208 Field Programmable Gate Arrays (FPGA) 1,233

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
M1AFS250-1PQ208I	Microchip Technology	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS		93	250000	1.5			Flatpack, Fine Pitch	QFP208,1.2SQ,20		1.425 V	.5 mm	100 °C (212 °F)		250000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G208		4.1 mm	28 mm						93		28 mm
M7A3P1000-PQ208I	Microsemi	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5			Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G208		4.1 mm	28 mm	No			350 MHz				28 mm
XC2S200-5PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			144	200000	2.5		1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	263 MHz	30 s	140	245 °C (473 °F)	28 mm
A3PE1500-2PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS		147	1500000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	147	245 °C (473 °F)	28 mm
XC3S250E-4PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		158	250000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz	30 s	126	245 °C (473 °F)	28 mm
A3P250-2PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
A54SX16PPQ208I	Microsemi	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	1452	CMOS			16000	3.3			Flatpack, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	0.9 ns	1452 CLBS, 16000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also be operated at 5 V; 24000 system gates also available	e0	240 MHz	20 s		225 °C (437 °F)	28 mm
A54SX16-PPQ208I	Actel	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1452	Yes	3.6 V	1452	CMOS		175	16000	3.3		3.3,3.3/5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	0.9 ns	1452 CLBS, 16000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also be operated at 5 V; 24000 system gates also available	e0	240 MHz		175		28 mm
M1AFS250-1PQG208I	Microsemi	FPGA	Industrial	Flat	208	QFF	Rectangular	Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5			Flatpack			1.425 V	.5 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-F208	3	4.1 mm	28 mm	No		e3					30.6 mm
XC2S200-6PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			284	200000	2.5		1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.6 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 200000	e3	263 MHz	30 s	284	245 °C (473 °F)	28 mm
A3P1000-2PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
APA1000-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	56320	Yes	2.7 V		CMOS		158	1000000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	70 °C (158 °F)		1000000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
APA1000-PQG208A	Microchip Technology	FPGA		Gull Wing	208	QFP	Square	Plastic/Epoxy	56320	Yes			CMOS		158			Tray	2.5,2.5/3.3 V	Flatpack	QFP208,1.2SQ,20	Field Programmable Gate Arrays		.5 mm						Quad	S-PQFP-G208	3			No				30 s	158	245 °C (473 °F)
M1A3P400-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	9216	CMOS			400000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		9216 CLBS, 400000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
5962-0151801QYC	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	2.75 V		CMOS	MIL-PRF-38535 Class Q		32000	2.5			Flatpack, Guard Ring			2.25 V	.5 mm	125 °C (257 °F)		32000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F208		3.22 mm	29.21 mm	No	2.5 V, 3.3 V, and 5.0 V mixed voltage operation	e4					29.21 mm
A42MX36-1CQ208	Microchip Technology	FPGA	Commercial	Flat	208	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2438	CMOS			54000	3.3			Flatpack, Guard Ring			3 V	.5 mm	70 °C (158 °F)	2.3 ns	2438 CLBS, 54000 Gates	0 °C (32 °F)		Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	Also Operates at 5 V supply		83 MHz				29.21 mm
A42MX36-CQ208	Microchip Technology	FPGA	Commercial	Flat	208	GQFF	Square	Ceramic, Metal-Sealed Cofired	2414	Yes	3.6 V	2438	CMOS			54000	3.3			Flatpack, Guard Ring			3 V	.5 mm	70 °C (158 °F)	2.7 ns	2438 CLBS, 54000 Gates	0 °C (32 °F)		Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	Also Operates at 5 V supply		73 MHz				29.21 mm
A54SX32-CQ208	Microchip Technology	FPGA	Commercial	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS		246	32000	3.3		3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	70 °C (158 °F)	1 ns	2880 CLBS, 32000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	205 MHz		246		29.21 mm
A54SX32-CQ208B	Microchip Technology	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3		3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	205 MHz		246		29.21 mm
A54SX32ACQ208	Microsemi	FPGA	Commercial	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	70 °C (158 °F)	1.2 ns	2880 CLBS, 48000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32A-CQ208	Microchip Technology	FPGA	Commercial	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	70 °C (158 °F)	1.2 ns	2880 CLBS, 48000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32CQ208	Actel	FPGA	Commercial	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS		246	32000	3.3		3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	70 °C (158 °F)	1 ns	2880 CLBS, 32000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	205 MHz		246	225 °C (437 °F)	29.21 mm
A54SX32CQ208B	Actel	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3		3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	205 MHz		246	225 °C (437 °F)	29.21 mm
