25920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm				30 s	1200	245 °C (473 °F)	42.5 mm
XC6VLX550T-2FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS	1200	1		1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1	1286 MHz	30 s	1200	245 °C (473 °F)	42.5 mm
XC4VFX140-11FFG1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	142128	Yes	1.26 V	15792	CMOS	896	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	1.14 V	1 mm			15792 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1	1205 MHz	30 s	896	225 °C (437 °F)	42.5 mm
XCKU115-1LFLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520	CMOS	702	0.95	Tray		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e1		30 s	702	245 °C (473 °F)	42.5 mm
XC7V2000T-1FH1761I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V		CMOS	850	1		1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1760				No	e0	1818 MHz		850
XC6VLX550T-3FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V	42960	CMOS	1200	1			Grid Array	BGA1760,42X42,40		.95 V	1 mm	85 °C (185 °F)	0.59 ns	42960 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm		e1		30 s	1200	245 °C (473 °F)	42.5 mm
XCKU095-1FFVB1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm	No	e1		30 s	702	245 °C (473 °F)	42.5 mm
XCKU15P-1FFVA1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85			Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e1		30 s	668	245 °C (473 °F)	42.5 mm
XCVU095-1FFVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768		832	.95			Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.81 mm	42.5 mm		e1		30 s	832	245 °C (473 °F)	42.5 mm
XCVU095-3FFVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	768		832	1			Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.81 mm	42.5 mm		e1		30 s	832	245 °C (473 °F)	42.5 mm
XQZU19EG-2FFRC1760I	Xilinx	FPGA SOC		Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		512	0.85			Grid Array	BGA1760,42.5X42.5,40		.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e0		40 s	512	245 °C (473 °F)	42.5 mm
XCVU080-1FFVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672		832	.95			Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		672 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.81 mm	42.5 mm		e1		30 s	832	245 °C (473 °F)	42.5 mm
XC6VLX760-2FF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	1.05 V		CMOS	1200	1		1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0	1286 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XCVU080-L1FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy		Yes	.927 V	672			.9			Grid Array			.873 V	1 mm			672 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.81 mm	42.5 mm		e1		30 s		245 °C (473 °F)	42.5 mm
XC5VLX155-2FFV1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		800	1			Grid Array	BGA1760,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	12160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm				30 s	800	245 °C (473 °F)	42.5 mm
XC5VLX330-1FFV1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920		1200	1			Grid Array	BGA1760,42X42,40		.95 V	1 mm	85 °C (185 °F)	0.9 ns	25920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm				30 s	1200	245 °C (473 °F)	42.5 mm
XC5VLX155-1FFV1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		800	1			Grid Array	BGA1760,42X42,40		.95 V	1 mm	85 °C (185 °F)	0.9 ns	12160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm				30 s	800	245 °C (473 °F)	42.5 mm
XC6VLX760-1LFF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	.93 V	59280	CMOS	1200	0.9			Grid Array	BGA1760,42X42,40		.87 V	1 mm	85 °C (185 °F)	0.85 ns	59280 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm		e0			1200		42.5 mm
XC6VLX760-1FF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	1.05 V		CMOS	1200	1		1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0	1098 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC7VX690T-1FF1761I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	850			1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1760				No	e0	1818 MHz		850
XC5VLX110-3FF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800	1		1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	8640 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0		30 s	800	225 °C (437 °F)	42.5 mm
XC5VLX110-2FF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800	1		1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	8640 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0		30 s	800	225 °C (437 °F)	42.5 mm
XCVU125-2FLVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200		884	.95			Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm		e1		30 s	884	245 °C (473 °F)	42.5 mm
XCKU19P-2FFVJ1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300		540	0.85			Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm		e1			540		42.5 mm
XC7V1500T-G2FLG1761E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic	1465920	Yes			CMOS	850			1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1760				No		1286 MHz		850
XC6VLX550T-2FFG1760E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes			CMOS	1200			1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B1760	4			No	e1	1286 MHz	30 s	1200	245 °C (473 °F)
XC5VLX220-2FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280		800	1		1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	17280 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1		30 s	800	225 °C (437 °F)	42.5 mm
XC5VLX220-2FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280		800	1		1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	17280 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0		30 s	800	225 °C (437 °F)	42.5 mm
XC7VX690T-1FF1761C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	850			0.9,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1760				No	e0	1818 MHz		850
XCKU075-1FFVB1760I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	756000	Yes	.979 V	2592		702	.95			Grid Array			.922 V	1 mm	100 °C (212 °F)		2592 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.81 mm	42.5 mm		e1		30 s	702	245 °C (473 °F)	42.5 mm
XC5VLX155-3FF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		800	1		1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	12160 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0			800		42.5 mm
XC4VFX140-11FF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy		Yes	1.26 V	15792	CMOS		1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)		15792 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0		30 s		225 °C (437 °F)	42.5 mm
XC7VX330T-1FF1761C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	326400	Yes			CMOS	650			0.9,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1760				No	e0	1818 MHz		650
XC4VFX140-12FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	142128	Yes	1.26 V	15792	CMOS	896	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		15792 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1	1181 MHz	30 s	896	225 °C (437 °F)	42.5 mm
XC5VLX155-1FF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		800	1		1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	12160 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0		30 s	800	225 °C (437 °F)	42.5 mm
XC7VX690T-L2FF1761E	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	850			1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1760				No	e0	1818 MHz		850
XCKU115-3FLVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	5520		832	1		1 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No	e1		30 s	832	245 °C (473 °F)	42.5 mm
XC5VLX220-2FFV1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280		800	1			Grid Array	BGA1760,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	17280 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm				30 s	800	245 °C (473 °F)	42.5 mm
XC5VLX155-2FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		800	1		1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	12160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1		30 s	800	225 °C (437 °F)	42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.