Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
FPGA |
Military |
Flat |
208 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
6036 |
Yes |
2.75 V |
6036 |
CMOS |
MIL-STD-883 Class B |
171 |
108000 |
2.5 |
2.5,3.3/5 V |
Flatpack |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.25 V |
.5 mm |
125 °C (257 °F) |
1.5 ns |
6036 CLBS, 108000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F208 |
3.3 mm |
29.21 mm |
No |
72000 typical gates available |
e0 |
217 MHz |
171 |
29.21 mm |
|||||||
Microsemi |
FPGA |
Military |
Flat |
208 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
6036 |
Yes |
2.75 V |
6036 |
CMOS |
MIL-STD-883 Class B |
171 |
108000 |
2.5 |
2.5,3.3/5 V |
Flatpack |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.25 V |
.5 mm |
125 °C (257 °F) |
1.5 ns |
6036 CLBS, 108000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F208 |
3.3 mm |
29.21 mm |
No |
72000 typical gates available |
e0 |
217 MHz |
171 |
29.21 mm |
|||||||
Microchip Technology |
FPGA |
Military |
Flat |
208 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
4224 |
Yes |
1.575 V |
2816 |
CMOS |
MIL-STD-883 Class B |
248 |
250000 |
1.5 |
1.5,1.5/3.3,2.5/3.3 V |
Flatpack, Guard Ring |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
125 °C (257 °F) |
0.84 ns |
2816 CLBS, 250000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F208 |
3.3 mm |
29.21 mm |
No |
250000 system gates avaiable |
e0 |
763 MHz |
248 |
29.21 mm |
|||||||
Microchip Technology |
FPGA |
Military |
Flat |
208 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
8064 |
Yes |
1.575 V |
5376 |
CMOS |
MIL-STD-883 Class B |
336 |
500000 |
1.5 |
1.5,1.5/3.3,2.5/3.3 V |
Flatpack, Guard Ring |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
125 °C (257 °F) |
0.84 ns |
5376 CLBS, 500000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F208 |
3.3 mm |
29.21 mm |
No |
500000 system gates avaiable |
e0 |
763 MHz |
336 |
29.21 mm |
|||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12000 |
Yes |
1.26 V |
1500 |
131 |
1.2 |
1.2 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.358 ns |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
311 MHz |
40 s |
131 |
245 °C (473 °F) |
28 mm |
||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
6100 |
Yes |
1.26 V |
768 |
147 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.56 ns |
768 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
420 MHz |
40 s |
147 |
245 °C (473 °F) |
28 mm |
|||||||
Xilinx |
FPGA |
Commercial Extended |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
6912 |
Yes |
1.89 V |
1536 |
CMOS |
329 |
93000 |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.47 ns |
1536 CLBS, 93000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Maximum usable gates = 300000 |
e0 |
357 MHz |
30 s |
329 |
225 °C (437 °F) |
28 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
2.625 V |
384 |
144 |
50000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
0.7 ns |
384 CLBS, 50000 Gates |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e4 |
263 MHz |
140 |
28 mm |
|||||||||
|
Microsemi |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
154 |
1000000 |
1.2 |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
70 °C (158 °F) |
24576 CLBS, 1000000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
154 |
28 mm |
||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
75264 |
Yes |
1.575 V |
75264 |
CMOS |
147 |
3000000 |
1.5 |
Tray |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 °C (185 °F) |
75264 CLBS, 3000000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
30 s |
147 |
245 °C (473 °F) |
28 mm |
||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
75264 |
Yes |
1.575 V |
75264 |
CMOS |
147 |
3000000 |
1.5 |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
70 °C (158 °F) |
75264 CLBS, 3000000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
147 |
245 °C (473 °F) |
28 mm |
||||||
|
Microsemi |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
13824 |
Yes |
1.575 V |
13824 |
CMOS |
147 |
600000 |
1.5 |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 °C (185 °F) |
13824 CLBS, 600000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
147 |
28 mm |
||||||||
Microchip Technology |
FPGA |
Military |
Flat |
208 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
2880 |
Yes |
2.75 V |
2880 |
CMOS |
174 |
48000 |
2.5 |
2.5,3.3/5 V |
Flatpack |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.25 V |
.5 mm |
125 °C (257 °F) |
1.1 ns |
2880 CLBS, 48000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F208 |
3.3 mm |
29.21 mm |
No |
32000 typical gates available |
e0 |
278 MHz |
174 |
29.21 mm |
||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12288 |
Yes |
2.7 V |
CMOS |
158 |
450000 |
2.5 |
Tray |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.3 V |
