676 Field Programmable Gate Arrays (FPGA) 1,111

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCE7K410T-1FFV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG		400		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	31775 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		3.37 mm	27 mm						400		27 mm
XC2S600E-7FGG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	864	CMOS		514	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 150000	e1	357 MHz	30 s	514	250 °C (482 °F)	27 mm
XC5VLX110-2FF676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	8640 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e0		30 s	440	225 °C (437 °F)	27 mm
XC3S200AN-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	448	CMOS			200000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	667 MHz				27 mm
XQ7K410T-L2RF676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	.93 V	31775	HKMG		400		.9		Grid Array			.87 V	1 mm	100 °C (212 °F)	0.91 ns	31775 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e0		30 s	400	225 °C (437 °F)	27 mm
XC7K160T-L2FFG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes	.93 V	12675	CMOS		400		.9	0.9,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm		0.91 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No	Also Operates at 1 V supply	e1		30 s	400	250 °C (482 °F)	27 mm
XC7K410T-2LFFG676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	.93 V	31775			250		0.9		Grid Array	BGA676,26X26,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	31775 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s	250	250 °C (482 °F)	27 mm
XC2S200E-6FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 150000	e0	357 MHz				27 mm
XC2VP20-6FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS		404		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1200 MHz	30 s	404	250 °C (482 °F)	27 mm
XC3S50AN-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	667 MHz				27 mm
XC5VLX30-2FFV676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			400		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	2400 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XC7K160T-2FBV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	12675					1		Grid Array			.97 V	1 mm		0.61 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XC6SLX75-N3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		408		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	806 MHz	30 s	408	250 °C (482 °F)	27 mm
XQ6SLX75T-3FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS		348			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B676	3			No		e1	862 MHz	30 s	348	250 °C (482 °F)
XC7K160T-1FF676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes			CMOS		400			1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B676				No		e0	1818 MHz		400
XC5VLX30-2FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			400		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XC2VP30-6FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS		416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	3424 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1200 MHz	30 s	416	225 °C (437 °F)	27 mm
XC4VLX60-10FFG676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS		448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4			No		e1		30 s	448	250 °C (482 °F)
XC4VSX35-11FFG676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	34560	Yes			CMOS		448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B676	4			No		e1		30 s	448	250 °C (482 °F)
XC6SLX45-3NFGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	806 MHz	30 s		250 °C (482 °F)	27 mm
XA3SD1800A-4FGG676Q	Xilinx	FPGA	Automotive	Ball	676	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	AEC-Q100	519	37440	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	0.71 ns	4160 CLBS, 37440 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	667 MHz	30 s	409	260 °C (500 °F)	27 mm
XQ6SLX150T-2FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS		396			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	3			No		e0	667 MHz	30 s	396	225 °C (437 °F)
XC6SLX100-1LFGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	500 MHz	30 s		250 °C (482 °F)	27 mm
XCKU5P-L2FFVB676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120			304		0.72		Grid Array	BGA676,26X26,40		.698 V	1 mm	110 °C (230 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		Also Operates at 0.85 V nominal supply	e1		30 s	304	250 °C (482 °F)	27 mm
XCV600E-6FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		444	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	357 MHz	30 s	444	225 °C (437 °F)	27 mm
XCE7K410T-L2FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	.97 V	31775	HKMG		400		.95		Grid Array			.93 V	1 mm	100 °C (212 °F)	0.61 ns	31775 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XCKU5P-L2FFVA676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120			304		0.72		Grid Array	BGA676,26X26,40		.698 V	1 mm	110 °C (230 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		Also Operates at 0.85 V nominal supply	e1		30 s	304	250 °C (482 °F)	27 mm
XA6SLX75-3FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS	AEC-Q100	408			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3			No		e0	862 MHz	30 s	408	225 °C (437 °F)
XC2S100E-6FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	600				37000	1.8		Grid Array			1.71 V	1 mm		0.47 ns	600 CLBS, 37000 Gates		Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 100000	e0	357 MHz				27 mm
XC7K325T-L2FBV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475					.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XC6SLX75T-2FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		320		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	667 MHz	30 s	320	250 °C (482 °F)	27 mm
XC6SLX45-L1FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	43661	Yes	1.05 V	3411	CMOS		358		1	1,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0		30 s	358	225 °C (437 °F)	27 mm
XC5VLX110-3FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	8640 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e1		30 s	440	250 °C (482 °F)	27 mm
XC6SLX150T-3NFGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	806 MHz	30 s		250 °C (482 °F)	27 mm
XC6SLX45-N3FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		358		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	806 MHz	30 s	358	225 °C (437 °F)	27 mm
XC7K160T-2LFFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	.93 V						0.9		Grid Array	BGA676,26X26,40		.87 V	1 mm	85 °C (185 °F)	0.61 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XC6SLX150T-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS		396			1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1		30 s	396	250 °C (482 °F)	27 mm
XC3S200-4FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0					27 mm
XQ6SLX150-L1FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS		498			1,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	3			No		e0	500 MHz	30 s	498	225 °C (437 °F)
XC2V1500-6FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS		392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	1920 CLBS, 1500000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	820 MHz	30 s	392	250 °C (482 °F)	27 mm
XC7K325T-L2FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475					.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XCKU035-2FBVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700			520		.95	0.95 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm	No		e1			520		27 mm
XC7K160T-L2FF676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes			CMOS		400			0.9,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B676				No		e0	1286 MHz		400
XC4VLX40-10FFG676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	41472	Yes			CMOS		448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4			No		e1		30 s	448	250 °C (482 °F)
XC6SLX150-2FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		498		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	667 MHz	30 s	498	250 °C (482 °F)	27 mm
XQKU040-2RSA676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes		30300					.95		Grid Array				1 mm			30300 CLBS		Tin Lead	Bottom	S-PBGA-B676		3.44 mm	27 mm			e0					27 mm
XQ7K325T-1RF676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	HKMG		400		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	25475 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e0		30 s	400	225 °C (437 °F)	27 mm
XCV600E-7FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		444	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	400 MHz	30 s	444	250 °C (482 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.