325 Field Programmable Gate Arrays (FPGA) 172

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A35T-1CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600			250	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A35T-2CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600			250	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A15T-2CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300			250	1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A15T-2CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300			250	1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A50T-2CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075			250	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A12T-1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A50T-L2CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	52160	Yes	.93 V	4075			250	0.9		0.9 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.87 V	.8 mm	100 °C (212 °F)	1.51 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No	Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
MPF100T-1FCSG325I	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		170	1			Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
XC7A25T-2CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150	1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.05 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
M2S090-FCSG325I	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V				180	1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B325	3	1.16 mm	11 mm					40 s	180	250 °C (482 °F)	13.5 mm
M2S090-FCSG325	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V				180	1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B325	3	1.16 mm	11 mm					40 s	180	250 °C (482 °F)	13.5 mm
M2S090-FCS325	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V				180	1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B325		1.16 mm	11 mm					30 s	180	240 °C (464 °F)	13.5 mm
M2S090-FCS325I	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V				180	1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	R-PBGA-B325		1.16 mm	11 mm					30 s	180	240 °C (464 °F)	13.5 mm
MPF100T-FCSG325I	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		170	1			Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
XC7A12T-2CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.05 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A50T-L1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075			250	0.95			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A12T-2CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A35T-2CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600			250	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A50T-2CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075			250	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A12T-1CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A12T-L1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG		150	0.95			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
M2GL060-FCSG325I	Microchip Technology	FPGA		Ball	325	BGA	Square	Plastic/Epoxy	56520	Yes	1.26 V				200	1.2	Tray		Grid Array			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325	3		11 mm						200		11 mm
XC7A25T-2CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150	1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A15T-1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300			250	1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A35T-1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600			250	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
MPF100T-FCSG325E	Microchip Technology	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		170	1			Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
XC7A15T-1CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300			250	1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A12T-3CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150	1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	15 mm
M2GL050-FCSG325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V		CMOS		200	1.2	Tray	1.2 V	Grid Array	BGA325,21X21,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325	3		11 mm	No					200		11 mm
XC7A50T-3CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075			250	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.94 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A35T-L1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600			250	0.95			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A50T-1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075			250	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
M2GL090T-FCSG325	Microchip Technology	FPGA	Other		325			Plastic	86316	Yes			CMOS		180	1.2	Tray	1.2 V		BGA325,21X21,20	Field Programmable Gate Arrays			85 °C (185 °F)			0 °C (32 °F)				3			No					180
M2GL090TS-1FCS325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS		180	1.2	Tray	1.2 V	Grid Array	BGA325,21X21,20	Field Programmable Gate Arrays	1.14 V		100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325				No				20 s	180	240 °C (464 °F)
M2GL025-FCSG325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS		180	1.2	Tray	1.2 V	Grid Array	BGA325,21X21,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325	3		11 mm	No					180		11 mm
XC7A35T-L2CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	.93 V	2600			250	0.9		0.9 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.87 V	.8 mm	100 °C (212 °F)	1.51 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No	Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
M2S090TS-1FCSG325I	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V				180	1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B325	3	1.16 mm	11 mm					40 s	180	250 °C (482 °F)	13.5 mm
XC7A25T-L1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825	HKMG		150	0.95			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
M2S025-FCSG325I	Microchip Technology	FPGA		Ball	325	TFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				180	1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.01 mm	11 mm					40 s	180	250 °C (482 °F)	11 mm
MPF050T-1FCSG325E	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy	48000	Yes	1.03 V		CMOS		164	1			Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				164		11 mm
XC7A25T-1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150	1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A25T-L2CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	.93 V	1825	HKMG		150	0.9			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.87 V	.8 mm	100 °C (212 °F)	1.51 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
M2GL025TS-1FCSG325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS		180	1.2	Tray	1.2 V	Grid Array	BGA325,21X21,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325	3		11 mm	No					180		11 mm
MPF100TL-FCSG325I	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		170	1			Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
XA7A50T-1CSG325Q	Xilinx	FPGA	Automotive	Ball	325	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG	AEC-Q100	150	1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
M2S050T-FCSG325I	Microchip Technology	FPGA		Ball	325	TFBGA	Square	Plastic/Epoxy	56340	Yes	1.26 V				200	1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.01 mm	11 mm					40 s	200	250 °C (482 °F)	11 mm
M2GL090TS-1FCSG325	Microchip Technology	FPGA	Other		325			Plastic	86316	Yes			CMOS		180	1.2	Tray	1.2 V		BGA325,21X21,20	Field Programmable Gate Arrays			85 °C (185 °F)			0 °C (32 °F)				3			No					180
M2S060-FCSG325I	Microchip Technology	FPGA		Ball	325	TFBGA	Square	Plastic/Epoxy	56520	Yes	1.26 V				200	1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.01 mm	11 mm					40 s	200	250 °C (482 °F)	11 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.