Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10476 |
Yes |
1.26 V |
1164 |
CMOS |
158 |
500000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.66 ns |
1164 CLBS, 500000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e4 |
657 MHz |
126 |
28 mm |
|||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e4 |
28 mm |
||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
320 |
CMOS |
5000 |
5 |
Flatpack, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
5.5 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Quad |
S-PQFP-G208 |
3.92 mm |
28 mm |
No |
928 flip-flops; typical gates = 5000-6000 |
125 MHz |
28 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
AEC-Q100 |
158 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
4.88 ns |
612 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
572 MHz |
30 s |
126 |
245 °C (473 °F) |
28 mm |
||||
|
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
2700 |
Yes |
1.89 V |
600 |
CMOS |
202 |
37000 |
1.8 |
1.2/3.6,1.8 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
0.47 ns |
600 CLBS, 37000 Gates |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Maximum usable gates = 100000 |
e3 |
357 MHz |
30 s |
202 |
245 °C (473 °F) |
28 mm |
|||||||
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
7448 |
Yes |
3.6 V |
3136 |
CMOS |
160 |
55000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1 ns |
3136 CLBS, 55000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Can also use 180000 gates |
e0 |
263 MHz |
30 s |
160 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
224 |
13000 |
3.3 |
3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.1 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Can also use 40000 gates |
e0 |
227 MHz |
30 s |
224 |
225 °C (437 °F) |
28 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
784 |
CMOS |
16000 |
5 |
Flatpack, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
6 ns |
784 CLBS, 16000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
3.92 mm |
28 mm |
No |
2016 flip-flops; typical gates = 16000-20000 |
e3 |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
576 |
CMOS |
10000 |
3.3 |
Flatpack, Fine Pitch |
3 V |
.5 mm |
1 ns |
576 CLBS, 10000 Gates |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
263 MHz |
28 mm |
||||||||||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
208 |
HLFQFP |
Square |
Plastic/Epoxy |
1024 |
Yes |
CMOS |
256 |
5 |
5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
.5 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
No |
e0 |
30 s |
256 |
225 °C (437 °F) |
||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
196 |
Yes |
5.25 V |
196 |
CMOS |
112 |
4000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
4.5 ns |
196 CLBS, 4000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
3.92 mm |
28 mm |
No |
616 flip-flops; typical gates = 4000-5000 |
e0 |
133.3 MHz |
30 s |
112 |
225 °C (437 °F) |
28 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1296 |
CMOS |
22000 |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
0.9 ns |
1296 CLBS, 22000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Can also use 65000 gates |
e3 |
294 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
238 |
Yes |
5.5 V |
100 |
CMOS |
160 |
2500 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
85 °C (185 °F) |
6 ns |
100 CLBS, 2500 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
3.92 mm |
28 mm |
No |
200 flip-flops; typical gates = 2500-3000 |
e0 |
90.9 MHz |
30 s |
160 |
225 °C (437 °F) |
28 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1936 |
CMOS |
33000 |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
3 V |
.5 mm |
1.1 ns |
1936 CLBS, 33000 Gates |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Can also use 100000 gates |
e3 |
227 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
400 |
Yes |
5.5 V |
400 |
CMOS |
160 |
8000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
85 °C (185 °F) |
4.5 ns |
400 CLBS, 8000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
3.92 mm |
28 mm |
No |
1120 flip-flops; typical gates = 8000-10000 |
e0 |
133.3 MHz |
30 s |
160 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
484 |
CMOS |
15000 |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
484 CLBS, 15000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Typical gates = 15000-23000 |
e0 |
28 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1368 |
Yes |
3.6 V |
576 |
CMOS |
169 |
10000 |
3.3 |
3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.1 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Maximum usable gates 30000 |
e3 |
217 MHz |
30 s |
169 |
245 °C (473 °F) |
28 mm |
||||
|
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
320 |
CMOS |
5000 |
5 |
Flatpack, Fine Pitch |
4.5 V |
.5 mm |
2.2 ns |
320 CLBS, 5000 Gates |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Max usable 6000 Logic gates |
e3 |
323 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||||||
Xilinx |
FPGA |
Gull Wing |
208 |
HLFQFP |
Square |
Plastic/Epoxy |
1024 |
Yes |
3.47 V |
1024 |
CMOS |
256 |
3.3 |
2.5,3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3.14 V |
.5 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
28 mm |
No |
e0 |
30 s |
256 |
225 °C (437 °F) |
28 mm |
||||||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
158 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.76 ns |
612 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
572 MHz |
30 s |
126 |
245 °C (473 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
224 |
13000 |
3.3 |
3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Typical gates = 13000-40000 |
e0 |
217 MHz |
30 s |
224 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
205 |
13000 |
3.3 |
3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Maximum usable gates 40000 |
e0 |
250 MHz |
30 s |
205 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
5.5 V |
196 |
CMOS |
148 |
6000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
3.8 ns |
196 CLBS, 6000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Typical gates = 6000-10000 |
e0 |
83 MHz |
30 s |
148 |
225 °C (437 °F) |
28 mm |
||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
3000 |
3.3 |
Flatpack, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
Max usable 5000 Logic gates |
