1924 Field Programmable Gate Arrays (FPGA) 306

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XCKU085-1LFLVF1924I

Xilinx

FPGA

Industrial

Ball

1924

BGA

Square

Plastic/Epoxy

1088325

Yes

.979 V

4100

CMOS

624

0.95

Tray

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

4100 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1924

4

4.13 mm

45 mm

e1

30 s

624

245 °C (473 °F)

45 mm

XC6VHX380T-3FF1923C

Xilinx

FPGA

Other

Ball

1924

BGA

Square

Plastic/Epoxy

382464

Yes

1.05 V

CMOS

720

1

1,1.2/2.5 V

Grid Array

BGA1923,44X44,40

Field Programmable Gate Arrays

.95 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1924

3.85 mm

45 mm

No

e0

1412 MHz

720

45 mm

XCKU115-L1FLVF1924I

Xilinx

FPGA

Industrial

Ball

1924

BGA

Square

Plastic/Epoxy

1451100

Yes

.927 V

5520

832

.9

0.9 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.873 V

1 mm

100 °C (212 °F)

5520 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1924

4

4.13 mm

45 mm

No

Also Operates at 0.95 V nominal supply

e1

30 s

832

245 °C (473 °F)

45 mm

XC7VX980T-1FF1926I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

979200

Yes

CMOS

720

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1924

No

e0

1818 MHz

720

XC6VHX380T-2FFG1924E

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

382464

Yes

CMOS

640

1,1.2/2.5 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

1 mm

Tin/Silver/Copper

Bottom

S-PBGA-B1924

4

No

e1

1286 MHz

30 s

640

245 °C (473 °F)

XC6VHX380T-1FF1924I

Xilinx

FPGA

Industrial

Ball

1924

BGA

Square

Plastic/Epoxy

382464

Yes

1.05 V

CMOS

640

1

1,1.2/2.5 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.95 V

1 mm

100 °C (212 °F)

5.08 ns

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B1924

4

3.85 mm

45 mm

No

e0

1098 MHz

30 s

640

225 °C (437 °F)

45 mm

XC7VX1140T-L2FL1930E

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

1139200

Yes

CMOS

1100

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1924

No

e0

1818 MHz

1100

XC7VX980T-L2FF1930E

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

979200

Yes

CMOS

900

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1924

No

e0

1818 MHz

900

XC7V2000T-L2FL1925E

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

1954560

Yes

1.03 V

CMOS

1200

1

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Tin/Lead

Bottom

S-PBGA-B1924

No

e0

1818 MHz

1200

XC7VX1140T-2FL1926C

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

1139200

Yes

CMOS

720

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1924

No

e0

1818 MHz

720

XC7VX690T-L2FF1927E

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

693120

Yes

CMOS

600

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1924

No

e0

1818 MHz

600

XCKU095-2FLVD1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

1176000

Yes

.979 V

67200

702

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

67200 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

702

45 mm

XCKU025-3FLVF1924C

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

318150

Yes

1.03 V

18180

312

1

Grid Array

BGA1924,44X44,40

.97 V

1 mm

85 °C (185 °F)

18180 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

312

45 mm

XCKU035-1FLVD1924C

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

444343

Yes

.979 V

25391

520

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

85 °C (185 °F)

25391 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

520

45 mm

XCKU035-2FLVD1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

444343

Yes

.979 V

25391

520

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

25391 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

520

45 mm

XCKU085-3FLVF1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

1088325

Yes

1.03 V

62190

676

1

Grid Array

BGA1924,44X44,40

.97 V

1 mm

100 °C (212 °F)

62190 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

676

45 mm

XCKU095-2FLVD1924C

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

1176000

Yes

.979 V

67200

702

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

85 °C (185 °F)

67200 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

702

45 mm

XCKU040-1FLVF1924C

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

530250

Yes

.979 V

30300

520

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

85 °C (185 °F)

30300 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

520

45 mm

XCKU060-2FLVD1924C

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

725550

Yes

.979 V

41460

624

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

85 °C (185 °F)

41460 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

624

45 mm

XCKU035-2FLVD1924E

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

444343

Yes

.979 V

25391

520

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

25391 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

520

45 mm

XCKU035-3FLVF1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

444343

Yes

1.03 V

25391

520

1

Grid Array

BGA1924,44X44,40

.97 V

1 mm

100 °C (212 °F)

25391 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

520

45 mm

XCKU095-1FLVF1924E

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

1176000

Yes

.979 V

67200

702

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

67200 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

702

45 mm

XCKU115-L1FLVD1924C

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

1451100

Yes

.92 V

82920

832

0.9

Grid Array

BGA1924,44X44,40

.88 V

1 mm

85 °C (185 °F)