.5 mm |
85 °C (185 °F) |
450000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
180 MHz |
30 s |
158 |
245 °C (473 °F) |
28 mm |
||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
6100 |
Yes |
1.26 V |
768 |
147 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.48 ns |
768 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
420 MHz |
40 s |
147 |
245 °C (473 °F) |
28 mm |
|||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
17000 |
Yes |
1.26 V |
2125 |
CMOS |
146 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.399 ns |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
435 MHz |
40 s |
146 |
245 °C (473 °F) |
28 mm |
||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
5000 |
Yes |
1.26 V |
625 |
CMOS |
146 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.399 ns |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
435 MHz |
40 s |
146 |
245 °C (473 °F) |
28 mm |
|||||||
|
Microchip Technology |
FPGA |
Gull Wing |
208 |
QFP |
Square |
Plastic/Epoxy |
9216 |
Yes |
1.575 V |
CMOS |
151 |
1.5 |
1.8/2.5/3.3 V |
Flatpack |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-PQFP-G208 |
3 |
No |
350 MHz |
30 s |
151 |
245 °C (473 °F) |
|||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
5292 |
Yes |
2.625 V |
1176 |
144 |
200000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.6 ns |
1176 CLBS, 200000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Maximum usable gates 200000 |
e4 |
263 MHz |
140 |
28 mm |
|||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
158 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.76 ns |
612 CLBS, 250000 Gates |
0 °C (32 °F) |
Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
572 MHz |
30 s |
126 |
245 °C (473 °F) |
28 mm |
|||||
|
Microsemi |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
154 |
1000000 |
1.2 |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
24576 CLBS, 1000000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
154 |
28 mm |
||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
3072 |
CMOS |
125000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
3072 CLBS, 125000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
Microsemi |
FPGA |
Military |
Flat |
208 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
1452 |
Yes |
3.63 V |
1452 |
CMOS |
MIL-STD-883 Class B |
172 |
16000 |
3.3 |
3.3,5 V |
Flatpack |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.97 V |
.5 mm |
125 °C (257 °F) |
0.9 ns |
1452 CLBS, 16000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F208 |
3.06 mm |
29.21 mm |
No |
24000 system gates avaiable |
e0 |
240 MHz |
172 |
29.21 mm |
|||||||
Microchip Technology |
FPGA |
Military |
Flat |
208 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
21504 |
Yes |
2.7 V |
CMOS |
MIL-STD-883 Class B |
158 |
600000 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Guard Ring |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.3 V |
.5 mm |
125 °C (257 °F) |
600000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F208 |
3.3 mm |
29.21 mm |
No |
e0 |
180 MHz |
158 |
29.21 mm |
||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12000 |
Yes |
1.26 V |
1500 |
131 |
1.2 |
1.2 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.331 ns |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
357 MHz |
40 s |
131 |
245 °C (473 °F) |
28 mm |
||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
5000 |
Yes |
1.26 V |
625 |
CMOS |
146 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.494 ns |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
435 MHz |
40 s |
146 |
245 °C (473 °F) |
28 mm |
||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
5000 |
Yes |
1.26 V |
625 |
CMOS |
146 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.399 ns |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
435 MHz |
40 s |
146 |
245 °C (473 °F) |
28 mm |
||||||||
Microsemi |
FPGA |
Military |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
154 |
1000000 |
1.5 |
1.5,1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
125 °C (257 °F) |
24576 CLBS, 1000000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
350 MHz |
20 s |
154 |
225 °C (437 °F) |
28 mm |
|||||||
Microsemi |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
154 |
1000000 |
1.2 |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
70 °C (158 °F) |
24576 CLBS, 1000000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
350 MHz |
154 |
28 mm |
|||||||||
|
Microsemi |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
154 |
1000000 |
1.2 |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
70 °C (158 °F) |
24576 CLBS, 1000000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
154 |
28 mm |
||||||||
|
Microsemi |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
154 |
1000000 |
1.2 |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
