1924 Field Programmable Gate Arrays (FPGA) 306

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
XCKU025-1FLVD1924C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	85 °C (185 °F)	18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm					312	45 mm
XCKU025-L1FLVF1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312	0.9		Grid Array	BGA1924,44X44,40		.88 V	1 mm	100 °C (212 °F)	18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm		Also Operates at 0.95 V nominal supply			312	45 mm
XCKU035-1FLVF1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)	25391 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm					520	45 mm
XCKU040-2FLVF1924C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	85 °C (185 °F)	30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm					520	45 mm
XCKU060-2FLVD1924E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)	41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm					624	45 mm
XCKU040-3FLVF1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300		520	1		Grid Array	BGA1924,44X44,40		.97 V	1 mm	100 °C (212 °F)	30300 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm					520	45 mm
XCKU085-1FLVF1924E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)	62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm					676	45 mm
XCKU040-L1FLVF1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	530250	Yes	.92 V	30300		520	0.9		Grid Array	BGA1924,44X44,40		.88 V	1 mm	100 °C (212 °F)	30300 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm		Also Operates at 0.95 V nominal supply			520	45 mm
XCKU060-L1FLVF1924E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624	0.9		Grid Array	BGA1924,44X44,40		.88 V	1 mm	100 °C (212 °F)	41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm		Also Operates at 0.95 V nominal supply			624	45 mm
XCKU035-3FLVF1924C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520	1		Grid Array	BGA1924,44X44,40		.97 V	1 mm	85 °C (185 °F)	25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm					520	45 mm
XCKU025-2FLVF1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)	18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm					312	45 mm
XCKU060-3FLVF1924E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460		624	1		Grid Array	BGA1924,44X44,40		.97 V	1 mm	100 °C (212 °F)	41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm					624	45 mm
XCKU035-L1FLVD1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391		520	0.9		Grid Array	BGA1924,44X44,40		.88 V	1 mm	100 °C (212 °F)	25391 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm		Also Operates at 0.95 V nominal supply			520	45 mm
XCKU035-L1FLVD1924C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391		520	0.9		Grid Array	BGA1924,44X44,40		.88 V	1 mm	85 °C (185 °F)	25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm		Also Operates at 0.95 V nominal supply			520	45 mm
XCKU095-2FLVF1924I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)	67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm					702	45 mm
XCKU035-L1FLVF1924E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391		520	0.9		Grid Array	BGA1924,44X44,40		.88 V	1 mm	100 °C (212 °F)	25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924	4.13 mm	45 mm		Also Operates at 0.95 V nominal supply			520	45 mm
XCVU11P-L2FLGF1924E	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	2835000	Yes	.742 V	162000		624	0.72		Grid Array	BGA1924,44X44,40		.698 V	1 mm	110 °C (230 °F)	162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924	4.24 mm	45 mm		Also Operates at 0.85 V nominal supply			624	45 mm
XC7VX485T-3FF1930E	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS	700	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1924			No		e0	1818 MHz	700

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.