82920 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

Also Operates at 0.95 V nominal supply

832

45 mm

XCKU060-3FLVF1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

725550

Yes

1.03 V

41460

624

1

Grid Array

BGA1924,44X44,40

.97 V

1 mm

100 °C (212 °F)

41460 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

624

45 mm

XCKU060-L1FLVF1924C

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

725550

Yes

.92 V

41460

624

0.9

Grid Array

BGA1924,44X44,40

.88 V

1 mm

85 °C (185 °F)

41460 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

Also Operates at 0.95 V nominal supply

624

45 mm

XCKU085-L1FLVD1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

1088325

Yes

.92 V

62190

676

0.9

Grid Array

BGA1924,44X44,40

.88 V

1 mm

100 °C (212 °F)

62190 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

Also Operates at 0.95 V nominal supply

676

45 mm

XCKU025-1FLVF1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

318150

Yes

.979 V

18180

312

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

18180 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

312

45 mm

XCKU115-3FLVD1924C

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

1451100

Yes

1.03 V

82920

832

1

Grid Array

BGA1924,44X44,40

.97 V

1 mm

85 °C (185 °F)

82920 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

832

45 mm

XCKU060-3FLVF1924C

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

725550

Yes

1.03 V

41460

624

1

Grid Array

BGA1924,44X44,40

.97 V

1 mm

85 °C (185 °F)

41460 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

624

45 mm

XCKU095-3FLVF1924E

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

1176000

Yes

1.03 V

67200

702

1

Grid Array

BGA1924,44X44,40

.97 V

1 mm

100 °C (212 °F)

67200 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

702

45 mm

XCKU060-2FLVF1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

725550

Yes

.979 V

41460

624

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

41460 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

624

45 mm

XCKU085-1FLVD1924C

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

1088325

Yes

.979 V

62190

676

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

85 °C (185 °F)

62190 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

676

45 mm

XCKU040-2FLVF1924E

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

530250

Yes

.979 V

30300

520

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

30300 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

520

45 mm

XCKU035-3FLVD1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

444343

Yes

1.03 V

25391

520

1

Grid Array

BGA1924,44X44,40

.97 V

1 mm

100 °C (212 °F)

25391 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

520

45 mm

XCKU025-1FLVD1924E

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

318150

Yes

.979 V

18180

312

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

18180 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

312

45 mm

XCKU035-1FLVD1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

444343

Yes

.979 V

25391

520

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

25391 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

520

45 mm

XCKU040-3FLVF1924E

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

530250

Yes

1.03 V

30300

520

1

Grid Array

BGA1924,44X44,40

.97 V

1 mm

100 °C (212 °F)

30300 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

520

45 mm

XCKU040-2FLVF1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

530250

Yes

.979 V

30300

520

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

30300 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

520

45 mm

XCKU025-2FLVD1924E

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

318150

Yes

.979 V

18180

312

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

18180 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

312

45 mm

XCKU025-1FLVF1924E

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

318150

Yes

.979 V

18180

312

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

18180 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

312

45 mm

XCKU040-1FLVF1924E

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

530250

Yes

.979 V

30300

520

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

30300 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

520

45 mm

XCKU115-L1FLVF1924C

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

1451100

Yes

.92 V

82920

832

0.9

Grid Array

BGA1924,44X44,40

.88 V

1 mm

85 °C (185 °F)

82920 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

Also Operates at 0.95 V nominal supply

832

45 mm

XCKU060-L1FLVF1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

725550

Yes

.92 V

41460

624

0.9

Grid Array

BGA1924,44X44,40

.88 V

1 mm

100 °C (212 °F)

41460 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

Also Operates at 0.95 V nominal supply

624

45 mm

XCKU025-2FLVD1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

318150

Yes

.979 V

18180

312

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

18180 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

312

45 mm

XCKU040-L1FLVF1924C

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

530250

Yes

.92 V

30300

520

0.9

Grid Array

BGA1924,44X44,40

.88 V

1 mm

85 °C (185 °F)

30300 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

Also Operates at 0.95 V nominal supply

520

45 mm

XCKU040-1FLVF1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

530250

Yes

.979 V

30300

520

0.95

Grid Array

BGA1924,44X44,40

.922 V

1 mm

100 °C (212 °F)

30300 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

520

45 mm

XCKU025-3FLVD1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

318150

Yes

1.03 V

18180

312

1

Grid Array

BGA1924,44X44,40

.97 V

1 mm

100 °C (212 °F)

18180 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

312

45 mm

XCKU095-L1FLVD1924I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

1176000

Yes

.92 V

67200

702

0.9

Grid Array

BGA1924,44X44,40

.88 V

1 mm

100 °C (212 °F)

67200 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1924

4.13 mm

45 mm

Also Operates at 0.95 V nominal supply

702

45 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.