1924 Field Programmable Gate Arrays (FPGA) 306

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7VX485T-2FF1927C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS	600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		600
XC7VX980T-1FF1930C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	979200	Yes			CMOS	900		0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		900
XC7VX690T-3FF1926E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	720		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		720
XCKU085-L1FLVF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190		676	0.9	0.9 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.88 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	676	245 °C (473 °F)	45 mm
XC7VX980T-1FF1928I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	979200	Yes			CMOS	480		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1924				No			1818 MHz		480
XC6VHX380T-2FFG1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	640	1	1,1.2/2.5 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1924	4	3.85 mm	45 mm	No		e1	1286 MHz	30 s	640	245 °C (473 °F)	45 mm
XCKU100-L1FLVF1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	958440	Yes	.927 V	4200		728	.9		Grid Array			.873 V	1 mm	100 °C (212 °F)		4200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924		4.13 mm	45 mm			e1			728		45 mm
XC7VX485T-2FF1927I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS	600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		600
XC7V2000T-2FL1925C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V		CMOS	1200	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		1200
XC6VHX380T-1FFG1924C	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	640	1	1,1.2/2.5 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1924	4	3.85 mm	45 mm	No		e1	1098 MHz	30 s	640	245 °C (473 °F)	45 mm
XC7VX485T-1FF1927C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	485760	Yes	.93 V		CMOS	600	0.9	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		600
XC6VHX565T-1FFG1924C	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V		CMOS	640	1	1,1.2/2.5 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1924	4	3.85 mm	45 mm	No		e1	1098 MHz	30 s	640	245 °C (473 °F)	45 mm
XC7VX980T-L2FF1928E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	979200	Yes			CMOS	480		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1924				No			1818 MHz		480
XC7VX485T-1FF1927I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS	600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		600
XC6VHX380T-3FFG1924C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes			CMOS	640		1,1.2/2.5 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1924	4			No		e1	1412 MHz	30 s	640	245 °C (473 °F)
XC7V2000T-1FL1925I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V		CMOS	1200	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		1200
XC6VHX380T-1FF1923C	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	720	1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1924		3.85 mm	45 mm	No		e0	1098 MHz		720		45 mm
XC6VHX380T-2FFG1924E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes			CMOS	640		1,1.2/2.5 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B1924	4			No		e1	1286 MHz	30 s	640	245 °C (473 °F)
XC6VHX380T-1FF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	640	1	1,1.2/2.5 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1924	4	3.85 mm	45 mm	No		e0	1098 MHz	30 s	640	225 °C (437 °F)	45 mm
XC7VX1140T-L2FL1930E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1139200	Yes			CMOS	1100		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		1100
XC7VX980T-L2FF1930E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	979200	Yes			CMOS	900		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		900
XC7V2000T-L2FL1925E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V		CMOS	1200	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		1200
XC7VX1140T-2FL1926C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1139200	Yes			CMOS	720		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		720
XC7VX690T-L2FF1927E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	600		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		600
XCKU095-2FLVD1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						702		45 mm
XCKU025-3FLVF1924C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180		312	1		Grid Array	BGA1924,44X44,40		.97 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						312		45 mm
XCKU035-1FLVD1924C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						520		45 mm
XCKU035-2FLVD1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						520		45 mm
XCKU085-3FLVF1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676	1		Grid Array	BGA1924,44X44,40		.97 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						676		45 mm
XCKU095-2FLVD1924C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						702		45 mm
XCKU040-1FLVF1924C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	85 °C (185 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						520		45 mm
XCKU060-2FLVD1924C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						624		45 mm
XCKU035-2FLVD1924E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						520		45 mm
XCKU035-3FLVF1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520	1		Grid Array	BGA1924,44X44,40		.97 V	1 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						520		45 mm
XCKU095-1FLVF1924E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						702		45 mm
XCKU115-L1FLVD1924C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920		832	0.9		Grid Array	BGA1924,44X44,40		.88 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm		Also Operates at 0.95 V nominal supply				832		45 mm
XCKU060-3FLVF1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460		624	1		Grid Array	BGA1924,44X44,40		.97 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						624		45 mm
XCKU060-L1FLVF1924C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624	0.9		Grid Array	BGA1924,44X44,40		.88 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm		Also Operates at 0.95 V nominal supply				624		45 mm
XCKU085-L1FLVD1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190		676	0.9		Grid Array	BGA1924,44X44,40		.88 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm		Also Operates at 0.95 V nominal supply				676		45 mm
XCKU025-1FLVF1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						312		45 mm
XCKU115-3FLVD1924C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832	1		Grid Array	BGA1924,44X44,40		.97 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						832		45 mm
XCKU060-3FLVF1924C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460		624	1		Grid Array	BGA1924,44X44,40		.97 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						624		45 mm
XCKU095-3FLVF1924E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200		702	1		Grid Array	BGA1924,44X44,40		.97 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						702		45 mm
XCKU060-2FLVF1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						624		45 mm
XCKU085-1FLVD1924C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						676		45 mm
XCKU040-2FLVF1924E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						520		45 mm
XCKU035-3FLVD1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520	1		Grid Array	BGA1924,44X44,40		.97 V	1 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						520		45 mm
XCKU025-1FLVD1924E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.13 mm	45 mm						312		45 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.