208 Field Programmable Gate Arrays (FPGA) 1,233

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP2C5Q208C8N	Intel	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	4608	Yes	1.25 V	288	CMOS	142		1.2		1.2,1.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		288 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Also requires 3.3 V supply	e3	402.5 MHz		134		28 mm
A3P250-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
M1A3P250-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s		245 °C (473 °F)	28 mm
EP2C8Q208C8N	Intel	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	138		1.2		1.2,1.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		516 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Also requires 3.3 V supply	e3	402.5 MHz		130		28 mm
A3P1000-PQG208M	Microchip Technology	FPGA	Military	Gull Wing	208	FQFP	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	154	1000000	1.5	Tray	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	154	245 °C (473 °F)	28 mm
M1A3P1000-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
M1A3P1000-PQG208M	Microchip Technology	FPGA	Military	Gull Wing	208	FQFP	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	154	1000000	1.5	Tray	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	154	245 °C (473 °F)	28 mm
A3P1000-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
M7A3P1000-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	154	1000000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G208	3	4.1 mm	28 mm	No			350 MHz	30 s	154	245 °C (473 °F)	28 mm
M1A3P250-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
A3P1000-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
A3PE1500-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS	147	1500000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s	147	245 °C (473 °F)	28 mm
A3P250-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
XC3S400-4PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	141	400000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.61 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	630 MHz	30 s	141	245 °C (473 °F)	28 mm
A3P600-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		600000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
LFXP2-8E-5QN208C	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	146		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	435 MHz	40 s	146	245 °C (473 °F)	28 mm
LFXP2-5E-5QN208C	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	146		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	435 MHz	40 s	146	245 °C (473 °F)	28 mm
M1A3P1000-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
EP2C8Q208I8N	Intel	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	138		1.2		1.2,1.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm			516 CLBS		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Also requires 3.3 V supply	e3	402.5 MHz		130		28 mm
EP2C5Q208I8N	Intel	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	4608	Yes	1.25 V	288	CMOS	142		1.2		1.2,1.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm			288 CLBS		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Also requires 3.3 V supply	e3	402.5 MHz		134		28 mm
A3P600-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		600000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
LFEC6E-3QN208C	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	6100	Yes	1.26 V	768		147		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.56 ns	768 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	420 MHz	40 s	147	245 °C (473 °F)	28 mm
M1A3PE1500-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS	147	1500000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	147	245 °C (473 °F)	28 mm
M1A3P600-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS	154	600000	1.5			Flatpack, Fine Pitch	QFP208,1.2SQ,20		1.425 V	.5 mm	100 °C (212 °F)		600000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s	154	245 °C (473 °F)	28 mm
A3P400-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	9216	CMOS		400000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		9216 CLBS, 400000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
XC3S400-4PQG208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	141	400000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm		0.61 ns	896 CLBS, 400000 Gates		Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	630 MHz	30 s	141	245 °C (473 °F)	28 mm
M7A3P1000-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	154	1000000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	70 °C (158 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	154	245 °C (473 °F)	28 mm
A3PE600-PQ208I	Microsemi	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	13824	Yes	1.575 V	13824	CMOS	147	600000	1.5		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	350 MHz		147		28 mm
M7A3PE600-PQ208I	Microchip Technology	FPGA		Gull Wing	208	QFP	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS	147		1.5		1.5/3.3 V	Flatpack	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQFP-G208				No					147
XC3S500E-4PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	158	500000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz	30 s	126	245 °C (473 °F)	28 mm
APA1000-PQG208M	Microchip Technology	FPGA	Military	Gull Wing	208	FQFP	Square	Plastic/Epoxy	56320	Yes	2.7 V		CMOS	158	1000000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		1000000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
APA600-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS	158	600000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		600000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
A3P125-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS		125000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
XC3S500E-4PQG208CS1	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	158	500000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz	30 s	126	245 °C (473 °F)	28 mm
XC2S50-5PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1728	Yes	2.625 V	384		176	50000	2.5		1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	384 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 50000	e3	263 MHz	30 s	176	245 °C (473 °F)	28 mm
XC3S200-4PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480	CMOS	141	200000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.61 ns	480 CLBS, 200000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	630 MHz	30 s	141	245 °C (473 °F)	28 mm
M1A3P400-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	9216	CMOS		400000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		9216 CLBS, 400000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s		245 °C (473 °F)	28 mm
LFXP2-17E-5QN208I	Lattice Semiconductor	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	17000	Yes	1.26 V	2125	CMOS	146		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	435 MHz	40 s	146	245 °C (473 °F)	28 mm
A54SX32A-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	2880	Yes	2.75 V	2880	CMOS	174	48000	2.5		2.5,3.3/5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	85 °C (185 °F)	1.2 ns	2880 CLBS, 48000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	32000 typical gates available	e3	238 MHz	30 s	174	245 °C (473 °F)	28 mm
A54SX32APQG208I	Microsemi	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	2880	Yes	2.75 V	2880	CMOS	174	48000	2.5		2.5,3.3/5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	85 °C (185 °F)	1.2 ns	2880 CLBS, 48000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	32000 typical gates available	e3	238 MHz	30 s	174	245 °C (473 °F)	28 mm
APA1000-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	56320	Yes	2.7 V		CMOS	158	1000000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		1000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
M1A3PE3000-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	147	3000000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	147	245 °C (473 °F)	28 mm
A3P1000-1PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
APA150-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	6144	Yes	2.7 V		CMOS	158	150000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		150000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
A3P400-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	9216	CMOS		400000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		9216 CLBS, 400000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
APA600-PQG208M	Microchip Technology	FPGA	Military	Gull Wing	208	FQFP	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS	158	600000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		600000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
A3P125-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS		125000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
AX500-PQ208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8064	Yes	1.575 V	5376	CMOS	336	286000	1.5		1.5,1.5/3.3,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)	0.99 ns	5376 CLBS, 286000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	500000 system gates avaiable	e0	649 MHz		336		28 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.