1924 Field Programmable Gate Arrays (FPGA) 306

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU115-2FLVD1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832	.95		0.95 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	832	245 °C (473 °F)	45 mm
XC7V2000T-1FL1925C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1954560	Yes	.93 V		CMOS	1200	0.9		0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		1200
XC7VX690T-1FF1930C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	1000			0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		1000
XC7VX690T-2FF1930I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	1000			1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		1000
XCKU115-1FLVF1924C	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832	.95		0.95 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	832	245 °C (473 °F)	45 mm
XCKU115-2FLVF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832	.95		0.95 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	832	245 °C (473 °F)	45 mm
XCKU085-3FLVF1924E	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676	1		1 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	676	245 °C (473 °F)	45 mm
XCVU11P-3FLGF1924E	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	2835000	Yes	.927 V	162000		624	0.9			Grid Array	BGA1924,44X44,40		.873 V	1 mm	100 °C (212 °F)		162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.24 mm	45 mm						624		45 mm
XC7VX1140T-1FL1926C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1139200	Yes			CMOS	720			0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		720
XC7VX690T-1FF1926C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	720			0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		720
XC7VX550T-2FF1927I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	554240	Yes			CMOS	600			1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		600
XC7VX690T-L2FF1926E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	720			1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		720
XCKU085-1FLVF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95		0.95 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	676	245 °C (473 °F)	45 mm
XCVU11P-2FLGF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	37320		624	.85			Grid Array	BGA1924,44X44,40		.825 V	1 mm	100 °C (212 °F)		37320 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924		4.24 mm	45 mm						624		45 mm
XC7VX485T-L2FF1930E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS	700	1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		700
XCKU100-1FLVD1924C	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	958440	Yes	.979 V	4200		832	.95			Grid Array			.922 V	1 mm	85 °C (185 °F)		4200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924		4.13 mm	45 mm			e1			832		45 mm
XC7VX550T-L2FF1927E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	554240	Yes			CMOS	600			1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		600
XC7VX485T-3FF1927E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS	600	1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		600
XCKU115-3FLVD1924E	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	5520		832	1		1 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	832	245 °C (473 °F)	45 mm
XC7VX1140T-1FL1928C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1139200	Yes			CMOS	480			0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		480
XC6VHX380T-2FF1924E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	640	1		1,1.2/2.5 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm					Tin Lead	Bottom	S-PBGA-B1924	4	3.85 mm	45 mm	No		e0	1286 MHz	30 s	640	225 °C (437 °F)	45 mm
XCVU11P-1FLGF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000		624	0.85			Grid Array	BGA1924,44X44,40		.825 V	1 mm	100 °C (212 °F)		162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924		4.24 mm	45 mm						624		45 mm
XCKU115-1FLVF1924E	Xilinx	FPGA	Commercial Extended	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832	0.95			Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm			e1		30 s	832	245 °C (473 °F)	45 mm
XCKU100-2FLVD1924E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	958440	Yes	.979 V	4200		832	.95			Grid Array			.922 V	1 mm	100 °C (212 °F)		4200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924		4.13 mm	45 mm			e1			832		45 mm
XC7VX1140T-G2FL1928E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1139200	Yes			CMOS	480			1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		480
XC7VX690T-1FF1926I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	720			1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		720
XC6VHX565T-1FF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V		CMOS	640	1		1,1.2/2.5 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1924	4	3.85 mm	45 mm	No		e0	1098 MHz	30 s	640	225 °C (437 °F)	45 mm
XC6VHX380T-1FF1924C	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	640	1		1,1.2/2.5 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1924	4	3.85 mm	45 mm	No		e0	1098 MHz	30 s	640	225 °C (437 °F)	45 mm
XC6VHX565T-2FF1923C	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V		CMOS	720	1		1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1924		3.85 mm	45 mm	No		e0	1286 MHz		720		45 mm
XC6VHX565T-1FFG1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V		CMOS	640	1		1,1.2/2.5 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1924	4	3.85 mm	45 mm	No		e1	1098 MHz	30 s	640	245 °C (473 °F)	45 mm
XC6VHX380T-2FF1923E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	720	1		1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm					Tin Lead	Bottom	S-PBGA-B1924		3.85 mm	45 mm	No		e0	1286 MHz		720		45 mm
XQKU115-2RLF1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy		Yes		82920			.95			Grid Array				1 mm			82920 CLBS		Tin Lead	Bottom	S-PBGA-B1924		4.15 mm	45 mm			e0					45 mm
XC6VHX255T-1FF1923I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	253440	Yes	1.05 V		CMOS	480	1		1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1924		3.85 mm	45 mm	No		e0	1098 MHz		480		45 mm
XC7VX550T-2FF1927C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	554240	Yes			CMOS	600			1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		600
XC7VX415T-2FF1927C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	412160	Yes			CMOS	600			1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		600
XC6VHX565T-2FF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V		CMOS	640	1		1,1.2/2.5 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1924	4	3.85 mm	45 mm	No		e0	1286 MHz	30 s	640	225 °C (437 °F)	45 mm
XC7VX485T-2FF1930C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS	700	1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		700
XC7VX980T-1FF1930I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	979200	Yes			CMOS	900			1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		900
XC6VHX565T-2FF1923E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V		CMOS	720	1		1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm					Tin Lead	Bottom	S-PBGA-B1924		3.85 mm	45 mm	No		e0	1286 MHz		720		45 mm
XCKU085-2FLVF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95		0.95 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	676	245 °C (473 °F)	45 mm
XC7VX980T-1FF1926C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	979200	Yes			CMOS	720			0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		720
XC7VX1140T-1FL1930I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1139200	Yes			CMOS	1100			1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		1100
XCKU115-L1FLVD1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	.927 V	5520		832	.9		0.9 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.873 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	832	245 °C (473 °F)	45 mm
XC6VHX380T-1FF1923I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	720	1		1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1924		3.85 mm	45 mm	No		e0	1098 MHz		720		45 mm
XC7VX690T-1FF1927C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	600			0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		600
XCKU085-1LFLVF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	4100	CMOS	624	0.95	Tray		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)		4100 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm			e1		30 s	624	245 °C (473 °F)	45 mm
XC6VHX380T-3FF1923C	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	720	1		1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1924		3.85 mm	45 mm	No		e0	1412 MHz		720		45 mm
XCKU115-L1FLVF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	.927 V	5520		832	.9		0.9 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.873 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	832	245 °C (473 °F)	45 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.