e3 |
217 MHz |
28 mm |
||||||||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
2700 |
Yes |
2.625 V |
600 |
144 |
100000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
0.7 ns |
600 CLBS, 100000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
263 MHz |
30 s |
140 |
245 °C (473 °F) |
28 mm |
||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
576 |
CMOS |
10000 |
3.3 |
Flatpack, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.6 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Max usable 13000 Logic gates |
e3 |
166 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
28 mm |
|||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
28 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
1296 |
Yes |
3.6 V |
1296 |
CMOS |
288 |
22000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1 ns |
1296 CLBS, 22000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Can also use 65000 gates |
e0 |
263 MHz |
30 s |
288 |
225 °C (437 °F) |
28 mm |
||||||||
Xilinx |
FPGA |
Commercial Extended |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.89 V |
384 |
CMOS |
182 |
23000 |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.47 ns |
384 CLBS, 23000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Maximum usable gates = 50000 |
e0 |
357 MHz |
30 s |
182 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
224 |
13000 |
3.3 |
3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.1 ns |
784 CLBS, 13000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Can also use 40000 gates |
e0 |
227 MHz |
30 s |
224 |
225 °C (437 °F) |
28 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1936 |
CMOS |
33000 |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1 ns |
1936 CLBS, 33000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Can also use 100000 gates |
e3 |
263 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
324 |
CMOS |
6000 |
5 |
Flatpack, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.6 ns |
324 CLBS, 6000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Max usable 8000 Logic gates |
e3 |
125 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
256 |
Yes |
5.5 V |
256 |
CMOS |
128 |
4000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
2 ns |
256 CLBS, 4000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Max usable 6000 Logic gates |
e0 |
125 MHz |
30 s |
128 |
225 °C (437 °F) |
28 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
3136 |
CMOS |
55000 |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
3 V |
.5 mm |
1.1 ns |
3136 CLBS, 55000 Gates |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
227 MHz |
28 mm |
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|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10476 |
Yes |
1.26 V |
1164 |
CMOS |
158 |
500000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.66 ns |
1164 CLBS, 500000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
657 MHz |
30 s |
126 |
245 °C (473 °F) |
28 mm |
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Xilinx |
FPGA |
Other |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
5.25 V |
784 |
CMOS |
224 |
13000 |
5 |
5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.3 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Max usable 20000 Logic gates |
e0 |
166 MHz |
30 s |
224 |
225 °C (437 °F) |
28 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1024 |
CMOS |
18000 |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
3 V |
.5 mm |
1.3 ns |
1024 CLBS, 18000 Gates |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Max usable 28000 Logic gates |
e3 |
200 MHz |
30 s |
245 °C (473 °F) |
28 mm |
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Xilinx |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Metal |
770 |
Yes |
5.5 V |
324 |
CMOS |
144 |
6500 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
85 °C (185 °F) |
6 ns |
324 CLBS, 6500 Gates |
-40 °C (-40 °F) |
Quad |
S-MQFP-G208 |
1 |
3.68 mm |
27.64 mm |
No |
936 flip-flops; typical gates = 6500-8000 |
90.9 MHz |
144 |
27.64 mm |
|||||||||
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
28 mm |
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Xilinx |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
196 |
Yes |
5.5 V |
196 |
CMOS |
112 |
4000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
85 °C (185 °F) |
6 ns |
196 CLBS, 4000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
3.92 mm |
28 mm |
No |
616 flip-flops; typical gates = 4000-5000 |
e0 |
90.9 MHz |
30 s |
112 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
3.3 |
Flatpack, Fine Pitch |
.5 mm |
Tin Lead |
Quad |
S-PQFP-G208 |
3.92 mm |
28 mm |
No |
e0 |
28 mm |
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Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
400 |
7000 |
3.3 |
Flatpack, Fine Pitch |
3 V |
.5 mm |
400 CLBS, 7000 Gates |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
28 mm |
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|
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Fine Pitch |
1.14 V |
.5 mm |
192 CLBS, 50000 Gates |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
|||||||||||||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.5 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
85 °C (185 °F) |
7 ns |
320 CLBS, 5000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
3.92 mm |
28 mm |
No |
928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA |
e0 |
100 MHz |
30 s |
144 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
256 |
Yes |
5.25 V |
256 |
CMOS |
128 |
4000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
2 ns |
256 CLBS, 4000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Max usable 6000 Logic gates |
e0 |
125 MHz |
30 s |
128 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.25 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
3.3 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Max usable 6000 Logic gates |
e0 |
227 MHz |
30 s |
144 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
484 |
Yes |
5.5 V |
484 |
CMOS |
176 |
6500 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
2.7 ns |
484 CLBS, 6500 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Max usable 7500 Logic gates |
e0 |
270 MHz |
30 s |
176 |
225 °C (437 °F) |
28 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.