363 Field Programmable Gate Arrays (FPGA) 65

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4VLX15-10SF363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			1536 CLBS		Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0	1028 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VLX15-10SFG363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1536 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e1	1028 MHz	30 s	240	260 °C (500 °F)	17 mm
XC4VLX25-11SFG363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			2688 CLBS		Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e1	1205 MHz	30 s	240	260 °C (500 °F)	17 mm
XC4VLX25-11SF363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			2688 CLBS		Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0	1205 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VLX15-11SFG363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			1536 CLBS		Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e1	1205 MHz	30 s	240	260 °C (500 °F)	17 mm
XC4VLX25-10SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0	1028 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VLX25-10SFG363CS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No	e1	1028 MHz	30 s	240	260 °C (500 °F)
XC4VFX12-11SFG363CS1	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B363	4			No	e1	1181 MHz	30 s	240	260 °C (500 °F)
XC4VLX15-11SF363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			1536 CLBS		Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0	1205 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VLX15-11SFG363IS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No	e1	1205 MHz	30 s	240	260 °C (500 °F)
XC4VFX12-11SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1368 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0	1181 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VLX15-11SFG363CS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No	e1	1205 MHz	30 s	240	260 °C (500 °F)
XC4VLX15-10SF363CS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B363	4			No	e0	1028 MHz	30 s	240	225 °C (437 °F)
XC4VLX25-11SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0	1205 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VLX15-12SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1536 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0	1205 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VLX15-12SFG363CS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No	e1	1205 MHz	30 s	240	260 °C (500 °F)
XC4VFX12-11SF363IS1	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B363	4			No	e0	1181 MHz	30 s	240	225 °C (437 °F)
XC4VFX12-12SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1368 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0	1205 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VLX15-10SFG363IS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No	e1	1028 MHz	30 s	240	260 °C (500 °F)
XC4VLX15-10SFG363CS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No	e1	1028 MHz	30 s	240	260 °C (500 °F)
XC4VLX25-12SF363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy		Yes	1.26 V	2688	CMOS		1.2		Grid Array, Fine Pitch			1.14 V	.8 mm			2688 CLBS		Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0		30 s		225 °C (437 °F)	17 mm
XC4VLX25-11SF363IS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B363	4			No	e0	1205 MHz	30 s	240	225 °C (437 °F)
XC4VFX12-11SFG363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1368 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e1	1181 MHz	30 s	240	260 °C (500 °F)	17 mm
XC4VLX15-12SF363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy		Yes	1.26 V	1536	CMOS		1.2		Grid Array, Fine Pitch			1.14 V	.8 mm			1536 CLBS		Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0		30 s		225 °C (437 °F)	17 mm
XC4VFX12-12SF363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy		Yes	1.26 V	1368	CMOS		1.2		Grid Array, Fine Pitch			1.14 V	.8 mm			1368 CLBS		Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0		30 s		225 °C (437 °F)	17 mm
XC4VFX12-10SF363CS1	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B363	4			No	e0	1028 MHz	30 s	240	225 °C (437 °F)
XC4VLX25-10SF363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			2688 CLBS		Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0	1028 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VFX12-10SFG363CS1	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B363	4			No	e1	1028 MHz	30 s	240	260 °C (500 °F)
XC4VLX15-12SF363CS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B363	4			No	e0	1205 MHz	30 s	240	225 °C (437 °F)
XC4VLX25-12SF363CS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B363	4			No	e0	1205 MHz	30 s	240	225 °C (437 °F)
XQ4VLX25-10SF363M	Xilinx	FPGA	Military	Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	240	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	125 °C (257 °F)		2688 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0	1028 MHz	30 s	240	225 °C (437 °F)	17 mm
XQ4VLX25-10SFG363M	Xilinx	FPGA	Military	Ball	363	FBGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS				Grid Array, Fine Pitch	BGA363,20X20,32		1.14 V	.8 mm	125 °C (257 °F)	0.78 ns		-55 °C (-67 °F)		Bottom	S-PBGA-B363		1.99 mm	17 mm							17 mm
XC4VLX15-11SF363IS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS	240	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			1536 CLBS		Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0	1205 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VFX12-10SF363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			1368 CLBS		Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0	1028 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VFX12-10SFG363IS1	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B363	4			No	e1	1028 MHz	30 s	240	260 °C (500 °F)
XC4VFX12-10SFG363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1368 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e1	1028 MHz	30 s	240	260 °C (500 °F)	17 mm
XC4VFX12-11SFG363IS1	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B363	4			No	e1	1181 MHz	30 s	240	260 °C (500 °F)
XC4VLX15-11SFG363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1536 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e1	1205 MHz	30 s	240	260 °C (500 °F)	17 mm
XC4VLX25-10SFG363IS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No	e1	1028 MHz	30 s	240	260 °C (500 °F)
XC4VFX12-12SFG363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1368 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e1	1205 MHz	30 s	240	260 °C (500 °F)	17 mm
XC4VLX25-11SFG363IS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No	e1	1205 MHz	30 s	240	260 °C (500 °F)
XC4VFX12-11SF363CS1	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B363	4			No	e0	1181 MHz	30 s	240	225 °C (437 °F)
XC4VLX25-10SFG363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			2688 CLBS		Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e1	1028 MHz	30 s	240	260 °C (500 °F)	17 mm
XC4VLX25-11SFG363CS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes			CMOS	240		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No	e1	1205 MHz	30 s	240	260 °C (500 °F)
XC4VFX12-11SFG363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			1368 CLBS		Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e1	1181 MHz	30 s	240	260 °C (500 °F)	17 mm
XC4VLX25-10SFG363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e1	1028 MHz	30 s	240	260 °C (500 °F)	17 mm
XC4VFX12-10SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1368 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e0	1028 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VLX15-10SFG363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS	240	1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			1536 CLBS		Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No	e1	1028 MHz	30 s	240	260 °C (500 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.