24576 CLBS, 1000000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
154 |
28 mm |
||||||||
|
Microsemi |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
154 |
1000000 |
1.2 |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
24576 CLBS, 1000000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
154 |
28 mm |
||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
38400 |
Yes |
1.575 V |
38400 |
CMOS |
147 |
1500000 |
1.5 |
Tray |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
70 °C (158 °F) |
38400 CLBS, 1500000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
147 |
245 °C (473 °F) |
28 mm |
|||||
Microsemi |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
75264 |
Yes |
1.575 V |
75264 |
CMOS |
147 |
3000000 |
1.5 |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 °C (185 °F) |
75264 CLBS, 3000000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
350 MHz |
147 |
28 mm |
|||||||||
Microsemi |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
24576 |
CMOS |
1000000 |
1.5 |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
70 °C (158 °F) |
24576 CLBS, 1000000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
350 MHz |
28 mm |
|||||||||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
2700 |
Yes |
2.625 V |
600 |
144 |
100000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
0.7 ns |
600 CLBS, 100000 Gates |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e4 |
263 MHz |
140 |
28 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
205 |
13000 |
3.3 |
3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.1 ns |
784 CLBS, 13000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Maximum usable gates 40000 |
e0 |
217 MHz |
30 s |
205 |
225 °C (437 °F) |
28 mm |
||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
8000 |
Yes |
1.26 V |
1000 |
CMOS |
146 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.494 ns |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
435 MHz |
40 s |
146 |
245 °C (473 °F) |
28 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
2700 |
Yes |
2.625 V |
600 |
144 |
100000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.6 ns |
600 CLBS, 100000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
263 MHz |
30 s |
140 |
245 °C (473 °F) |
28 mm |
||||||
|
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
4320 |
Yes |
1.26 V |
480 |
CMOS |
141 |
200000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
0.61 ns |
480 CLBS, 200000 Gates |
Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
630 MHz |
30 s |
141 |
245 °C (473 °F) |
28 mm |
||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
8192 |
Yes |
2.7 V |
CMOS |
158 |
300000 |
2.5 |
Tray |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.3 V |
.5 mm |
85 °C (185 °F) |
300000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
180 MHz |
30 s |
158 |
245 °C (473 °F) |
28 mm |
||||||
Intel |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
4608 |
Yes |
1.25 V |
288 |
CMOS |
142 |
1.2 |
1.2,1.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
288 CLBS |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Also requires 3.3 V supply |
e0 |
402.5 MHz |
134 |
28 mm |
|||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
2700 |
Yes |
2.625 V |
600 |
144 |
100000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.7 ns |
600 CLBS, 100000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
263 MHz |
30 s |
140 |
245 °C (473 °F) |
28 mm |
||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
158 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.76 ns |
612 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
572 MHz |
126 |
28 mm |
|||||||
|
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
5292 |
Yes |
1.89 V |
1176 |
CMOS |
289 |
71000 |
1.8 |
1.2/3.6,1.8 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
0.47 ns |
1176 CLBS, 71000 Gates |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Maximum usable gates = 200000 |
e3 |
357 MHz |
30 s |
289 |
245 °C (473 °F) |
28 mm |
|||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
158 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.66 ns |
612 CLBS, 250000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
657 MHz |
126 |
28 mm |
|||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
17000 |
Yes |
1.26 V |
2125 |
CMOS |
146 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.399 ns |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
435 MHz |
40 s |
146 |
245 °C (473 °F) |
28 mm |
|||||||
|
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
3888 |
Yes |
2.625 V |
864 |
144 |
150000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
0.7 ns |
864 CLBS, 150000 Gates |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e4 |
263 MHz |
140 |
28 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.