A54SX72A-CQ208M	Microchip Technology	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS		171	108000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	72000 typical gates available	e0	217 MHz		171		29.21 mm
A54SX72ACQ208M	Microsemi	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS		171	108000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	72000 typical gates available	e0	217 MHz		171		29.21 mm
APA1000-CQ208B	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square	Ceramic, Metal-Sealed Cofired	56320	Yes	2.7 V		CMOS	MIL-STD-883 Class B	158	1000000	2.5		2.5,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		1000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No		e0	180 MHz		158		29.21 mm
APA1000-CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square	Ceramic, Metal-Sealed Cofired	56320	Yes	2.7 V		CMOS	MIL-STD-883 Class B	158	1000000	2.5		2.5,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		1000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No		e0	180 MHz		158		29.21 mm
APA600-CQ208B	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square	Ceramic, Metal-Sealed Cofired	21504	Yes	2.7 V		CMOS	MIL-STD-883 Class B	158	600000	2.5		2.5,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		600000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No		e0	180 MHz		158		29.21 mm
LFE2-20E-6QN208C	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	20000	Yes	1.26 V	2625			131		1.2		1.2 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.331 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	357 MHz	40 s	131	245 °C (473 °F)	28 mm
M1A3P1000L-1PQ208I	Microsemi	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		154	1000000	1.2		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	350 MHz		154		28 mm
XC2S150-5PQG208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	3888	Yes	2.625 V	864			260	150000	2.5		1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	864 CLBS, 150000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	263 MHz	30 s	260	245 °C (473 °F)	28 mm
A3PE3000L-1PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		147	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	250 MHz	30 s	147	245 °C (473 °F)	28 mm
LFXP2-17E-5QN208C	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	17000	Yes	1.26 V	2125	CMOS		146		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	435 MHz	40 s	146	245 °C (473 °F)	28 mm
LFXP2-17E-5QN208C8W	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	17000	Yes	1.26 V		CMOS		146		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	311 MHz		146	245 °C (473 °F)	28 mm
M1A3PE3000-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		147	3000000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	147	245 °C (473 °F)	28 mm
XC3S400-4PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		141	400000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.61 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	630 MHz		141		28 mm
XC3S400-4PQ208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		141	400000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm		0.61 ns	896 CLBS, 400000 Gates		Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	630 MHz		141		28 mm
XC3S500E-4PQG208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS		158	500000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz	30 s	126	245 °C (473 °F)	28 mm
XC3S500E-4PQG208IS1	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS		158	500000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz	30 s	126	245 °C (473 °F)	28 mm
5962-0151802QYC	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	2.75 V		CMOS	MIL-PRF-38535 Class Q		32000	2.5			Flatpack, Guard Ring			2.25 V	.5 mm	125 °C (257 °F)		32000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F208		3.22 mm	29.21 mm	No	2.5 V, 3.3 V, and 5.0 V mixed voltage operation	e4					29.21 mm
A3P400-2PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	9216	CMOS			400000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		9216 CLBS, 400000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
A3PE3000-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		147	3000000	1.5		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s	147	245 °C (473 °F)	28 mm
A42MX36-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square	Ceramic, Metal-Sealed Cofired	2414	Yes	3.6 V	2438	CMOS			54000	3.3			Flatpack, Guard Ring			3 V	.5 mm	125 °C (257 °F)	2.3 ns	2438 CLBS, 54000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	Also Operates at 5 V supply	e0	83 MHz				29.21 mm
A54SX32-1CQ208B	Microchip Technology	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3		3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	0.9 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	240 MHz		246		29.21 mm
A54SX32A-CQ208B	Microchip Technology	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	174	48000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32A-CQ208M	Microchip Technology	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin/Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz	20 s	174	225 °C (437 °F)	29.21 mm
A54SX32ACQ208B	Microsemi	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	174	48000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32ACQ208M	Microsemi	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin/Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz	20 s	174	225 °C (437 °F)	29.21 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.